JPS58121658A - 半導体機器のリ−ド材用銅合金 - Google Patents
半導体機器のリ−ド材用銅合金Info
- Publication number
- JPS58121658A JPS58121658A JP315982A JP315982A JPS58121658A JP S58121658 A JPS58121658 A JP S58121658A JP 315982 A JP315982 A JP 315982A JP 315982 A JP315982 A JP 315982A JP S58121658 A JPS58121658 A JP S58121658A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- strength
- lead material
- heat resistance
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP315982A JPS58121658A (ja) | 1982-01-12 | 1982-01-12 | 半導体機器のリ−ド材用銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP315982A JPS58121658A (ja) | 1982-01-12 | 1982-01-12 | 半導体機器のリ−ド材用銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58121658A true JPS58121658A (ja) | 1983-07-20 |
| JPH0310695B2 JPH0310695B2 (enrdf_load_stackoverflow) | 1991-02-14 |
Family
ID=11549565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP315982A Granted JPS58121658A (ja) | 1982-01-12 | 1982-01-12 | 半導体機器のリ−ド材用銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58121658A (enrdf_load_stackoverflow) |
-
1982
- 1982-01-12 JP JP315982A patent/JPS58121658A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0310695B2 (enrdf_load_stackoverflow) | 1991-02-14 |
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