JPS5816074A - 金または金合金膜のエツチング方法 - Google Patents
金または金合金膜のエツチング方法Info
- Publication number
- JPS5816074A JPS5816074A JP11395881A JP11395881A JPS5816074A JP S5816074 A JPS5816074 A JP S5816074A JP 11395881 A JP11395881 A JP 11395881A JP 11395881 A JP11395881 A JP 11395881A JP S5816074 A JPS5816074 A JP S5816074A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- gold
- acid
- alloy film
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 31
- 239000010931 gold Substances 0.000 title claims abstract description 23
- 229910001020 Au alloy Inorganic materials 0.000 title claims abstract description 15
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 9
- 239000003353 gold alloy Substances 0.000 title claims abstract description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 8
- 238000000034 method Methods 0.000 title claims description 12
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims abstract description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 150000001735 carboxylic acids Chemical class 0.000 claims abstract description 8
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims abstract description 6
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims abstract description 5
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims abstract description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims abstract description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims abstract description 3
- 235000015165 citric acid Nutrition 0.000 claims abstract description 3
- 235000019253 formic acid Nutrition 0.000 claims abstract description 3
- 239000001630 malic acid Substances 0.000 claims abstract description 3
- 235000011090 malic acid Nutrition 0.000 claims abstract description 3
- 235000006408 oxalic acid Nutrition 0.000 claims abstract description 3
- 239000001384 succinic acid Substances 0.000 claims abstract 2
- 235000011044 succinic acid Nutrition 0.000 claims abstract 2
- 239000000243 solution Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- DKNPRRRKHAEUMW-UHFFFAOYSA-N Iodine aqueous Chemical compound [K+].I[I-]I DKNPRRRKHAEUMW-UHFFFAOYSA-N 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 abstract description 15
- 239000011630 iodine Substances 0.000 abstract description 10
- 229910052740 iodine Inorganic materials 0.000 abstract description 10
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 229910001868 water Inorganic materials 0.000 abstract description 6
- 238000007788 roughening Methods 0.000 abstract description 5
- 235000011054 acetic acid Nutrition 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 13
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910000927 Ge alloy Inorganic materials 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002496 iodine Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012369 In process control Methods 0.000 description 1
- BYDQGSVXQDOSJJ-UHFFFAOYSA-N [Ge].[Au] Chemical compound [Ge].[Au] BYDQGSVXQDOSJJ-UHFFFAOYSA-N 0.000 description 1
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- SAOPTAQUONRHEV-UHFFFAOYSA-N gold zinc Chemical compound [Zn].[Au] SAOPTAQUONRHEV-UHFFFAOYSA-N 0.000 description 1
- 238000010965 in-process control Methods 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11395881A JPS5816074A (ja) | 1981-07-20 | 1981-07-20 | 金または金合金膜のエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11395881A JPS5816074A (ja) | 1981-07-20 | 1981-07-20 | 金または金合金膜のエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5816074A true JPS5816074A (ja) | 1983-01-29 |
| JPS6214033B2 JPS6214033B2 (enrdf_load_stackoverflow) | 1987-03-31 |
Family
ID=14625464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11395881A Granted JPS5816074A (ja) | 1981-07-20 | 1981-07-20 | 金または金合金膜のエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5816074A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187299U (ja) * | 1984-05-22 | 1985-12-11 | 安原鉄工株式会社 | 駆動装置内蔵型電動シヤツタ−の停止装置 |
| JP2006199987A (ja) * | 2005-01-19 | 2006-08-03 | Mitsubishi Chemicals Corp | エッチング液及びエッチング方法 |
| WO2008026542A1 (fr) * | 2006-08-28 | 2008-03-06 | Mitsubishi Chemical Corporation | agent de gravure et processus de gravure |
-
1981
- 1981-07-20 JP JP11395881A patent/JPS5816074A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187299U (ja) * | 1984-05-22 | 1985-12-11 | 安原鉄工株式会社 | 駆動装置内蔵型電動シヤツタ−の停止装置 |
| JP2006199987A (ja) * | 2005-01-19 | 2006-08-03 | Mitsubishi Chemicals Corp | エッチング液及びエッチング方法 |
| WO2008026542A1 (fr) * | 2006-08-28 | 2008-03-06 | Mitsubishi Chemical Corporation | agent de gravure et processus de gravure |
| JPWO2008026542A1 (ja) * | 2006-08-28 | 2010-01-21 | 三菱化学株式会社 | エッチング液及びエッチング方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6214033B2 (enrdf_load_stackoverflow) | 1987-03-31 |
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