JPH0831716B2 - Chip mounter - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounter, and more particularly to a chip mounter for carrying and mounting chip components such as microchips on a substrate.

[0002]

2. Description of the Related Art FIGS. 5 and 6 show a conventional chip mounter and its head portion, 1 is a frame portion for fixing and holding each component, 2 is a chip component, 3 is this chip component 2
Feeder, 4 is a substrate on which the chip component 2 is mounted, 5 is a substrate transporting unit, 6 is a head unit, 7 is an X-direction moving unit of the head unit 6, 8 is a Y-direction moving unit, and 9 is a chip unit 2 picked up. A suction nozzle 10 for controlling the position and a positioning claw 1 for regulating the angle and position of the chip component 2 in the suctioned state;
1 is a motor for rotating the suction nozzle 9;
Is a motor for moving the suction nozzle 9 up and down.

When the chip component 2 on the normal feeder 3 is sucked by the suction nozzle 9, the position and angle of the chip component with respect to the normal state are largely deviated, and the chip component 2 cannot be mounted on the substrate 4 as it is. In recent years, chip parts have become smaller and more precise, and mounting accuracy of ± 0.1 mm or less is required at the time of mounting. In the conventional chip mounter as described above, the positioning claw 10 of the chip component 2 moves toward the suction nozzle 9, and the position of the chip component 2 held by the suction nozzle 9 is adjusted to adjust the center of the chip. The position of the chip component 2 is corrected so as to come to the center of the suction nozzle 9.

In another conventional example, the positioning of the chip component 2 is performed by using the positioning claws 10 instead of positioning the chip component 2 in the state of being sucked by the suction nozzle 9, as shown in FIG.
As shown in FIG. 8, the position and the angle of the chip component 2 in the state of being sucked by the suction nozzle 9 are read by the camera 13 fixed to the housing frame part 1, and the positional deviation is caused by the moving parts 7 in the X and Y directions. The head unit 6 is moved and corrected by 8 and the angle is corrected by rotating the suction nozzle 9 by the motor 11.

[0005]

However, as shown in FIGS. 5 and 6, in the case where the position regulating pawl 10 is used for positioning the chip component, the normal position regulating pawl 10 is driven by pneumatic pressure to the component. Because the driving force is large,
There is a risk of bending legs such as ICs.

On the other hand, in the case of using a camera as shown in FIGS. 7 and 8, the above problem is solved, but since the head moves from the feeder section to the fixed camera section to the substrate, that is, the head moves to all sides. The parts must be always detoured to the fixed camera part, which requires a longer moving time than the method in which the parts can be positioned while the head is moving as shown in FIGS. As described above, the increase of the moving time greatly reduces the productivity of the substrate. The present invention eliminates the above drawbacks.

[0007]

A chip mounter according to the present invention comprises a nozzle portion for sucking a chip component from a component supply unit, a centering mechanism having a driving member for moving the component to the center of the nozzle portion, A camera that recognizes the shape of the chip component sucked by the nozzle portion,
The chip part dimensions recognized by the above camera are the above chip parts.
Reading a storage mechanism for storing together with the part number, the size of the chip component sucked to the nozzle portion from the storage mechanism
Means, characterized in that it comprises more control means for stopping the cell <br/> Ntaringu mechanism slightly longer positions from the chip component dimensions.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

In the present invention, as shown in FIG. 2, X, Y indicating the numbers of a plurality of components 2 to be mounted and the component mounting positions on the board which are predetermined in a memory (not shown).
The arrangement data such as the coordinate position is stored in the arrangement data area 15. Further, the shape data such as the vertical and horizontal dimensions of the component 2 read by the camera can be stored in the shape data area 16 together with the number of the component 2. Further, as shown in FIG. 1, the component 2 in the arrangement data is sucked by the suction nozzle 9 and the camera 13
By recognizing the shape data such as the vertical and horizontal dimensions of the component 2, the shape data of the component 2 is stored in memory, and the positioning claws 10, 10 as the centering mechanism are based on this data.
Drive mechanism 1 such as a motor that can control the position of the car
The parts 2 are loosely positioned by being driven by the motors 4 and 14 and stopped at positions longer than the vertical and horizontal lengths of the parts 2 by 10 to several tens of μm respectively.

Further, at the same time as the above-described centering operation of the component 2, the head 6 is moved to the component mounting position on the substrate 4 and the component 2 is mounted. By repeating such a process, first, all the components corresponding to the first pattern are mounted on the first pattern of the first substrate.

Since the same pattern is usually assigned to one board 4 by a combination of the same parts,
In this case, mounting is started in the second and third patterns on different parts of the same substrate 4. In this case, however, since the data of the parts are already stored in the memory, As described above, the head 6 is not moved onto the camera 13, the vertical and horizontal lengths of the shape data of the relevant part 2 stored in the memory are read out, and the centering of the part 2 is performed based on the shape. At the same time, the head 6 is moved to a corresponding position on the substrate 4 to mount components.

After the components 2 are mounted on the first board 4, the board 4 is ejected from the mounter, and if there is a board to be mounted, this new board is loaded and the above steps are repeated. If it ends. 3 and 4 are flowcharts showing the above steps.

[0013]

As described above, according to the present invention, since the component positioning is performed while controlling the position by the motor based on the component shape recognized by the camera, the centering is performed at a high speed so as not to damage the component, according to the component shape. You can Further, it is only the first pattern of the first board that recognizes the shape of the part by the camera, and normally, there are two to several tens of the same patterns in one board, and several tens to one pattern at a time. Considering that hundreds of substrates are produced, there is a great advantage that the substrate can be produced with greatly improved productivity from the viewpoint of the whole production.

In the case of mounting a very important positioning component such as an IC called QFP, which has a lead connection interval of about 0.5 mm, the camera 13 recognizes the shape of the component every time and it is highly reliable. It is also possible to install it.

Although the motor is used in the above embodiment, any other motor can be used as long as the position can be controlled. Further, the centering claw 10 itself can be attached to the linear motor.

[Brief description of drawings]

FIG. 1 is a perspective view of a chip mounter of the present invention.

FIG. 2 is an explanatory diagram of contents of a memory.

FIG. 3 is a part of a flowchart of the chip mounter of the present invention.

FIG. 4 is the remaining part of the flow chart of the chip mounter of the present invention.

FIG. 5 is a perspective view of a conventional chip mounter.

FIG. 6 is a perspective view of a conventional head portion.

FIG. 7 is a perspective view of another conventional chip mounter.

FIG. 8 is a perspective view of another conventional head unit.

[Explanation of symbols]

 1 Frame Part 2 Chip Part 3 Feeder 4 Substrate 5 Transfer Part 6 Head Part 7 X Direction Moving Part 8 Y Direction Moving Part 9 Suction Nozzle 10 Positioning Claw 11 Motor 12 Motor 13 Camera 14 Drive Mechanism 15 Arrangement Data Area 16 Shape Data Area

Claims (1)

[Claims] 1. A nozzle unit for sucking a chip component from a component supply unit, a centering mechanism having a driving body for moving the component to the center of the nozzle unit, and a nozzle unit for sucking the chip component by the nozzle unit. A camera that recognizes the shape and the chip part dimensions recognized by the above camera are the above chip parts.
A storage mechanism for storing together with the part number, and means for reading the size of the chip component sucked to the nozzle portion from the storage mechanism, control for stopping the Centering <br/> grayed mechanism slightly longer position than the chip component dimensions A chip mounter comprising means.