JPS59161098A - Optical data reader for automatic assembling system - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The present invention automatically sets so-called small electronic components such as chips (resistors, capacitors), mini-mold transistors, mini-flat E-C components, etc. on a printed circuit board. The purpose of the optical data reading device used in an automatic assembly system for soldering is to read a position data sheet with a large number of markings indicating the mounting positions of a large number of electronic components mounted on a printed board. , an image sensor that optically scans this position data sheet to detect the positions of the plurality of mark parts, an address in a four-child component supply section of the electronic component mounted on the printed circuit board, and the electronic component supply of the electronic component. A keyboard for inputting information such as the pickup angle from the part and the setting angle with respect to the printed circuit board;
The relationship between the axis coordinate and the Y-axis coordinate is stored, and each electronic component corresponding to the large number of mark parts is classified and assembled by address based on the information from the keyboard.
J order is determined and the resulting assembly order data for each electronic component, X-axis coordinate data, and ¥4'lB coordinate data.

By having a configuration equipped with a CPU that stores component address data, pick-up angle data, and set angle data, it is extremely easy to store data on a storage medium, and it is possible to automatically assemble to various specifications. Notes for system control'l&D 1. The object of the present invention is to provide an optical data reading device for an automatic assembly system, which can easily obtain a used medium and can change over various types of data in a short time.

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a horizontally elongated machine frame, in which a first transfer mechanism 2 is disposed in the front part, and a second transfer mechanism 6 is provided in the rear part. Reference numeral 4 designates a conveyance table mounted on the front part of this machine frame 1), which is adapted to be moved by the first transfer groove 2 in the directions of arrow 5 and counter-arrow 5.

Furthermore, at the end of the front section of the machine frame 1, there is a printed circuit board storage section (not shown) in which a large number of lint circuit boards are stored in a stacked manner.
When the transport table 4 is moved in the opposite direction of the arrow 5 and positioned at the end of the front stage of the machine frame 1, one printed circuit board 6 is removed from the three parts of the printed circuit board "1%".
is now being offered. In this case, 7 is placed on the top surface of the printed circuit board A, as shown in FIG.
Component wiring patterns 7, . . . are formed, and soldering points 8 of small electronic components are formed. ... is marked. Reference numeral 9 is a number of solder supply structures installed in the upper part of the front part of the crosspiece frame 1, and includes a support frame 10 and a screen 11 attached to the support frame 10. The soldering point of the printed circuit board 6 is 8°...
・Corresponding to solder pattern 12. ...but I'm exhausted. The solder feeder groove 9 has a movable application member (not shown) that applies sticky creamy solder onto the screen 11, and the transfer table 4
When the coating member is moved over the screen 11 with the printed circuit board 6 mounted on the screen 11 positioned below the screen 11, the solder pattern 12. According to the soldering points 8 of the printed circuit board 6. ...Solder is supplied on top by printing. 13 is a mounting mechanism disposed in the middle part of the machine frame 1, and this will be described below.

Reference numeral 14 denotes an X-width transfer mechanism having an X-width/crus motor 15 disposed in the middle part of the machine frame 1, and is configured to move the X-axis circumferential table 16 in the arrow X and counter-arrow X directions. It has become. Reference numeral 17 denotes a Y@ transfer mechanism disposed on the base frame 18, which has a Y-axis pulse motor 19 and is configured to move the Y-axis table 20 in the arrow Y and counter-arrow Y directions. It has become. Further, a chip chuck 21 and a machining C chuck 22 are attached to the Y-axis circumferential table 20, and these chucks 21 and 22 are moved up and down by air cylinders 26 and 24, respectively. It is designed to be rotated by chuck Nockles motors 25 and 26 (see FIG. 4). Reference numeral 27 denotes a small electronic component supply unit, which is equipped with a transfer unit (28) having a component pulse motor 38 (see FIG.
A base frame 30 is placed on a base 29 having arrows 61 and 3.
A large number of reels 62. are attached to the base frame 60 so as to be movable in one direction. ... are arranged in parallel, and these reels 32. A large number of rollers 33 in one-to-one correspondence with...
9... are arranged in parallel, and the reel 32°... is a tape 34 that stores small electronic components such as chip resistors, chip capacitors, mini-molded transistors, mini-warmold transistors, etc. 2 are wrapped around each other, and the tips of the tapes 34°... are placed on rollers 63. . . . and the roller 65.・・・
* is pulled out to the pickup table 35 by being rotated. Note that 35a is a cutter. In this case, tape 64. ... are housed with different small electronic components, but a large number of the same small electronic components are adhered to each tape 54 at predetermined intervals. And reel 32. ``1'' for each
.

Component addresses 1'-2J, 1'-3J, . . . are determined. 36 is an IC mounted on the base frame 60
It is a magazine in which 12 mini-flat E-Cs, which are small electronic parts, are stored and stored, categorized by type, and each mini-flat E-C has its own parts address. There is. Although not shown in the drawings, a heating frame structure is provided in the middle of the second transfer mechanism 3 at the rear stage of the intrusion frame 1, and a 1. In each case, a pair of runners 37 (41st Sutani Teru) are installed.

The automatic assembly system shown in FIG. 1 is controlled by the control apposition shown in FIG.
'V, F as a storage medium for storing data;
2PROM, 40 is CPU, 41j is display unit, 4
2 is the X1 drawing machine 10 interface, 45rr is the drive circuit for the X width, 44 is the Y axis circumference I10 interface, 4
5 drive circuit for Y@, 46 a chuck machine 10 interface, 472 a chuck drive circuit, 48 a parts supply machine 10 interface, 49 a parts supply drive circuit, 50 machines).

51 is a drive circuit for drive units other than the pulse motors 15, 19, 25, 26 and 38; 52 is a controller 10 interface;

Now, the optical data sales device 53 for storing automatic assembly data in the FROM 39 will be described with reference to FIGS. 5 to 8. 54 (d position data sheet,
As shown in FIG. 6, this includes a chip component 55 mounted on the printed circuit board B. . . . (chip resistor, chip capacitor, mini mold transistor, mini power mold transistor, etc.) and the data shielding hole 57 which is a mark part indicating the mounting center position +2 of the mini flat E C56 (see Fig. 3 above). . . , which is set on a moving table 58. This moving table 5
8 is moved by a pulse drive motor 59 via a screw rod 60 in the direction of arrow Y and the direction opposite to arrow Y.
Furthermore, a light source 61 is disposed above the movable table 58. Further, a mirror 62 is disposed below the moving table 58 in correspondence with the light source 61, and its reflecting surface 63 has an inclination angle of 45 degrees. 64 is a linear image sensor, which is the reflective surface 6 of the mirror 62.
3 in the direction of arrow X.

Therefore, the image sensor 64 receives the light that passes through the data trace hole 57 of the position data sheet 54 and is reflected by the reflective surface 66, and outputs a position detection signal.

The position detection signal 1l-j of the image sensor 64 is given to the CPU 66 via the high-speed video interface 65, and the CPU 66 detects the position detection signal 1l-j every time one scan of the image sensor 64 in the direction of arrow X is completed. Output the drive signal and give it to the pulse motor 59 via the pulse motor drive circuit @67゛:Runina, pulse motor 59! Each time a d@ motion pulse is applied, the # motion table 58 is rotated by a predetermined angle and moved by a predetermined distance in the direction of the arrow Y. Based on the above, the CPU 66 selects the data trace hole 57 of the position data sheet 54. ... are read and stored in relation to the X-axis mark and the Y-axis mark. Then, when the CPU 66 finishes capturing all positions of the data holes 57°, the CPU 66r! 'i
Around the time of reading, the position information is sequentially displayed on a CRT (not shown) based on an operator's operation. Then, the location information is read on the CRT rlj,
When displayed in the order of F21, r3J, . Various information such as the feed stroke 2 pickup angle and set angle of the small child part is entered and stored in the CPU 66.

When such operations are completed, the CP-U 66 stores each small electronic component by address, determines its assembly order, and reads the above data 'f:' 110 interface 69 and ROM. EPR via circuit 70
Write and store in OM39. Therefore, EPROM59
As shown in FIG. 8, the reading sequence rIJ, r'
2J, 1-3J, ... A data indicating the assembly order for each "n" + X! ! '[l] B data showing m mark.

C data indicating the Y-axis coordinate, D data indicating the part address, ? E data indicating the pick-up angle, F data indicating the set angle, and G-i'' indicating the feed stroke are often stored.The EPROM 39 in which the automatic assembly data is stored in this way is optically After the data reading device 56 is removed, it is inserted and set into a control box (not shown) of the automatic assembly system shown in FIG.

Next, the operation of this embodiment will be explained. Final delivery table 4
When it is located at the center position of the printed circuit board, which is the end of the front stage of the crusher 1, a signal from the position/direction controller 37 is given to the CPU 40 via the control controller 52, and the CPU [40 outputs a printed circuit board set signal and supplies it to the drive circuit 51 via the control I10 interface 5o. As a result, a setting mechanism (not shown) thrown into the printed circuit board storage section is activated, and one printed circuit board 6 out of the many printed circuit boards stacked in the printed circuit board storage section is placed on the transfer table. Set to 4. When the printed circuit board 6 is set on the transport table 4, the set detection detector 37 detects this, so the CPU 40 outputs a transport signal and sends it to the drive circuit 51. The transport mechanism 2 of No. 1 is activated to transport the transport table 4 in the direction of arrow 5. Transfer table 4 is used for soldering! When it is transferred to the lower part of the screen 12 of the @1 purchasing facility 9, the position detection detector 67 detects this, so the CPU 40 outputs a stop signal and a solder supply signal to drive the drive circuit 51.
First, the first transfer machine 612 is stopped,
Next, the applicator member of the solder supply mechanism 9 is moved back and forth within the support frame 10, and as a result, creamy solder is printed on the soldering location 8° of the printed circuit board B. When the coating member completes its reciprocating movement within the support frame 10, this is detected by the coating unit finance detector 37, so the CPU 40 starts driving again (starting No. 8 to exit). Then, the first transfer mechanism 2 is activated and the transfer table 4 is again transferred in the direction of the arrow 5.

When the transport table 4 reaches the groove mounting mechanism 13 in the middle section, the position detection detector 37 detects this, and the CPU 40 outputs a stop signal to stop the first transport mechanism 2 and Drive circuit 5 by outputting the transfer signal
As a result, a transfer groove (not shown) is activated to transfer the printed circuit board 6 set on the transfer table 4 onto the X-axis table 16. When this transfer is completed, the transfer detection detector 67 detects it, and the CPU 40 starts reading out the automatic assembly data stored in the EPROM 39. First, data B to C of the first positioned small electronic component is read out sequentially from data A indicating the assembly order, and a component supply signal is output based on data D indicating the component address to prevent parts damage. The drive circuit 49 is supplied to the component supply drive circuit 49 via the liner 10 interface 48.
The parts pulse motor 38 is rotated to move the base frame 30 in the direction of the arrow 51 or counter-arrow 31, and the tip of the tape 64 on the reel 32 corresponding to the above-mentioned part address is positioned opposite the cutter 35a. Further, a chuck rotation signal is outputted based on the E data indicating the pink-up angle and given to the chuck drive circuit 47 via the chuck tool 10 interface 46), and the chuck drive circuit 47 is a chuck pulse motor. 25 or 26 to rotate the chuck 21 or 22 by a predetermined angle. In this case, when the small electronic component located at the position facing the cutter 35a, that is, at the pick-up position, is a chip component 55, the chip chuck 21 is selected, and when the mini-flat machining C56 is selected, the chuck 22 for machining C is selected. The reason for rotating the chuck 21 or 22 is as follows. In other words, small electronic components have a Yokoyoshi rectangular shape;
The pick-up angle is stored as E data so that the small electronic component can be chucked in an optimal state because the shape has a directionality such as a vertically bent rectangular shape.

Thereafter, a chuck signal is outputted and given to the drive circuit 51, thereby causing the air cylinder 2
5 or 24 is activated, the chuck 21 or 22 is lowered, and the small electronic component at the pick-up position facing the cutter 35a is chucked, and then the air cylinder 2
3 or 24 is returned to complete the pickup of the small electronic component. When picking up such a small electronic component is completed, the roller 33 corresponding to the tape 34 at the book-up position facing the cutter 35a is rotated by a predetermined angle based on the C data indicating the feed stroke.
The small electronic components on the tape 64 are picked up on the table 3.
5. In this state, the center of the small electronic component adhered to the tape 34 is located at the center of the pickup table 35. That is, the small electronic components have different shapes, such as squares, horizontally long rectangles, and mediastinal rectangles, as well as small differences in thickness. The withdrawal amount is set optimally. When the tape 34 has been drawn out in this manner, the leading end of the tape 34 that has come off the pickup table 65 is cut by the cutter 35a. Thereafter, a chuck rotation signal is outputted again based on the F data indicating the set angle and given to the chuck drive circuit 47, and the chuck 21 or 22 is rotated by a predetermined angle again. This is because when a small electronic component is mounted on the printed circuit board 6, there are various mounting directions, such as the positions of the terminals, which are made in a 1D oblong shape or a vertically long shape, and are therefore set in a predetermined mounting state. This is because the set angle is stored as F data. Furthermore, B data indicating the X@ coordinate and C indicating the Y axis coordinate
Based on data: ll11. The m motion signal and the Y@ drive signal are output to the X-axis peripheral machine 10 interface 42 and the
The axial circumferential drive circuit 43 and the Y-axis circumferential driver 4 are arranged. Accordingly, the X@ drive circuit 43 rotates the X-axis circumferential pulse motor 15 by a predetermined angle, moves the X-axis circumferential table 16 in the direction of arrow The Y-axis peripheral table 20 is moved in the direction of the arrow Y or in the opposite direction of the arrow Y. Therefore, the small electronic components chucked by the chuck 21 or 22 are transferred to the B data and C data on the printed circuit board 6. It is located above its own mounting position indicated by . Thereafter, the air cylinder 23 or 24 is operated again to lower the chuck 21 or 22, and the small electronic components chucked in the chuck 21 or 22 are set at their mounting position on the printed circuit board 6. Become. In this case, the terminals of the small electronic components set on the printed circuit board 6 come into contact with solder printed and supplied to the soldering points 8 to which they are to be soldered, and are temporarily held by the adhesiveness of the solder. . In this way, when the setting of the small electronic component on the printed circuit board 6 is completed, the chuck 21 or 22 is moved upward, and the X-axis circumferential table 16 and the Y-axis circumferential table 20 are moved in the opposite direction to that described above. As a result, the chip chuck 21 is returned to its original position above the book-up position on the pickup table 35. Similarly, the CPU 40 sequentially reads data B to C in accordance with the order of data A indicating the assembly order, and sets the corresponding small electronic component at the mounting position on the printed circuit board 6. When all the small electronic components to be mounted on the printed circuit board 6 have been set, the CPU 40 outputs a set completion signal and sends it to the X-motion drive circuit 46, which drives the X-axis pulse motor 15. is rotated in a certain direction to move the X-axis circumferential table 16 in the direction of arrow X, whereby the printed circuit board 6 is transferred from the X-axis circumferential table 16 onto the second transfer punch 3. When this transfer is finished, or some time before this, the CPU 4
0 is a drive circuit 5 which outputs a drive signal and a heating signal.
As a result, the second transfer machine 6 is operated to transfer the printed circuit board 6 in the direction of the arrow 5, and a heating mechanism (not shown) is operated to transfer the printed circuit board 6 in the direction of the arrow 5. 2
The printed circuit board 6 transferred by the transfer mechanism 3 is heated to melt or glaze the solder at the soldering points 8, . As shown in FIG. 3, a small electronic component C-chip component 55. Mini flat IC56) printed base Fi
Soldering for 6 completes the installation. Thereafter, the operations described above will be repeated.

According to the optical data reading device 53 of this embodiment, the assembly order (A data) of small electronic components (A data), lx shaft seat CB data) is stored in the EPROM 59 based on the information from the position data sheet 54 and the keyboard 6B. , Yl coordinate, mark (0 data), parts address CD data), pickup angle (
Since each data (E data), set angle (F data), and feed) stroke (G data) is recorded uniquely, it is extremely easy to store data in EPROM 39K, and it is also compatible with the specifications of multi-21g. EFROM for the automatic assembly system leg system can be easily obtained, and it is possible to carry out a variety of tasks in a short period of time.

Further, according to this embodiment, the following effects can be obtained. In other words, just by stacking and storing a large number of printed circuit boards in the printed circuit board storage section at the end of the machine frame 1, you can store them one by one! It is set on the general transport table 4 and can automatically attach and assemble a large number of small electronic components to the set printed circuit board B, and moreover, the optimum assembly order of the small electronic components is stored in advance in the EPROM 39. This allows assembly to be completed in a short time, which is extremely effective in terms of labor savings. In addition, EPRO is used as a storage device to control the automatic 1wl standing system.
Since M39 is used, it has the advantage of being smaller and more durable than when using cassette tape, etc. Furthermore, by replacing EPROM39, it can be used for printed circuit boards with different types of circuit configurations. It can also be adapted to automatic assembly of small electronic components.

It should be noted that the present invention is not limited to the embodiments described above and shown in the drawings; for example, EPRO may be used as a storage medium.
It is possible to use a normal ROM instead of M, or even use a punched tape, a magnetic floppy disk, a magnetic tape, etc. without departing from the gist of the invention. Of course.

As is clear from the above description, the present invention makes it extremely easy to store data on a storage medium, and also makes it possible to easily obtain a storage medium for controlling an automatic assembly system even with a wide variety of specifications. It is possible to provide an optical data: two-take device for an automatic assembly system that can perform multi-purpose switching in a short time.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention, in which Fig. 1 is a perspective view of the whole, Fig. 2 is a diagram showing the wiring and turns of the printed circuit board, and Fig. 3 is a diagram showing the mounting state of small electronic components on the printed circuit board. Figure 4 shows the control circuit) Figure 2 and Figure 5 are diagrams explaining the principle of the optical data reading device, Figure 6 is a plan view of the position data sheet, and Figure 7 is the optical data reading device. The block diagram of the device, FIG. 8, is a diagram showing the data stored in the FROM. In the drawing, 4 is a transfer table, 6 is a printed circuit board, 7 is a wiring pattern, 8 is a soldering point, 9 is a solder supply mechanism, 11
1'5 is a screen, 1'5 is a mounting mechanism, 16 is an X-axis table, 20 is a Y-axis table, 21 and 22 are chucks, 27 is a small component supply section, 62 is a reel, 64 is a tape, 55 ．． Side pickup table, 36 is Engineering C magazine, 59 is EPR○ivl (storage medium), 40
53 is a CPU, 53 is an optical data reading device, 54 is a position data sheet, 55 is a chip part (small-sized diagonal part), 56 is a mini-flat IC (small-sized part), 57
is a data trace hole (mark part), 58 is a moving table, 6
4 is an image sensor, 68 is a keyboard, 70 is a ROM
The write circuit is shown. Applicant: Sunkus Imoshiki Company - Agent: Patent Attorney Kozume Sato 2 Sendai 3 Figure 4 Figure 5

Claims (1)

[Scope of Claims] 1. A position data sheet in which a large number of mark portions indicating mounting positions of a large number of electronic components to be mounted on a printed circuit board are formed; an image sensor that detects the position of the part, an address in the electronic component supply section of the electronic component mounted on the printed circuit board, a pick-up angle of the electronic component from the core component supply section, and a pick-up angle with respect to the printed circuit board. A keyboard for inputting information such as the set angle, and a keyboard for storing the positions of the plurality of marks in the relationship between X@ coordinates and YJ graduations based on detection signals from the image sensor; Based on the information, each electronic component corresponding to the large number of mark parts is divided into addresses, and the assembly order is determined. , assembly order data, x@ coordinate data, Y-axis coordinate data, and component address data for each electronic component. An optical data reading device for an automatic assembly system comprising a CPU that stores pickup angle data and set angle data.