JPS58134452A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法

Info

Publication number
JPS58134452A
JPS58134452A JP57016232A JP1623282A JPS58134452A JP S58134452 A JPS58134452 A JP S58134452A JP 57016232 A JP57016232 A JP 57016232A JP 1623282 A JP1623282 A JP 1623282A JP S58134452 A JPS58134452 A JP S58134452A
Authority
JP
Japan
Prior art keywords
leads
lead
resin
semiconductor device
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57016232A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6351542B2 (enExample
Inventor
Masachika Masuda
正親 増田
Hajime Murakami
元 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP57016232A priority Critical patent/JPS58134452A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to DE3303165A priority patent/DE3303165C2/de
Priority to GB08302730A priority patent/GB2115220B/en
Priority to IT19414/83A priority patent/IT1161869B/it
Priority to KR1019830000433A priority patent/KR900001989B1/ko
Publication of JPS58134452A publication Critical patent/JPS58134452A/ja
Priority to SG362/87A priority patent/SG36287G/en
Priority to HK707/87A priority patent/HK70787A/xx
Priority to MY616/87A priority patent/MY8700616A/xx
Publication of JPS6351542B2 publication Critical patent/JPS6351542B2/ja
Priority to KR1019900000785A priority patent/KR900001988B1/ko
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57016232A 1982-02-05 1982-02-05 半導体装置およびその製造方法 Granted JPS58134452A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP57016232A JPS58134452A (ja) 1982-02-05 1982-02-05 半導体装置およびその製造方法
DE3303165A DE3303165C2 (de) 1982-02-05 1983-01-31 Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern
GB08302730A GB2115220B (en) 1982-02-05 1983-02-01 Semiconductor device and method of producing the same
IT19414/83A IT1161869B (it) 1982-02-05 1983-02-03 Dispositivo a semiconduttori e procedimento per la sua fabbricazione
KR1019830000433A KR900001989B1 (ko) 1982-02-05 1983-02-04 반도체장치
SG362/87A SG36287G (en) 1982-02-05 1987-04-23 Semiconductor device and method of producing the same
HK707/87A HK70787A (en) 1982-02-05 1987-10-01 Semiconductor device and method of producing the same
MY616/87A MY8700616A (en) 1982-02-05 1987-12-30 Semiconductor device and method of producing the same
KR1019900000785A KR900001988B1 (ko) 1982-02-05 1990-01-24 반도체장치에 사용되는 리이드 프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57016232A JPS58134452A (ja) 1982-02-05 1982-02-05 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS58134452A true JPS58134452A (ja) 1983-08-10
JPS6351542B2 JPS6351542B2 (enExample) 1988-10-14

Family

ID=11910801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57016232A Granted JPS58134452A (ja) 1982-02-05 1982-02-05 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS58134452A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0464982U (enExample) * 1990-10-12 1992-06-04
US5324888A (en) * 1992-10-13 1994-06-28 Olin Corporation Metal electronic package with reduced seal width

Also Published As

Publication number Publication date
JPS6351542B2 (enExample) 1988-10-14

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