JPS58131744A - ワイヤボンダにおけるキヤピラリへのワイヤ通し方法 - Google Patents
ワイヤボンダにおけるキヤピラリへのワイヤ通し方法Info
- Publication number
- JPS58131744A JPS58131744A JP57014231A JP1423182A JPS58131744A JP S58131744 A JPS58131744 A JP S58131744A JP 57014231 A JP57014231 A JP 57014231A JP 1423182 A JP1423182 A JP 1423182A JP S58131744 A JPS58131744 A JP S58131744A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- capillary
- clamper
- cutting clamper
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57014231A JPS58131744A (ja) | 1982-01-29 | 1982-01-29 | ワイヤボンダにおけるキヤピラリへのワイヤ通し方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57014231A JPS58131744A (ja) | 1982-01-29 | 1982-01-29 | ワイヤボンダにおけるキヤピラリへのワイヤ通し方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58131744A true JPS58131744A (ja) | 1983-08-05 |
JPH0135500B2 JPH0135500B2 (zh) | 1989-07-25 |
Family
ID=11855293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57014231A Granted JPS58131744A (ja) | 1982-01-29 | 1982-01-29 | ワイヤボンダにおけるキヤピラリへのワイヤ通し方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58131744A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02273952A (ja) * | 1989-04-17 | 1990-11-08 | Shinkawa Ltd | キヤピラリへのワイヤ通し方法 |
US8191759B2 (en) | 2009-01-07 | 2012-06-05 | Shinkawa Ltd. | Wire bonding apparatus and wire bonding method |
US11420287B2 (en) * | 2019-09-29 | 2022-08-23 | Ningbo Shangjin Automation Technology Co., Ltd. | Wire clamping system for fully automatic wire bonding machine |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10201400485PA (en) * | 2014-03-07 | 2015-10-29 | Kande Private Ltd | A wire holding apparatus for wire bonding |
-
1982
- 1982-01-29 JP JP57014231A patent/JPS58131744A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02273952A (ja) * | 1989-04-17 | 1990-11-08 | Shinkawa Ltd | キヤピラリへのワイヤ通し方法 |
US8191759B2 (en) | 2009-01-07 | 2012-06-05 | Shinkawa Ltd. | Wire bonding apparatus and wire bonding method |
US11420287B2 (en) * | 2019-09-29 | 2022-08-23 | Ningbo Shangjin Automation Technology Co., Ltd. | Wire clamping system for fully automatic wire bonding machine |
Also Published As
Publication number | Publication date |
---|---|
JPH0135500B2 (zh) | 1989-07-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4213556A (en) | Method and apparatus to detect automatic wire bonder failure | |
US4653681A (en) | Voice coil actuated fine wire clamp | |
JPH07106365A (ja) | ワイヤボンダのワイヤ尾部長さを監視する装置および方法 | |
JPS58131744A (ja) | ワイヤボンダにおけるキヤピラリへのワイヤ通し方法 | |
JPS6052471A (ja) | 予備のボンデイングワイヤを維持する装置 | |
JPH088271B2 (ja) | ワイヤボンデイング装置 | |
KR100255002B1 (ko) | 와이어 본딩 방법 및 장치 | |
US20080083815A1 (en) | Moveable arm assembly for a wire bonder | |
US5318234A (en) | Automatic wire de-spooler for wire bonding machines | |
KR200181365Y1 (ko) | 본딩된 와이어의 배선상태 확인용 스코프 | |
JP6270920B2 (ja) | ワイヤボンディング装置におけるワイヤ繰り出し機構 | |
JP2575066B2 (ja) | 半導体組立装置 | |
JP2627968B2 (ja) | 半導体組立装置 | |
JPS6081835A (ja) | 自動ボンデイングワイヤ−通し機構 | |
JPS59115533A (ja) | ワイヤボンデイング装置 | |
SU1637984A1 (ru) | Автоматизированна установка дл присоединени объемных выводов полупроводниковых приборов и микросхем | |
JPS6026300B2 (ja) | ワイヤボンデイング装置 | |
JPH0611066B2 (ja) | ワイヤボンデイング装置 | |
JPH025533Y2 (zh) | ||
JPH0689917A (ja) | クランプ面摩耗度の検出を行うことのできるワイヤボンディング装置及びその検出方法 | |
JPH03235043A (ja) | 電線異常検出装置 | |
JPS5849097B2 (ja) | コイル巻線装置 | |
JPS60245140A (ja) | ワイヤボンデイング方法および装置 | |
JPS62139337A (ja) | ワイヤボンデイング装置 | |
JPH02250723A (ja) | ワイヤの垂直出し装置 |