JPS58128846A - ポリイミド系樹脂片面銅張積層板の製造方法 - Google Patents

ポリイミド系樹脂片面銅張積層板の製造方法

Info

Publication number
JPS58128846A
JPS58128846A JP57009598A JP959882A JPS58128846A JP S58128846 A JPS58128846 A JP S58128846A JP 57009598 A JP57009598 A JP 57009598A JP 959882 A JP959882 A JP 959882A JP S58128846 A JPS58128846 A JP S58128846A
Authority
JP
Japan
Prior art keywords
film
sided copper
polyimide resin
resin
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57009598A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6149111B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
加藤　正廣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP57009598A priority Critical patent/JPS58128846A/ja
Publication of JPS58128846A publication Critical patent/JPS58128846A/ja
Publication of JPS6149111B2 publication Critical patent/JPS6149111B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP57009598A 1982-01-26 1982-01-26 ポリイミド系樹脂片面銅張積層板の製造方法 Granted JPS58128846A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57009598A JPS58128846A (ja) 1982-01-26 1982-01-26 ポリイミド系樹脂片面銅張積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57009598A JPS58128846A (ja) 1982-01-26 1982-01-26 ポリイミド系樹脂片面銅張積層板の製造方法

Publications (2)

Publication Number Publication Date
JPS58128846A true JPS58128846A (ja) 1983-08-01
JPS6149111B2 JPS6149111B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-10-28

Family

ID=11724752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57009598A Granted JPS58128846A (ja) 1982-01-26 1982-01-26 ポリイミド系樹脂片面銅張積層板の製造方法

Country Status (1)

Country Link
JP (1) JPS58128846A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232031A (ja) * 1985-08-02 1987-02-12 Mitsui Petrochem Ind Ltd 多層プリント配線基板製造用ポリ４―メチル―１―ペンテン製表面粗化フィルム及びシート
US5057372A (en) * 1989-03-22 1991-10-15 The Dow Chemical Company Multilayer film and laminate for use in producing printed circuit boards
US5112425A (en) * 1988-04-05 1992-05-12 Du Pont Canada Inc. Polymethylpentene release sheet method of use
WO2012029263A1 (ja) * 2010-09-03 2012-03-08 富士電機株式会社 太陽電池モジュールの製造方法
CN102529222A (zh) * 2010-12-15 2012-07-04 新高电子材料（中山）有限公司 一种低热阻高绝缘金属基覆铜板及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698135A (en) * 1980-01-07 1981-08-07 Toshiba Chem Corp Preparation of polymide resin laminated plate with one copper
JPS56111637A (en) * 1979-08-22 1981-09-03 Hitachi Chem Co Ltd Production of adhesive-coated laminated sheet
JPS5770654A (en) * 1980-10-22 1982-05-01 Mitsubishi Gas Chemical Co Manufacture of laminated board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56111637A (en) * 1979-08-22 1981-09-03 Hitachi Chem Co Ltd Production of adhesive-coated laminated sheet
JPS5698135A (en) * 1980-01-07 1981-08-07 Toshiba Chem Corp Preparation of polymide resin laminated plate with one copper
JPS5770654A (en) * 1980-10-22 1982-05-01 Mitsubishi Gas Chemical Co Manufacture of laminated board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232031A (ja) * 1985-08-02 1987-02-12 Mitsui Petrochem Ind Ltd 多層プリント配線基板製造用ポリ４―メチル―１―ペンテン製表面粗化フィルム及びシート
US5112425A (en) * 1988-04-05 1992-05-12 Du Pont Canada Inc. Polymethylpentene release sheet method of use
US5057372A (en) * 1989-03-22 1991-10-15 The Dow Chemical Company Multilayer film and laminate for use in producing printed circuit boards
WO2012029263A1 (ja) * 2010-09-03 2012-03-08 富士電機株式会社 太陽電池モジュールの製造方法
CN102529222A (zh) * 2010-12-15 2012-07-04 新高电子材料（中山）有限公司 一种低热阻高绝缘金属基覆铜板及其制备方法
CN102529222B (zh) * 2010-12-15 2014-07-02 新高电子材料（中山）有限公司 一种低热阻高绝缘金属基覆铜板及其制备方法

Also Published As

Publication number Publication date
JPS6149111B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-10-28

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