JPS58155157A - 硬脆材料におけるチツピング防止加工方法 - Google Patents

硬脆材料におけるチツピング防止加工方法

Info

Publication number
JPS58155157A
JPS58155157A JP3827682A JP3827682A JPS58155157A JP S58155157 A JPS58155157 A JP S58155157A JP 3827682 A JP3827682 A JP 3827682A JP 3827682 A JP3827682 A JP 3827682A JP S58155157 A JPS58155157 A JP S58155157A
Authority
JP
Japan
Prior art keywords
chipping
brittle material
machined
grinding
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3827682A
Other languages
English (en)
Japanese (ja)
Other versions
JPH021629B2 (enExample
Inventor
Takashi Miyatani
孝 宮谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3827682A priority Critical patent/JPS58155157A/ja
Publication of JPS58155157A publication Critical patent/JPS58155157A/ja
Publication of JPH021629B2 publication Critical patent/JPH021629B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP3827682A 1982-03-11 1982-03-11 硬脆材料におけるチツピング防止加工方法 Granted JPS58155157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3827682A JPS58155157A (ja) 1982-03-11 1982-03-11 硬脆材料におけるチツピング防止加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3827682A JPS58155157A (ja) 1982-03-11 1982-03-11 硬脆材料におけるチツピング防止加工方法

Publications (2)

Publication Number Publication Date
JPS58155157A true JPS58155157A (ja) 1983-09-14
JPH021629B2 JPH021629B2 (enExample) 1990-01-12

Family

ID=12520781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3827682A Granted JPS58155157A (ja) 1982-03-11 1982-03-11 硬脆材料におけるチツピング防止加工方法

Country Status (1)

Country Link
JP (1) JPS58155157A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339302A (ja) * 2005-05-31 2006-12-14 Shin Etsu Handotai Co Ltd 貼り合わせウエーハの製造方法及び貼り合わせウエーハの外周研削装置
JP2011032124A (ja) * 2009-07-31 2011-02-17 Bridgestone Plant Engineering Co Ltd 薄板ガラスの加工装置
JP2012148390A (ja) * 2011-01-21 2012-08-09 Disco Corp 硬質基板の研削方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339302A (ja) * 2005-05-31 2006-12-14 Shin Etsu Handotai Co Ltd 貼り合わせウエーハの製造方法及び貼り合わせウエーハの外周研削装置
JP2011032124A (ja) * 2009-07-31 2011-02-17 Bridgestone Plant Engineering Co Ltd 薄板ガラスの加工装置
JP2012148390A (ja) * 2011-01-21 2012-08-09 Disco Corp 硬質基板の研削方法

Also Published As

Publication number Publication date
JPH021629B2 (enExample) 1990-01-12

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