JPS58123746A - 曲げ加工性に優れた半導体機器リード材 - Google Patents

曲げ加工性に優れた半導体機器リード材

Info

Publication number
JPS58123746A
JPS58123746A JP578982A JP578982A JPS58123746A JP S58123746 A JPS58123746 A JP S58123746A JP 578982 A JP578982 A JP 578982A JP 578982 A JP578982 A JP 578982A JP S58123746 A JPS58123746 A JP S58123746A
Authority
JP
Japan
Prior art keywords
alloy
heat resistance
strength
conductivity
lead material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP578982A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0118978B2 (enrdf_load_stackoverflow
Inventor
Kozo Yamato
山戸　浩三
Kiichi Akasaka
赤坂　喜一
Shigeo Shinozaki
篠崎　重雄
Taku Kuroyanagi
黒柳　卓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP578982A priority Critical patent/JPS58123746A/ja
Publication of JPS58123746A publication Critical patent/JPS58123746A/ja
Publication of JPH0118978B2 publication Critical patent/JPH0118978B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP578982A 1982-01-18 1982-01-18 曲げ加工性に優れた半導体機器リード材 Granted JPS58123746A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP578982A JPS58123746A (ja) 1982-01-18 1982-01-18 曲げ加工性に優れた半導体機器リード材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP578982A JPS58123746A (ja) 1982-01-18 1982-01-18 曲げ加工性に優れた半導体機器リード材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP153488A Division JPS63235443A (ja) 1988-01-07 1988-01-07 半導体機器のリード材用銅合金

Publications (2)

Publication Number Publication Date
JPS58123746A true JPS58123746A (ja) 1983-07-23
JPH0118978B2 JPH0118978B2 (enrdf_load_stackoverflow) 1989-04-10

Family

ID=11620854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP578982A Granted JPS58123746A (ja) 1982-01-18 1982-01-18 曲げ加工性に優れた半導体機器リード材

Country Status (1)

Country Link
JP (1) JPS58123746A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59126740A (ja) * 1983-01-06 1984-07-21 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS60145341A (ja) * 1984-01-09 1985-07-31 Furukawa Electric Co Ltd:The 半導体機器のリ−ド材用銅合金
US4710349A (en) * 1986-03-18 1987-12-01 Sumitomo Metal & Mining Co., Ltd. Highly conductive copper-based alloy
JPS63310931A (ja) * 1987-06-10 1988-12-19 Furukawa Electric Co Ltd:The フレキシブルプリント用銅合金

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479120A (en) * 1977-12-07 1979-06-23 Sumitomo Electric Ind Ltd Copper alloy for trolley wire
JPS5531173A (en) * 1978-08-28 1980-03-05 Nippon Steel Corp Ni-saving type nonmagnetic stainless steel for rivet and screw
JPS5893860A (ja) * 1981-11-30 1983-06-03 Nippon Telegr & Teleph Corp <Ntt> 高力高導電性銅合金の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479120A (en) * 1977-12-07 1979-06-23 Sumitomo Electric Ind Ltd Copper alloy for trolley wire
JPS5531173A (en) * 1978-08-28 1980-03-05 Nippon Steel Corp Ni-saving type nonmagnetic stainless steel for rivet and screw
JPS5893860A (ja) * 1981-11-30 1983-06-03 Nippon Telegr & Teleph Corp <Ntt> 高力高導電性銅合金の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59126740A (ja) * 1983-01-06 1984-07-21 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS60145341A (ja) * 1984-01-09 1985-07-31 Furukawa Electric Co Ltd:The 半導体機器のリ−ド材用銅合金
US4710349A (en) * 1986-03-18 1987-12-01 Sumitomo Metal & Mining Co., Ltd. Highly conductive copper-based alloy
JPS63310931A (ja) * 1987-06-10 1988-12-19 Furukawa Electric Co Ltd:The フレキシブルプリント用銅合金

Also Published As

Publication number Publication date
JPH0118978B2 (enrdf_load_stackoverflow) 1989-04-10

Similar Documents

Publication Publication Date Title
JPS5834536B2 (ja) 半導体機器のリ−ド材用の銅合金
JPS6250425A (ja) 電子機器用銅合金
JPH0229737B2 (enrdf_load_stackoverflow)
JPS6045698B2 (ja) 半導体機器用リ−ド材
JPS5834537B2 (ja) 耐熱性の良好な高力導電用銅合金
JPH01272733A (ja) 半導体装置用Ｃｕ合金製リードフレーム材
JPS58123746A (ja) 曲げ加工性に優れた半導体機器リード材
JPH02277735A (ja) リードフレーム用銅合金
JPS6256937B2 (enrdf_load_stackoverflow)
JPS594493B2 (ja) 半導体機器のリ−ド材用銅合金
JPS5920438A (ja) 半導体機器のリ−ド材用銅合金
JPS6393835A (ja) 半導体機器のリ−ド材用銅合金
JPS58104148A (ja) 半導体機器のリ−ド材用銅合金
JPS628491B2 (enrdf_load_stackoverflow)
JPS63293130A (ja) 半導体装置用Ｃｕ合金製リ−ドフレ−ム材
JPS60218442A (ja) リ−ドフレ−ム用銅合金
JPS58147140A (ja) 半導体装置のリ−ド材
JPS60145343A (ja) 半導体機器のリ−ド材用銅合金
JPS59126740A (ja) リ−ドフレ−ム用銅合金
JPH0253502B2 (enrdf_load_stackoverflow)
JPS6367539B2 (enrdf_load_stackoverflow)
JPS60145344A (ja) 半導体機器のリ−ド材用銅合金
JPS60145341A (ja) 半導体機器のリ−ド材用銅合金
JPH0310695B2 (enrdf_load_stackoverflow)
JPS59140343A (ja) リ−ドフレ−ム用銅合金