JPS58126056A - 斜め溝加工方法 - Google Patents

斜め溝加工方法

Info

Publication number
JPS58126056A
JPS58126056A JP888382A JP888382A JPS58126056A JP S58126056 A JPS58126056 A JP S58126056A JP 888382 A JP888382 A JP 888382A JP 888382 A JP888382 A JP 888382A JP S58126056 A JPS58126056 A JP S58126056A
Authority
JP
Japan
Prior art keywords
grinding wheel
diagonal
grinding
diagonal groove
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP888382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6335380B2 (enrdf_load_stackoverflow
Inventor
Shigeru Fujimoto
茂 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP888382A priority Critical patent/JPS58126056A/ja
Priority to US06/377,008 priority patent/US4517769A/en
Priority to GB8214280A priority patent/GB2098893B/en
Priority to DE3218953A priority patent/DE3218953C2/de
Publication of JPS58126056A publication Critical patent/JPS58126056A/ja
Publication of JPS6335380B2 publication Critical patent/JPS6335380B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP888382A 1981-05-20 1982-01-25 斜め溝加工方法 Granted JPS58126056A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP888382A JPS58126056A (ja) 1982-01-25 1982-01-25 斜め溝加工方法
US06/377,008 US4517769A (en) 1981-05-20 1982-05-11 Method and apparatus for forming oblique groove in semiconductor device
GB8214280A GB2098893B (en) 1981-05-20 1982-05-17 Method and apparatus for forming oblique groove in semiconductor device
DE3218953A DE3218953C2 (de) 1981-05-20 1982-05-19 Verfahren und Vorrichtung zur Ausbildung einer Schrägrille in einer Halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP888382A JPS58126056A (ja) 1982-01-25 1982-01-25 斜め溝加工方法

Publications (2)

Publication Number Publication Date
JPS58126056A true JPS58126056A (ja) 1983-07-27
JPS6335380B2 JPS6335380B2 (enrdf_load_stackoverflow) 1988-07-14

Family

ID=11705069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP888382A Granted JPS58126056A (ja) 1981-05-20 1982-01-25 斜め溝加工方法

Country Status (1)

Country Link
JP (1) JPS58126056A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258154U (enrdf_load_stackoverflow) * 1985-10-01 1987-04-10
JPH01218027A (ja) * 1988-02-26 1989-08-31 Fuji Electric Co Ltd 半導体装置の製造方法
JPH01264758A (ja) * 1988-04-14 1989-10-23 Nippon Inter Electronics Corp 半導体装置の加工装置ならびにに製造方法
KR20030064539A (ko) * 2002-01-28 2003-08-02 배영철 엔드밀을 이용한 홈가공 장치 및 방법
KR100650239B1 (ko) * 1999-08-30 2006-11-24 리켄 중성자 렌즈부재의 가공장치 및 방법
JP2011135535A (ja) * 2009-12-25 2011-07-07 Ngk Insulators Ltd 複合基板及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108086A (en) * 1978-02-13 1979-08-24 Nobumasa Fujishiro Method of forming groove by means of saw machine and milling machine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108086A (en) * 1978-02-13 1979-08-24 Nobumasa Fujishiro Method of forming groove by means of saw machine and milling machine

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258154U (enrdf_load_stackoverflow) * 1985-10-01 1987-04-10
JPH01218027A (ja) * 1988-02-26 1989-08-31 Fuji Electric Co Ltd 半導体装置の製造方法
JPH01264758A (ja) * 1988-04-14 1989-10-23 Nippon Inter Electronics Corp 半導体装置の加工装置ならびにに製造方法
KR100650239B1 (ko) * 1999-08-30 2006-11-24 리켄 중성자 렌즈부재의 가공장치 및 방법
KR20030064539A (ko) * 2002-01-28 2003-08-02 배영철 엔드밀을 이용한 홈가공 장치 및 방법
JP2011135535A (ja) * 2009-12-25 2011-07-07 Ngk Insulators Ltd 複合基板及びその製造方法

Also Published As

Publication number Publication date
JPS6335380B2 (enrdf_load_stackoverflow) 1988-07-14

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