JPS58150852U - semiconductor pressure transducer - Google Patents

semiconductor pressure transducer

Info

Publication number
JPS58150852U
JPS58150852U JP4688582U JP4688582U JPS58150852U JP S58150852 U JPS58150852 U JP S58150852U JP 4688582 U JP4688582 U JP 4688582U JP 4688582 U JP4688582 U JP 4688582U JP S58150852 U JPS58150852 U JP S58150852U
Authority
JP
Japan
Prior art keywords
pressure
pressure transducer
gauge
semiconductor pressure
strain gauge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4688582U
Other languages
Japanese (ja)
Inventor
実 高橋
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP4688582U priority Critical patent/JPS58150852U/en
Publication of JPS58150852U publication Critical patent/JPS58150852U/en
Pending legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の1実施例を示すゲージクミの平面図、
第2図はその断面構造図である。 1・・・シリコンウェーハ、2・・・歪ケージ、4・・
・Alx極、5・・・第2パツシベーシヨン、6・・・
感圧ダイヤフラム、8・・・ゲージチップ。
FIG. 1 is a plan view of a gauge kumi showing one embodiment of the present invention;
FIG. 2 is a cross-sectional structural diagram thereof. 1... Silicon wafer, 2... Strain cage, 4...
・Alx pole, 5... 2nd passivation, 6...
Pressure sensitive diaphragm, 8...gauge tip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 片面に不純物拡散により形成した歪ゲージを有するシリ
コンウェーハの、前記歪ゲージと反対の面をエツチング
により薄肉の感圧ダイヤフラムを形成後切断したゲージ
チップにおいて、前記感圧部以外に配設した前記歪ゲー
ジを接続する配線用および外部の入出力端子への接続用
のA1電極上に、例エバ窒化シリコン膜等の第2パツシ
ベーシヨンを形成し、かつ感圧ダイヤフラム上にかから
ないようにしたことを特徴とする半導体圧力変換器。
In a gauge chip in which a thin pressure-sensitive diaphragm is formed by etching on the opposite side of a silicon wafer having a strain gauge formed by impurity diffusion on one side and then cut, the strain gauge disposed outside the pressure-sensitive part is A second passivation, such as an evaporative silicon nitride film, is formed on the A1 electrode for wiring to connect the gauge and for connection to an external input/output terminal, and is made so that it does not cover the pressure-sensitive diaphragm. Semiconductor pressure transducer.
JP4688582U 1982-04-02 1982-04-02 semiconductor pressure transducer Pending JPS58150852U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4688582U JPS58150852U (en) 1982-04-02 1982-04-02 semiconductor pressure transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4688582U JPS58150852U (en) 1982-04-02 1982-04-02 semiconductor pressure transducer

Publications (1)

Publication Number Publication Date
JPS58150852U true JPS58150852U (en) 1983-10-08

Family

ID=30057867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4688582U Pending JPS58150852U (en) 1982-04-02 1982-04-02 semiconductor pressure transducer

Country Status (1)

Country Link
JP (1) JPS58150852U (en)

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