JPS58124262A - 集積回路装置 - Google Patents

集積回路装置

Info

Publication number
JPS58124262A
JPS58124262A JP57006948A JP694882A JPS58124262A JP S58124262 A JPS58124262 A JP S58124262A JP 57006948 A JP57006948 A JP 57006948A JP 694882 A JP694882 A JP 694882A JP S58124262 A JPS58124262 A JP S58124262A
Authority
JP
Japan
Prior art keywords
output buffer
terminal
terminals
chip
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57006948A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416944B2 (enrdf_load_stackoverflow
Inventor
Soichi Ito
伊藤　荘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57006948A priority Critical patent/JPS58124262A/ja
Publication of JPS58124262A publication Critical patent/JPS58124262A/ja
Publication of JPH0416944B2 publication Critical patent/JPH0416944B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/998—Input and output buffer/driver structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP57006948A 1982-01-20 1982-01-20 集積回路装置 Granted JPS58124262A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57006948A JPS58124262A (ja) 1982-01-20 1982-01-20 集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57006948A JPS58124262A (ja) 1982-01-20 1982-01-20 集積回路装置

Publications (2)

Publication Number Publication Date
JPS58124262A true JPS58124262A (ja) 1983-07-23
JPH0416944B2 JPH0416944B2 (enrdf_load_stackoverflow) 1992-03-25

Family

ID=11652451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57006948A Granted JPS58124262A (ja) 1982-01-20 1982-01-20 集積回路装置

Country Status (1)

Country Link
JP (1) JPS58124262A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143647A (ja) * 1983-09-09 1985-07-29 フエアチアイルド　カメラ　アンド　インストルメント　コ−ポレ−シヨン 回路のインダクタンスを減少させ且つ制御した電圧勾配を与える集積回路チツプ配線構成
JPS62263654A (ja) * 1986-05-12 1987-11-16 Nec Ic Microcomput Syst Ltd 半導体装置
EP0367060A3 (en) * 1988-10-31 1991-11-21 Motorola, Inc. Microprocessor having high current drive
JPH06140578A (ja) * 1992-10-29 1994-05-20 Mitsubishi Electric Corp 半導体集積装置
EP1179848A3 (en) * 1989-02-14 2005-03-09 Koninklijke Philips Electronics N.V. Supply pin rearrangement for an I.C.

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420680A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Large scale integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420680A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Large scale integrated circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143647A (ja) * 1983-09-09 1985-07-29 フエアチアイルド　カメラ　アンド　インストルメント　コ−ポレ−シヨン 回路のインダクタンスを減少させ且つ制御した電圧勾配を与える集積回路チツプ配線構成
JPS62263654A (ja) * 1986-05-12 1987-11-16 Nec Ic Microcomput Syst Ltd 半導体装置
EP0367060A3 (en) * 1988-10-31 1991-11-21 Motorola, Inc. Microprocessor having high current drive
EP1179848A3 (en) * 1989-02-14 2005-03-09 Koninklijke Philips Electronics N.V. Supply pin rearrangement for an I.C.
JPH06140578A (ja) * 1992-10-29 1994-05-20 Mitsubishi Electric Corp 半導体集積装置

Also Published As

Publication number Publication date
JPH0416944B2 (enrdf_load_stackoverflow) 1992-03-25

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