JPS58114039U - Semiconductor manufacturing jig - Google Patents
Semiconductor manufacturing jigInfo
- Publication number
- JPS58114039U JPS58114039U JP1103382U JP1103382U JPS58114039U JP S58114039 U JPS58114039 U JP S58114039U JP 1103382 U JP1103382 U JP 1103382U JP 1103382 U JP1103382 U JP 1103382U JP S58114039 U JPS58114039 U JP S58114039U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor manufacturing
- manufacturing jig
- semiconductor wafer
- abstract
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はエピタキシャル成長装置の断面ｉ、第２図は比
較的小径の半導体ウェー／Ｎを載置したサセプタの部分
平面図、第３図および第４図は比較的大径の半導体ウェ
ーハを載置したサセプタの部分平面図、第５図は比較的
大径の半導体ウェーハを載−し゛たこの考案の一実施例
のサセプタの部分平面図、第６図は第５図のＶＩ−ＶＩ
線に沿う断面図−である。
１３・・・・・・半導体ウェーハ、１４・・・・・・半
導体製造治具（サセプタ）、１５・・・・・・傾斜面部
、１６・・曲 □山部、１７・・・・・・谷部。Figure 1 is a cross-section i of the epitaxial growth apparatus, Figure 2 is a partial plan view of a susceptor on which a relatively small diameter semiconductor wafer/N is placed, and Figures 3 and 4 are on which a relatively large diameter semiconductor wafer is placed. FIG. 5 is a partial plan view of a susceptor according to an embodiment of this invention on which a relatively large diameter semiconductor wafer is mounted, and FIG. 6 is a partial plan view of a susceptor shown in FIG.
It is a sectional view taken along the line. 13... Semiconductor wafer, 14... Semiconductor manufacturing jig (susceptor), 15... Inclined surface portion, 16... Curved □ Mountain portion, 17... Tanibe.
Claims (2)
傾斜面部分に半導体ウェーハを載置するようにした半導
体製造治具。(1) At least its upper surface is formed into a triangular wave shape in cross section,
A semiconductor manufacturing jig in which a semiconductor wafer is placed on an inclined surface.
新案登録請求の範囲第（１）項記載の半導体製造治具。(2) The semiconductor manufacturing jig according to claim (1), wherein both sides of the upper surface are upwardly sloped surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1103382U JPS58114039U (en) | 1982-01-28 | 1982-01-28 | Semiconductor manufacturing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1103382U JPS58114039U (en) | 1982-01-28 | 1982-01-28 | Semiconductor manufacturing jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58114039U true JPS58114039U (en) | 1983-08-04 |
Family
ID=30023653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1103382U Pending JPS58114039U (en) | 1982-01-28 | 1982-01-28 | Semiconductor manufacturing jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58114039U (en) |
-
1982
- 1982-01-28 JP JP1103382U patent/JPS58114039U/en active Pending
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