JPS58125891A - チツプ本体の形をもつように設計された電気部品 - Google Patents
チツプ本体の形をもつように設計された電気部品Info
- Publication number
- JPS58125891A JPS58125891A JP57182691A JP18269182A JPS58125891A JP S58125891 A JPS58125891 A JP S58125891A JP 57182691 A JP57182691 A JP 57182691A JP 18269182 A JP18269182 A JP 18269182A JP S58125891 A JPS58125891 A JP S58125891A
- Authority
- JP
- Japan
- Prior art keywords
- chip body
- circuit board
- printed circuit
- adhesive
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 241000219104 Cucurbitaceae Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Details Of Resistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19813141264 DE3141264A1 (de) | 1981-10-17 | 1981-10-17 | In der gestalt eines chipkoerpers ausgebildetes elektrisches bauteil |
| DE31412645 | 1981-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58125891A true JPS58125891A (ja) | 1983-07-27 |
Family
ID=6144307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57182691A Pending JPS58125891A (ja) | 1981-10-17 | 1982-10-18 | チツプ本体の形をもつように設計された電気部品 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS58125891A (cg-RX-API-DMAC10.html) |
| DE (1) | DE3141264A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2514983A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2200801B (en) * | 1986-12-25 | 1991-01-09 | Tdk Corp | Electronic circuit element |
| DE3730498A1 (de) * | 1987-09-11 | 1989-03-30 | Philips Patentverwaltung | Oberflaechenmontierbares bauelement mit kleberbeschichtung |
-
1981
- 1981-10-17 DE DE19813141264 patent/DE3141264A1/de not_active Withdrawn
-
1982
- 1982-10-14 FR FR8217205A patent/FR2514983A1/fr active Granted
- 1982-10-18 JP JP57182691A patent/JPS58125891A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE3141264A1 (de) | 1983-05-05 |
| FR2514983A1 (fr) | 1983-04-22 |
| FR2514983B3 (cg-RX-API-DMAC10.html) | 1984-07-27 |
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