JPH0419807Y2 - - Google Patents
Info
- Publication number
- JPH0419807Y2 JPH0419807Y2 JP14330585U JP14330585U JPH0419807Y2 JP H0419807 Y2 JPH0419807 Y2 JP H0419807Y2 JP 14330585 U JP14330585 U JP 14330585U JP 14330585 U JP14330585 U JP 14330585U JP H0419807 Y2 JPH0419807 Y2 JP H0419807Y2
- Authority
- JP
- Japan
- Prior art keywords
- ground
- pins
- integrated circuit
- input
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000010586 diagram Methods 0.000 description 4
- 230000001902 propagating effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14330585U JPH0419807Y2 (enrdf_load_stackoverflow) | 1985-09-18 | 1985-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14330585U JPH0419807Y2 (enrdf_load_stackoverflow) | 1985-09-18 | 1985-09-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6251743U JPS6251743U (enrdf_load_stackoverflow) | 1987-03-31 |
| JPH0419807Y2 true JPH0419807Y2 (enrdf_load_stackoverflow) | 1992-05-06 |
Family
ID=31052862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14330585U Expired JPH0419807Y2 (enrdf_load_stackoverflow) | 1985-09-18 | 1985-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419807Y2 (enrdf_load_stackoverflow) |
-
1985
- 1985-09-18 JP JP14330585U patent/JPH0419807Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6251743U (enrdf_load_stackoverflow) | 1987-03-31 |
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