JPS58150838U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58150838U
JPS58150838U JP4778982U JP4778982U JPS58150838U JP S58150838 U JPS58150838 U JP S58150838U JP 4778982 U JP4778982 U JP 4778982U JP 4778982 U JP4778982 U JP 4778982U JP S58150838 U JPS58150838 U JP S58150838U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor pellet
semiconductor
glossy
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4778982U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6344997Y2 (enrdf_load_stackoverflow
Inventor
戸嶋　正征
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP4778982U priority Critical patent/JPS58150838U/ja
Publication of JPS58150838U publication Critical patent/JPS58150838U/ja
Application granted granted Critical
Publication of JPS6344997Y2 publication Critical patent/JPS6344997Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Wire Bonding (AREA)
JP4778982U 1982-03-31 1982-03-31 半導体装置 Granted JPS58150838U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4778982U JPS58150838U (ja) 1982-03-31 1982-03-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4778982U JPS58150838U (ja) 1982-03-31 1982-03-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS58150838U true JPS58150838U (ja) 1983-10-08
JPS6344997Y2 JPS6344997Y2 (enrdf_load_stackoverflow) 1988-11-22

Family

ID=30058738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4778982U Granted JPS58150838U (ja) 1982-03-31 1982-03-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS58150838U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6344997Y2 (enrdf_load_stackoverflow) 1988-11-22

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