JPS6116924Y2 - - Google Patents
Info
- Publication number
- JPS6116924Y2 JPS6116924Y2 JP9684281U JP9684281U JPS6116924Y2 JP S6116924 Y2 JPS6116924 Y2 JP S6116924Y2 JP 9684281 U JP9684281 U JP 9684281U JP 9684281 U JP9684281 U JP 9684281U JP S6116924 Y2 JPS6116924 Y2 JP S6116924Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electronic component
- lead wire
- tank
- rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 63
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 17
- 239000007788 liquid Substances 0.000 description 16
- 238000005476 soldering Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9684281U JPS584274U (ja) | 1981-06-29 | 1981-06-29 | 半田仕上げ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9684281U JPS584274U (ja) | 1981-06-29 | 1981-06-29 | 半田仕上げ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS584274U JPS584274U (ja) | 1983-01-12 |
| JPS6116924Y2 true JPS6116924Y2 (enrdf_load_stackoverflow) | 1986-05-24 |
Family
ID=29891669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9684281U Granted JPS584274U (ja) | 1981-06-29 | 1981-06-29 | 半田仕上げ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS584274U (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62277757A (ja) * | 1986-05-26 | 1987-12-02 | Tamura Seisakusho Co Ltd | 被はんだ付け物移換え装置 |
-
1981
- 1981-06-29 JP JP9684281U patent/JPS584274U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS584274U (ja) | 1983-01-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2869497A (en) | Soldering machine | |
| JPS6116924Y2 (enrdf_load_stackoverflow) | ||
| US4776508A (en) | Electronic component lead tinning device | |
| JPS6352458B2 (enrdf_load_stackoverflow) | ||
| US3893409A (en) | Apparatus for solder coating printed circuit boards | |
| JPH01205415A (ja) | 電子部品の錫めっき装置 | |
| JPS5875154A (ja) | 加熱装置 | |
| US4499120A (en) | Method for solder tinning of component leads | |
| JPS62211991A (ja) | 基板の埋込ピン上にはんだを平坦に充填する方法 | |
| JPH02244792A (ja) | 電子部品の樹脂コーティング方法 | |
| JPS60191659A (ja) | はんだ付け方法及び装置 | |
| JPH05190403A (ja) | アキシャルリード部品の半田コーティング方法および装置 | |
| JPS572536A (en) | Semiconductor device | |
| JPH01256159A (ja) | リードフレームへの半田外装方法 | |
| JPS63196046A (ja) | 電子部品の樹脂コ−テイング方法 | |
| JPH0671650B2 (ja) | 回転式半田処理法での半田溶融液補給兼酸化膜除去方法および装置 | |
| JPS643577Y2 (enrdf_load_stackoverflow) | ||
| JPS59186394A (ja) | Ｉｃ用保持具 | |
| JPH02246106A (ja) | 電子部品半田ディプ処理装置 | |
| JPH0143875Y2 (enrdf_load_stackoverflow) | ||
| JPH0817983A (ja) | 半田めっき装置 | |
| JPH0945837A (ja) | 半田めっき装置 | |
| JPS6214687Y2 (enrdf_load_stackoverflow) | ||
| JP2693277B2 (ja) | 電子部品用半田ディップ装置 | |
| JPS614571A (ja) | コ−テイング液の滴下カツプ |