JPS58112388A - Coating device in hybrid circuit board assembling apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for precisely mounting electronic components onto a hybrid circuit board, and more particularly to a method for precisely mounting electronic components onto a hybrid circuit board.

It has solder bumps on the bottom surface. The above-mentioned hybrid circuit board assembly apparatus is used in which small components such as semicircular chips, capacitor chips, integrated circuit chips, etc., commonly known as fritsuno chips, are mounted on a ceramic substrate preprinted with thin-layer conductors. The present invention relates to a coating device that applies an adhesive to the upper surface of the substrate prior to assembling the chip onto the upper surface of the substrate in order to temporarily adhesively hold the chip on the upper surface of the substrate.

Some hybrid circuit board assembly devices have a woodcutter configuration, but in any of these devices, a It is necessary to apply an adhesive to the upper surface of the substrate to immovably and temporarily hold the chip to be assembled above the substrate.

Various methods are used to apply adhesive to the top surface of the substrate, but since the adhesive applied to the top surface of the substrate is used to temporarily fix the chip to the top surface of the substrate, it is difficult to use excessive adhesive. In addition, the assembled chip must be firmly supported on the board, so more than a certain amount must be applied, and the adhesive must be applied uniformly and blindly. ◎ To date, there is no adhesive applicator that satisfies all of these requirements in most cases.

The amount of adhesive applied may be excessive or uniform application may not be achieved.

The present invention was devised in order to eliminate the dissatisfaction with the above-mentioned conventional example, and in order to apply an adhesive to the upper surface of the substrate, the application surface of the stang/base which presses the cloth surface upwardly of the substrate is kept constant. It has an uneven surface of Noreen.

An embodiment of the present invention will be described below with reference to the drawings. Referring to FIGS.
The turntable 1B is provided with a generally flat circular turntable 1B mounted to rotate around 4.

A drive device (not shown) for rotating the turntable 1sI is provided below the turntable 13,
The turntable ill and the drive I & mount are fixed to the base plate zO. The base plate BO is provided with base legs z2 so that the turntable 18 is at a height that allows an operator to conveniently mount a board on the turntable 13 as described below.

An alignment support plate holder for the alignment support plate 36 arranged substantially symmetrically with respect to the drive shaft 14! 14 is the turntable 1
It is installed behind turntable 1g at approximately the same height as turntable 11. These alignment receiving plates 86 place and hold chips 40 of various types, and a plurality of chips having one physical size, type, and value are placed on each alignment receiving plate s6 in regular nine turns. be placed.

The turntable 1z is provided with four nesting stands s8 equidistantly spaced from each other, and after the substrate 80 is inserted therein by an operator, it is gripped rigidly and removably. The turntable 1m is intermittently rotated clockwise in four equal steps of 90&, and each nesting stand s8 is placed at a loading station 8s near the worker who manually pushes the board 80 (not shown). located in Turntable IJ is 9
When it is rotated 0 degrees and indexed, the board inside the SS goes
Come to the Fim cloth station 84, where the substrate 80
Glue is automatically applied to the top surface. This adhesive ridge 5 cleans the conductor surface on which the soldering is to be performed, and serves as an adhesive to bond the chip 40 to the substrate 80 after and before soldering.

When the turntable 18 is then rotated 90 degrees and indexed, the adhesive is applied and the board 80 comes to the assembly station 36, where the board 7'4G is attached to the board 80. 80 printed circuits require versatility.

It is placed on the substrate 80 with nine turns and orientations.

Terra on board 80! When the 4G is installed, the turntable iB rotates 90 degrees and is indexed to the unloading station 8.
8, the assembled board 80 is automatically carried out onto a conveyor crane, and the conveyor 4s transports the board 80 to the next process 9.For example, soldering is carried out to the process section.Assembling is carried out at station 86. Chip 40 installed on substrate 80
Although the assembly work time is irregular depending on the number of turntables 12, the operation of the turntable 12 is continuous.

Each nesting stand S8 has four
Two substrates 80 are typically installed by nine operators, one at each station, for simultaneous machining.

Behind turntable 1B, Ii row receiving plate holder z4
A pair of left chip carrier 44 and right chip carrier 44 are provided opposite to each other, and these chip carriers can move independently in the x-y horizontal plane as shown in Figure WJ1. To make it easier to understand in Figure 2.

The positions of the chip carriers 44, 46 are indicated by dashed lines.

When retreating in the Y direction and moving left or right in the X direction, the chip carriers 44 and 46 travel above the arrayed alignment receiving plates 16 and pick up individual chips 7'40 from the alignment receiving plates s6. As shown in the 0M2 diagram.

For practical reasons, when two chip carriers 44 , 46 are used, the right chip carrier 46 has an alignment support plate z6 on the right side of the drive shaft 14 in order to avoid substantial interference between these chip carriers. handling, the left chip carrier 44 is connected to the drive shaft 14
However, such a restriction is not necessarily necessary (by computer control, any of the chip carriers 44 and 46 can handle the alignment plate s6 to the chip 7'40). In response to an address command along the X-Y axis from another program (not shown),
The chip carrier 44° 46 is moved onto the alignment plate 86 holding the desired chip 4o, and a hollow vertical spindle using an internal vacuum is lowered to place the chip 7'4 on the alignment plate Sa.
Capture 0.

The spindle holding a given chip 40 rises.

The chip carriers 44, 46 move laterally in X-YdIJ until they reach the desired position on the substrate 80, which is located at the assembly station 86 of the turntable ls.

The posture of the tip 40 in the rotational direction is determined by the rotation of the spindle, and the tip 40 is accurately positioned on the spindle by the depth posture correction device. Then spindle #
After the deity, the Tyrannosen is pressed with a certain force onto the top surface of the board SOO adhesive applied, and here the chip 7"40 is attached until it is permanently soldered and bonded. ◎Permanently bonded. The method and apparatus do not form part of this invention. The vacuum in the spindle is removed and the chip 4o is released by a slight positive pressure. After the spindle is raised, the chip carrier port, 46, is oriented according to the control program. Then select the other chip No. 0 and repeat the same operation sequence.One chip carrier moves back to the alignment receiving plate 86 again, leaving chip 4o behind. Each chip carrier operates independently of the other chip carrier, except in the case where the chip carriers alternately place a chip on the substrate 8o, such as when the chip carrier is on standby without being placed on the substrate 8o.

After completing the assembly of the board 80, turn chisel li1
is further rotated 90 degrees and indexed to place the substrate 3o at the unloading station 884C, which causes the unloading device 898 to operate and grasp the edge of the nine assembled substrates 8o from above. The substrate 8o is released from its holder 18, lifted up by the unloading device 898, rotated horizontally, and lowered onto the conveyor crane.

Until a detector (not shown) indicates completion of the work to be done at each of the four stations.

The turntable li1 is not rotated.

As described above, the coating apparatus 100 according to the present invention is constructed.

Coating station 8 of hybrid circuit board assembly device 10
The adhesive is applied to the upper surface of the substrate 80 located at this application station 841.

That is, after inserting the board 80 into the gold plate 28, the board 8
0, the turntable 12 is automatically rotated intermittently by 90 degrees in the direction of the hour hand by a drive device (not shown), and the board 8
0 is installed in the coating station 84. Coating device 100
has a stamp arm 1o11 that is removably attached to a swing arm 104 that is rotatable about two rotation shafts 106. The swing arm 1G4 is actuated in one of two positions. In the first position, the stand base 103 (FIGS. a, b) is wetted with adhesive 1118.

After being indexed to the coating station 84, it is positioned directly above the accommodated substrate 80. When the solenoid is actuated, the second rotation shaft 106 descends, and the application surface 1G+1 of the stun f pad 1011 is removed from the housed substrate 80 before it rises again to its original height. Press down momentarily. The stamping pin 1Gm has almost the same size and shape as the board 80, and the adhesive is applied uniformly to the entire top surface of the board 800. Only a narrow rim of about 1/16 inch next to the edge is left.

The swinging arm 104 is then rotated 180 degrees (by means not shown) about the pivot axis 106, and the stamp nod 10S1 is placed on top of the pine 110 which is continuously wetted with adhesive. When the next substrate 8o is indexed, a solenoid (not shown) lowers the stamping pad IG2, and its coating surface 108 is wetted by a pine needle 110. Stang pad 10fi is then pulled up, rotated 180 degrees, and transported again above coating station 84 and the next substrate 8o, and the coating process described above is repeated.

The application surface 108 of the stang pad 1 oz. is comprised of parallel rows of rectangular lands with large protruding surfaces 114 raised above the bottom 116 of the stang 7° pad 1 oz. Furthermore, on the application surface 108, alternating rows of rectangular lands are formed on the bottom 1 of the stun 7° pad 102.
16, there is a small protruding surface part 118 that is pulled up by a distance 11i10 that is slightly shorter than the large protruding surface part 114.

Stamp pad 10B is made of rubber or other suitable resilient material and is backed with aggregate 188. Application surface 10
8 is not a single continuous plane, but the protruding surface portions 114° 118
This spacing allows the adhesive 118 to be uniformly applied onto the substrate 80 without gaps when the stamp tip 10$1 is pressed against the substrate 80 at the coating station 84 as described above. Sufficient pressure is applied and the stang guard 1 oll has sufficient elasticity, so the protruding surface portion 114 ,
118 all contact substrate 80. When the stamp pad log is pulled up after applying adhesive to the substrate, the small protruding surface portion 118 separates from the substrate 80.

- 10,000, the large protruding surface portion 114 still contacts the substrate 80 and maintains its increased production position. Therefore, Stanguard 102
The force due to the surface tension between the substrate 80 and the substrate 80 is broken during the process, and the stress generated on the substrate 80 during one separation process becomes small.

Rows of square 0.100 inch protrusions and 0.100
An example of a stamp with an inch separated column 1
G1i is such that the large protruding surface portion 114 is located 0.0 above the bottom portion 116.
60 inches, and the small protruding surface portion 101 is located above the bottom portion 116.
, o s.

9. Completely and uniformly apply adhesive to the surface of the substrate 80.

The mat 11G is composed of a short elastic and flexible wick (FIG. 4), and is shaped like an inverted U, with a shallow receiver filled with a layering agent 118 connected to the rigid support member 1 supported in the tray 126.
It surrounds 14. The end 180 of the pine) 110 is supported in the adhesive 11a, and the support 114 maintains a horizontal mat surface on which the stamp 7° pad log is pressed.
Wet on level 1811. In a well-known manner, Matt 1
Glue ls moving from 1G to STANGUA 4TSDO 10m
8 is replaced by the action of the mat material. A removable force/removal force indicated by dashed lines in FIG. 4 and having a rectangular opening 186.
F-184 is provided to reduce evaporation and staining of the adhesive TSE, while the stang pad 1101 is pine) 11
It is set so that it reaches 0.

In this manner, in the coating device 10G according to the present invention, when the turntable iB rotates intermittently and the substrate 80 held by the metal insert 28 is located at the coating station 84, the stamp pad 10B attached to the rotating arm 104 is rotated. (Figure 3)
11G (Fig. 4), rises, and rotates on the substrate 80 ◎ Stamp 9 Tsudo 10
! is then lowered to press and compress the substrate 80 and apply an adhesive thereto. Then, the stamp guard 102 is pulled up, rotated, and returned to its initial position on the pin 11G to wait for the ninth substrate 80 to be coated.

After the adhesive coating work is completed, the turntable lit is indexed by rotating 90 degrees in the direction of the soil, and the coated substrate go is
It is transported to the stand-up station 86.

In this way, two stamps and a coating device 100 according to the present invention are used.
Since the coating rk 1108 of the nine dots 1011 is formed from a row of the large protrusion 11Ii portion 114 and the small protrusion surface portion 118, the entire wing cloth 110108 is not pressed against the upper surface of the substrate 80 at the same time with the same pressing force, and At the same time, it does not separate from the upper surface of the substrate 80. In other words, when the coating surface 108 is pressed against the upper surface of the substrate 80, the large protruding surface portion 114 is pressed first, and conversely, the coating surface 108 is pressed against the upper surface of the substrate 80.
8 is detached from the substrate 80, the large protruding surface portion 114
The detachment of the small protruding surface portion 1141 is delayed in terms of time.

Therefore, the adhesive 118 located between the coating surface 10g and the top surface of the substrate 80, due to its surface tension,
When the stump base powder log leaves the upper surface of the substrate 80, it is pulled by the large number of large protruding surface portions 114, and the upper surface of the substrate 80 is not coated excessively.

In other words, since the coating surface 108 has unevenness formed by a large number of large protruding surface portions 114 and small protruding surface portions 118, a relatively large amount of adhesive l18 is applied. By pressing the adhesive 1B8 onto the upper surface of the substrate 80, a sufficient amount of the adhesive 1B8 can be applied almost uniformly over the entire upper surface of the substrate 80.
, when the STANGUADO log is removed from the top surface of the substrate 80, the small protruding surface portion 118 first separates from the top surface of the substrate 80, and then the large protruding surface portion 114 separates from the top surface of the substrate 80, so that the small protruding surface portion 114 separates. By this,
The adhesive 128 applied to the upper surface of the substrate 80 opposite to the small protruding surface portion 114 is drawn to the large protruding surface portion 114 still in contact with the upper surface of the substrate 80 due to the action of the surface rki tension, and the adhesive 128 is drawn to the upper surface of the substrate 80. The adhesive 1B8 that has gathered on this large protruding surface portion 114 will only remain in the form of a Ti layer.

The surface tension of the adhesive 1' 118 applied to the application surface 108 causes it to be sucked up by the stamp band los ill, so that an appropriate amount of adhesive 188 is uniformly applied to the upper surface of the substrate 80. 0 As is clear from the above description, the coating device according to the present invention can uniformly and only apply an appropriate amount of adhesive to the upper surface of the substrate by the action of both the large and small protruding surface portions of the coating surface. The work required is simply to suppress the standino 4, and furthermore, the application time is shortened, which provides excellent effects.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway plan view of a hybrid circuit board assembly device embodying the present invention, with parts omitted. FIG. 2 is a partial plan view of the moving device omitted in FIG. 1. FIGS. 3(a) and 3(b) are plane and llffi diagrams of the stamp/base in the coating device according to the present invention. FIG. 4 is a 11-side view showing the specific structure of the saucer in the device of the present invention. Explanation of symbols 1O: circuit type assembly device, 20: pace plate, 12: turntable, 84: alignment receiving plate holder, 86: alignment receiving plate, 2
8: Iresenkin, 8s: Loading station. 84: Application station, aa: Assembly station,
88: Unloading station, 8o: Board, 4o: Chip f,
too: coating device, 1oit: stamp band. 104: Swinging arm, 106: Rotating arm, 108: Application surface. 110: Matt, 114: Large protruding surface part, 118: Small protruding surface part, 1m6: Receiving ff111 118: Adhesive 〇 Procedural amendment form (Category 1 Showa CL? year /month//day Director General of the Patent Office Waka 13 Kazuto Audience 1 , name of invention

Claims (1)

[Claims] An adhesive is applied to the upper surface of the substrate held immovably and in alignment, and then various desired chips are assembled on the upper surface of the substrate, and each of the chips is attached to the applied adhesive. A coating device for applying an adhesive onto the substrate (3) in a hybrid circuit board assembly apparatus in which the substrate is temporarily held on the upper surface of the substrate by adhesive. a saucer containing an adhesive; a stamp/branch for applying the adhesive stored in the saucer to the application surface, which is the lower surface of the saucer;
The stamp pad is comprised of a drive mechanism that moves the stamp pad between the saucer and the substrate and presses the application surface against the upper surface of the substrate, and the stamp pad has two protrusions made of elastic material on the lower surface of the plate-shaped plywood. A large number of protruding surface portions each having a flat end surface are protruded, and the protruding surface portions are arranged in rows and columns, and large protruding surface portions with a large protrusion amount and small protruding surface portions with a small protrusion amount are alternately arranged in rows. A coating device for a hybrid circuit board assembly device in which a coating surface is formed by forming a coating surface.