JPS58125891A - チツプ本体の形をもつように設計された電気部品 - Google Patents

チツプ本体の形をもつように設計された電気部品

Info

Publication number
JPS58125891A
JPS58125891A JP57182691A JP18269182A JPS58125891A JP S58125891 A JPS58125891 A JP S58125891A JP 57182691 A JP57182691 A JP 57182691A JP 18269182 A JP18269182 A JP 18269182A JP S58125891 A JPS58125891 A JP S58125891A
Authority
JP
Japan
Prior art keywords
chip body
circuit board
printed circuit
adhesive
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57182691A
Other languages
English (en)
Japanese (ja)
Inventor
ライムンド・リ−ガ−
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Publication of JPS58125891A publication Critical patent/JPS58125891A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Details Of Resistors (AREA)
JP57182691A 1981-10-17 1982-10-18 チツプ本体の形をもつように設計された電気部品 Pending JPS58125891A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE31412645 1981-10-17
DE19813141264 DE3141264A1 (de) 1981-10-17 1981-10-17 In der gestalt eines chipkoerpers ausgebildetes elektrisches bauteil

Publications (1)

Publication Number Publication Date
JPS58125891A true JPS58125891A (ja) 1983-07-27

Family

ID=6144307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57182691A Pending JPS58125891A (ja) 1981-10-17 1982-10-18 チツプ本体の形をもつように設計された電気部品

Country Status (3)

Country Link
JP (1) JPS58125891A (enExample)
DE (1) DE3141264A1 (enExample)
FR (1) FR2514983A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1278876C (en) * 1986-12-25 1991-01-08 Sho Masujima Adhesive mounted electronic circuit element
DE3730498A1 (de) * 1987-09-11 1989-03-30 Philips Patentverwaltung Oberflaechenmontierbares bauelement mit kleberbeschichtung

Also Published As

Publication number Publication date
FR2514983A1 (fr) 1983-04-22
DE3141264A1 (de) 1983-05-05
FR2514983B3 (enExample) 1984-07-27

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