JPS58143550A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58143550A
JPS58143550A JP57027109A JP2710982A JPS58143550A JP S58143550 A JPS58143550 A JP S58143550A JP 57027109 A JP57027109 A JP 57027109A JP 2710982 A JP2710982 A JP 2710982A JP S58143550 A JPS58143550 A JP S58143550A
Authority
JP
Japan
Prior art keywords
wiring
power supply
pattern
vcc
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57027109A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0434307B2 (enrdf_load_stackoverflow
Inventor
Katsu Sanada
真田　克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57027109A priority Critical patent/JPS58143550A/ja
Publication of JPS58143550A publication Critical patent/JPS58143550A/ja
Publication of JPH0434307B2 publication Critical patent/JPH0434307B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP57027109A 1982-02-22 1982-02-22 半導体装置 Granted JPS58143550A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57027109A JPS58143550A (ja) 1982-02-22 1982-02-22 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57027109A JPS58143550A (ja) 1982-02-22 1982-02-22 半導体装置

Publications (2)

Publication Number Publication Date
JPS58143550A true JPS58143550A (ja) 1983-08-26
JPH0434307B2 JPH0434307B2 (enrdf_load_stackoverflow) 1992-06-05

Family

ID=12211906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57027109A Granted JPS58143550A (ja) 1982-02-22 1982-02-22 半導体装置

Country Status (1)

Country Link
JP (1) JPS58143550A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63175441A (ja) * 1987-01-14 1988-07-19 Nec Corp 半導体装置
JPS63307759A (ja) * 1987-06-09 1988-12-15 Nec Corp 半導体集積回路
JPS6413733U (enrdf_load_stackoverflow) * 1987-07-16 1989-01-24
JPH01251640A (ja) * 1988-03-31 1989-10-06 Toshiba Corp 半導体集積回路装置
JPH01251639A (ja) * 1988-03-31 1989-10-06 Toshiba Corp 半導体集積回路装置
US5138419A (en) * 1988-06-01 1992-08-11 Fujitsu Limited Wafer scale integration device with dummy chips and relay pads
US5165086A (en) * 1985-02-20 1992-11-17 Hitachi, Ltd. Microprocessor chip using two-level metal lines technology

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125085A (enrdf_load_stackoverflow) * 1974-06-26 1976-03-01 Ibm

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125085A (enrdf_load_stackoverflow) * 1974-06-26 1976-03-01 Ibm

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5165086A (en) * 1985-02-20 1992-11-17 Hitachi, Ltd. Microprocessor chip using two-level metal lines technology
JPS63175441A (ja) * 1987-01-14 1988-07-19 Nec Corp 半導体装置
JPS63307759A (ja) * 1987-06-09 1988-12-15 Nec Corp 半導体集積回路
JPS6413733U (enrdf_load_stackoverflow) * 1987-07-16 1989-01-24
JPH01251640A (ja) * 1988-03-31 1989-10-06 Toshiba Corp 半導体集積回路装置
JPH01251639A (ja) * 1988-03-31 1989-10-06 Toshiba Corp 半導体集積回路装置
US5138419A (en) * 1988-06-01 1992-08-11 Fujitsu Limited Wafer scale integration device with dummy chips and relay pads

Also Published As

Publication number Publication date
JPH0434307B2 (enrdf_load_stackoverflow) 1992-06-05

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