JPS58155746A - 半導体機器のリ−ド材用銅合金 - Google Patents

半導体機器のリ−ド材用銅合金

Info

Publication number
JPS58155746A
JPS58155746A JP3868082A JP3868082A JPS58155746A JP S58155746 A JPS58155746 A JP S58155746A JP 3868082 A JP3868082 A JP 3868082A JP 3868082 A JP3868082 A JP 3868082A JP S58155746 A JPS58155746 A JP S58155746A
Authority
JP
Japan
Prior art keywords
alloy
heat resistance
rare earth
strength
earth elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3868082A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0310698B2 (en:Method
Inventor
Kozo Yamato
山戸　浩三
Kiichi Akasaka
赤坂　喜一
Shigeo Shinozaki
篠崎　重雄
Taku Kuroyanagi
黒柳　卓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP3868082A priority Critical patent/JPS58155746A/ja
Publication of JPS58155746A publication Critical patent/JPS58155746A/ja
Publication of JPH0310698B2 publication Critical patent/JPH0310698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
JP3868082A 1982-03-11 1982-03-11 半導体機器のリ−ド材用銅合金 Granted JPS58155746A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3868082A JPS58155746A (ja) 1982-03-11 1982-03-11 半導体機器のリ−ド材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3868082A JPS58155746A (ja) 1982-03-11 1982-03-11 半導体機器のリ−ド材用銅合金

Publications (2)

Publication Number Publication Date
JPS58155746A true JPS58155746A (ja) 1983-09-16
JPH0310698B2 JPH0310698B2 (en:Method) 1991-02-14

Family

ID=12531989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3868082A Granted JPS58155746A (ja) 1982-03-11 1982-03-11 半導体機器のリ−ド材用銅合金

Country Status (1)

Country Link
JP (1) JPS58155746A (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770674A (ja) * 1994-06-06 1995-03-14 Toshiba Corp 半導体装置
CN113755714A (zh) * 2021-06-22 2021-12-07 上海交通大学 一种适合于铸造工艺的高导热铜合金及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770674A (ja) * 1994-06-06 1995-03-14 Toshiba Corp 半導体装置
CN113755714A (zh) * 2021-06-22 2021-12-07 上海交通大学 一种适合于铸造工艺的高导热铜合金及其制备方法

Also Published As

Publication number Publication date
JPH0310698B2 (en:Method) 1991-02-14

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