JPS5812442Y2 - 半田付け装置 - Google Patents

半田付け装置

Info

Publication number
JPS5812442Y2
JPS5812442Y2 JP1977155802U JP15580277U JPS5812442Y2 JP S5812442 Y2 JPS5812442 Y2 JP S5812442Y2 JP 1977155802 U JP1977155802 U JP 1977155802U JP 15580277 U JP15580277 U JP 15580277U JP S5812442 Y2 JPS5812442 Y2 JP S5812442Y2
Authority
JP
Japan
Prior art keywords
inert gas
heat sink
space
gas
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977155802U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5481273U (enrdf_load_stackoverflow
Inventor
育久 西村
成市 竹村
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1977155802U priority Critical patent/JPS5812442Y2/ja
Publication of JPS5481273U publication Critical patent/JPS5481273U/ja
Application granted granted Critical
Publication of JPS5812442Y2 publication Critical patent/JPS5812442Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP1977155802U 1977-11-18 1977-11-18 半田付け装置 Expired JPS5812442Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977155802U JPS5812442Y2 (ja) 1977-11-18 1977-11-18 半田付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977155802U JPS5812442Y2 (ja) 1977-11-18 1977-11-18 半田付け装置

Publications (2)

Publication Number Publication Date
JPS5481273U JPS5481273U (enrdf_load_stackoverflow) 1979-06-08
JPS5812442Y2 true JPS5812442Y2 (ja) 1983-03-09

Family

ID=29145170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977155802U Expired JPS5812442Y2 (ja) 1977-11-18 1977-11-18 半田付け装置

Country Status (1)

Country Link
JP (1) JPS5812442Y2 (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49115652U (enrdf_load_stackoverflow) * 1973-01-31 1974-10-03
JPS5247420Y2 (enrdf_load_stackoverflow) * 1973-10-29 1977-10-27
JPS5153157Y2 (enrdf_load_stackoverflow) * 1973-10-31 1976-12-18

Also Published As

Publication number Publication date
JPS5481273U (enrdf_load_stackoverflow) 1979-06-08

Similar Documents

Publication Publication Date Title
US5419481A (en) Process and apparatus for attaching/deataching land grid array components
JPH0739483Y2 (ja) リフロー炉
JP3638415B2 (ja) ガス雰囲気はんだ付け装置
CN100457348C (zh) 回流炉及热风吹出式加热器
JPS5812442Y2 (ja) 半田付け装置
JPH06120655A (ja) 自動半田付け装置
JPS63268563A (ja) 印刷配線回路板をはんだでマス結合する装置
KR950009621B1 (ko) 본딩장치
JPH09267133A (ja) 中空二重管への充填材の充填・排出装置
JPS6026123Y2 (ja) 焼入浴の上昇流規制装置
JP3770725B2 (ja) リードフレーム搬送装置
JPH054934Y2 (enrdf_load_stackoverflow)
JP3072914B2 (ja) 不活性ガス雰囲気リフローはんだ付け装置
JPH05343448A (ja) 半導体装置用の半田付け治具
JP2003031940A (ja) リフロー半田装置
JP3406005B2 (ja) リフロー装置およびリフロー方法
JP3086340B2 (ja) ヒートシンク付き電子部品のプリント基板への半田実装方法
KR950001297B1 (ko) 큐어(cure)장치
JPS6116924Y2 (enrdf_load_stackoverflow)
JPH0741408B2 (ja) リフロー炉およびそれに用いる面吹出し型ヒータ
JPH077021Y2 (ja) エアヒーター
JPH0621576Y2 (ja) コーティング材の塗布装置
JP3644364B2 (ja) 半田バンプ形成方法
US20070152023A1 (en) Solder deposit method on electronic packages for post-connection process
JPS59156568A (ja) パタ−ン、チツプ素子等に対する半田メツキ装置