JPS58131633U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58131633U
JPS58131633U JP1662083U JP1662083U JPS58131633U JP S58131633 U JPS58131633 U JP S58131633U JP 1662083 U JP1662083 U JP 1662083U JP 1662083 U JP1662083 U JP 1662083U JP S58131633 U JPS58131633 U JP S58131633U
Authority
JP
Japan
Prior art keywords
terminal conductor
metal layer
utility
semiconductor device
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1662083U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6314467Y2 (enrdf_load_stackoverflow
Inventor
デイ−タ−・クロツコフ
エルヴイン・ヴルツ
Original Assignee
シ−メンス・アクチエンゲゼルシヤフト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シ−メンス・アクチエンゲゼルシヤフト filed Critical シ−メンス・アクチエンゲゼルシヤフト
Publication of JPS58131633U publication Critical patent/JPS58131633U/ja
Application granted granted Critical
Publication of JPS6314467Y2 publication Critical patent/JPS6314467Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1662083U 1982-02-08 1983-02-07 半導体装置 Granted JPS58131633U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE8203300.5 1982-02-08
DE8203300 1982-02-08

Publications (2)

Publication Number Publication Date
JPS58131633U true JPS58131633U (ja) 1983-09-05
JPS6314467Y2 JPS6314467Y2 (enrdf_load_stackoverflow) 1988-04-22

Family

ID=30005759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1662083U Granted JPS58131633U (ja) 1982-02-08 1983-02-07 半導体装置

Country Status (1)

Country Link
JP (1) JPS58131633U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6314467Y2 (enrdf_load_stackoverflow) 1988-04-22

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