JPS58116738A - 半導体ウエハの熱処理装置 - Google Patents

半導体ウエハの熱処理装置

Info

Publication number
JPS58116738A
JPS58116738A JP56212200A JP21220081A JPS58116738A JP S58116738 A JPS58116738 A JP S58116738A JP 56212200 A JP56212200 A JP 56212200A JP 21220081 A JP21220081 A JP 21220081A JP S58116738 A JPS58116738 A JP S58116738A
Authority
JP
Japan
Prior art keywords
chamber
furnace
oxygen
hole
oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56212200A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6328496B2 (enExample
Inventor
Kenichi Kuroishi
黒石　憲一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP56212200A priority Critical patent/JPS58116738A/ja
Publication of JPS58116738A publication Critical patent/JPS58116738A/ja
Publication of JPS6328496B2 publication Critical patent/JPS6328496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
    • C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
    • C23C8/10—Oxidising

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
JP56212200A 1981-12-29 1981-12-29 半導体ウエハの熱処理装置 Granted JPS58116738A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56212200A JPS58116738A (ja) 1981-12-29 1981-12-29 半導体ウエハの熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56212200A JPS58116738A (ja) 1981-12-29 1981-12-29 半導体ウエハの熱処理装置

Publications (2)

Publication Number Publication Date
JPS58116738A true JPS58116738A (ja) 1983-07-12
JPS6328496B2 JPS6328496B2 (enExample) 1988-06-08

Family

ID=16618571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56212200A Granted JPS58116738A (ja) 1981-12-29 1981-12-29 半導体ウエハの熱処理装置

Country Status (1)

Country Link
JP (1) JPS58116738A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6159341U (enExample) * 1984-09-25 1986-04-21
JP2016163025A (ja) * 2015-03-05 2016-09-05 三菱電機株式会社 半導体製造装置および半導体デバイスの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6159341U (enExample) * 1984-09-25 1986-04-21
JP2016163025A (ja) * 2015-03-05 2016-09-05 三菱電機株式会社 半導体製造装置および半導体デバイスの製造方法

Also Published As

Publication number Publication date
JPS6328496B2 (enExample) 1988-06-08

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