JPS58125837A - 自動ダイボンダのペレツト位置決め装置 - Google Patents

自動ダイボンダのペレツト位置決め装置

Info

Publication number
JPS58125837A
JPS58125837A JP57009134A JP913482A JPS58125837A JP S58125837 A JPS58125837 A JP S58125837A JP 57009134 A JP57009134 A JP 57009134A JP 913482 A JP913482 A JP 913482A JP S58125837 A JPS58125837 A JP S58125837A
Authority
JP
Japan
Prior art keywords
pellet
pellets
good
resin sheet
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57009134A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258659B2 (OSRAM
Inventor
Hitoshi Fujimoto
藤本　仁士
Toshinobu Banjo
番條　敏信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57009134A priority Critical patent/JPS58125837A/ja
Publication of JPS58125837A publication Critical patent/JPS58125837A/ja
Publication of JPS6258659B2 publication Critical patent/JPS6258659B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP57009134A 1982-01-22 1982-01-22 自動ダイボンダのペレツト位置決め装置 Granted JPS58125837A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57009134A JPS58125837A (ja) 1982-01-22 1982-01-22 自動ダイボンダのペレツト位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57009134A JPS58125837A (ja) 1982-01-22 1982-01-22 自動ダイボンダのペレツト位置決め装置

Publications (2)

Publication Number Publication Date
JPS58125837A true JPS58125837A (ja) 1983-07-27
JPS6258659B2 JPS6258659B2 (OSRAM) 1987-12-07

Family

ID=11712150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57009134A Granted JPS58125837A (ja) 1982-01-22 1982-01-22 自動ダイボンダのペレツト位置決め装置

Country Status (1)

Country Link
JP (1) JPS58125837A (OSRAM)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108149A (ja) * 1984-10-31 1986-05-26 Kazumichi Kimura 半導体ペレツトの位置検出装置
JPS61147541A (ja) * 1984-12-21 1986-07-05 Toshiba Seiki Kk 良品ペレツトの判別装置
JPS61147542A (ja) * 1984-12-21 1986-07-05 Toshiba Seiki Kk 良品ペレツトの判別装置
US4913335A (en) * 1988-09-01 1990-04-03 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for die bonding
JP2003014531A (ja) * 2001-06-27 2003-01-15 Shimadzu Corp 天びん

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474376A (en) * 1977-11-26 1979-06-14 Toshiba Corp Position detection system for semiconductor chip
JPS54122980A (en) * 1978-03-16 1979-09-22 Nec Corp Surface inspection unit for semiconductor pellet
JPS575345A (en) * 1980-06-13 1982-01-12 Hitachi Ltd Isolating and picking up method for pellet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5474376A (en) * 1977-11-26 1979-06-14 Toshiba Corp Position detection system for semiconductor chip
JPS54122980A (en) * 1978-03-16 1979-09-22 Nec Corp Surface inspection unit for semiconductor pellet
JPS575345A (en) * 1980-06-13 1982-01-12 Hitachi Ltd Isolating and picking up method for pellet

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108149A (ja) * 1984-10-31 1986-05-26 Kazumichi Kimura 半導体ペレツトの位置検出装置
JPS61147541A (ja) * 1984-12-21 1986-07-05 Toshiba Seiki Kk 良品ペレツトの判別装置
JPS61147542A (ja) * 1984-12-21 1986-07-05 Toshiba Seiki Kk 良品ペレツトの判別装置
US4913335A (en) * 1988-09-01 1990-04-03 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for die bonding
JP2003014531A (ja) * 2001-06-27 2003-01-15 Shimadzu Corp 天びん

Also Published As

Publication number Publication date
JPS6258659B2 (OSRAM) 1987-12-07

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