JPS58112356A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS58112356A
JPS58112356A JP57215076A JP21507682A JPS58112356A JP S58112356 A JPS58112356 A JP S58112356A JP 57215076 A JP57215076 A JP 57215076A JP 21507682 A JP21507682 A JP 21507682A JP S58112356 A JPS58112356 A JP S58112356A
Authority
JP
Japan
Prior art keywords
pellet
lead
lead frame
bonding wire
short
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57215076A
Other languages
Japanese (ja)
Inventor
Shoichi Ogura
小倉　昭一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57215076A priority Critical patent/JPS58112356A/en
Publication of JPS58112356A publication Critical patent/JPS58112356A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To put together a variety of pellet mount parts in a minority and allow the manufacture by punching, by having a lead, which is projected out of the part of non-recess of the semiconductor mount support at the center, and is at the same level as the other lead. CONSTITUTION:From the part of non-recess of the pellet mount support 2, the lead 6 to be connected by a pellet electrode and a bonding wire is projected out so as to be bonded at the same level as the other lead 3. Since the lead 6 projected from the pellet mount support 2 is at the same level as the other lead 3, the short between the bonding wire 5 and a pellet, and the short between the bonding wire and the pellet mount part are eliminated. Thereby, even extremely a small pellet which causes short (as compared with at the pellet part) can be mounted without short circuitting.

Description

【発明の詳細な説明】 本発明は半導体集積回路（ｒｃ）装置に用いるリードフ
レームに係り１％にワイヤボンディング後に高信頼なリ
ードフレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead frame used in a semiconductor integrated circuit (RC) device, and relates to a highly reliable lead frame after wire bonding.

ＩＣ装置を作るには、例えば第１図のように複数のリー
ドを一体に形成してなるリードフレームを使用し、この
リードフレームの各半導体素子（ペレット）載置部（タ
ブ）２にペレット４を接続し、次いで各ペレットの電極
とインナーリード３とをワイヤ５によりボンディングし
、その後ペレット及びワイヤボンディング部を包囲する
ように樹脂封止するのである。To make an IC device, for example, as shown in FIG. 1, a lead frame formed by integrally forming a plurality of leads is used, and a pellet 4 is placed on each semiconductor element (pellet) mounting portion (tab) 2 of this lead frame. Then, the electrodes of each pellet and the inner lead 3 are bonded with the wire 5, and then the pellet and the wire bonding part are sealed with resin so as to surround them.

本来、このペレットの電極とインナーリードのボンディ
ング位置は、同じ高さにあるのが望ましいＯ しかし、第１図のリードフレームにペレットを載せると
、第２図のようにペレット４の電極の方がインナーリー
ドよシもベレット分だけ高くなってしまい、ボンディン
グワイヤとペレットのシ冒−ト、ボンディングワイヤと
ベレット載置部のシ璽−トなどが起ζ夛易くなってしま
う。Originally, it is desirable that the bonding positions of the electrode of this pellet and the inner lead be at the same height. The height of the inner lead is also increased by the length of the pellet, making it easier for the bonding wire and the pellet to collide, and for the bonding wire and the pellet mounting portion to collide.

そこで、ペレット載置部が第３図および第４図に示すよ
うに凹部とし九リードフレーム２′を使用すれば、この
問題はなくなるのである。Therefore, if the pellet mounting portion is a recessed portion as shown in FIGS. 3 and 4 and a nine-lead frame 2' is used, this problem will be eliminated.

しかしこのままでは、ペレット載置支持部のボンゲイン
グするところも凹部となってしまい、前述の第２図の場
合と同様になシ、使用できないという問題が存在する。However, if this continues as it is, the portion of the pellet placement support section where the pellets are bonded will also become a recessed portion, which poses the problem that it cannot be used as in the case of FIG. 2 described above.

本発明の目的は、かかる従来の欠点のない実装性の優れ
たリードフレームを提供することにある。An object of the present invention is to provide a lead frame with excellent mounting performance and without such conventional drawbacks.

本発明による集積回路リードフレームは、複数のリード
を一体に形成してなるリードフレームにおいて、中央の
半導体素子載置部及び載置部支持部の一部が凹部であシ
、且つその載置部支持部（凹部でない部分）よ〕出てい
てしかも他のリードと同等の高さにあるリードを有する
ことを特徴とする。An integrated circuit lead frame according to the present invention is a lead frame formed by integrally forming a plurality of leads, in which a central semiconductor element mounting part and a part of the mounting part support part are recessed parts, and the mounting part It is characterized by having a lead that protrudes from the supporting part (a part that is not a recessed part) and is at the same height as the other leads.

次に本発明の一実施例を、第５図および第６図を参照し
て説明する。Next, one embodiment of the present invention will be described with reference to FIGS. 5 and 6.

仁の実施例は、ベレッ′ト装置部支持部２の凹部となっ
ていない部分よ如、ペレット電極とボンディングワイヤ
によ）持続する為のリード６を出して、他のリード３と
同じ高さの所にポンディングできるようにしたものであ
る。In this embodiment, a lead 6 for sustaining (the pellet electrode and bonding wire) is brought out from the part of the pellet device support part 2 that is not recessed, and is placed at the same height as the other leads 3. It is designed so that it can be pounded at the location.

本発明実施例によれば、ペレット載置部支持部２から出
たリード６も他のリード３と同じ高さになる為、ボンデ
ィングワイヤ５とペレットのシ曹−ト、ボ／ディングワ
イヤとペレット載置部のシ冒−トもなくなるのである。According to the embodiment of the present invention, since the lead 6 coming out from the pellet placement part support part 2 is also at the same height as the other leads 3, the bonding wire 5 and the pellet sheet, the bonding wire and the pellet This also eliminates the need to damage the tray.

これによシ、前述のシ■−トを起こすような（ペレット
部分に比べ）極端に小さなペレットでも、シ璽−トさせ
ることなく載せることができる。As a result, even extremely small pellets (compared to the pellet portion) that would raise the sheet mentioned above can be placed without causing the sheet to become erect.

これにより、従来のタイプのリードフレームにあっては
、多種類のペレット載置部が必要だったものを少数にま
とめることができるので、多種少量生産の為に金属の化
学的腐食による製造方法によシ製作していたものを、打
抜きによシ製作することができ大幅な経費節減となる。As a result, the conventional type of lead frame, which required multiple types of pellet placement parts, can be reduced to a small number of parts, making it possible to reduce the number of pellets placed in a small number of lead frames. Items that were previously manufactured can now be manufactured by punching, resulting in significant cost savings.

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図はそれぞれ従来のリードフレームを
示す平面図及び側面図、第３図および第４図はそれぞれ
従来のペレット載置部が凹部となっているリードフレー
ムを示す平面図と側面図、第５図および第６図はそれぞ
れ本発明の一実施例によるリードフレームを示す平面図
及び側面図であるＯ なお図において、１・・・・・・リードフレームの外枠
。 ２・・・・・・ペレット載置部、３・・・・・・インナ
ーリード、４・・・・・・ペレット、５・・・・・・ボ
ンディングワイヤ、６第　１　図　　　　　　　策　２
（Ｉ２１躬３図　　　第４図 ／Figures 1 and 2 are a plan view and a side view, respectively, of a conventional lead frame, and Figures 3 and 4 are a plan view and a side view, respectively, of a conventional lead frame in which the pellet placement part is a recess. 5 and 6 are a plan view and a side view, respectively, showing a lead frame according to an embodiment of the present invention. In the figures, 1... Outer frame of the lead frame. 2... Pellet placement part, 3... Inner lead, 4... Pellet, 5... Bonding wire, 6 Figure 1 Measure 2
(Fig. 4/

Claims (1)

【特許請求の範囲】[Claims] 複数のリードが枠に一体に形成され、該枠に半導体素子
載置部が支持部を介して設けられ、該半導体素子載置部
の位置する面が前記複数のリードの位置する面よＪ）４
低位置に設けられ九リードフレームにおいて、前記支持
部に接続し九リードが設けられ、該支持部に接続したリ
ードは前記複数のリードの位置する面と同一面に位置す
ることを特徴とするリードフレーム。A plurality of leads are integrally formed on a frame, a semiconductor element mounting part is provided on the frame via a support part, and the surface on which the semiconductor element mounting part is located is the same as the surface on which the plurality of leads are located. 4
A nine-lead frame provided at a low position, in which nine leads are provided connected to the support part, and the leads connected to the support part are located on the same surface as the surface on which the plurality of leads are located. flame.
JP57215076A 1982-12-08 1982-12-08 Lead frame Pending JPS58112356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57215076A JPS58112356A (en) 1982-12-08 1982-12-08 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57215076A JPS58112356A (en) 1982-12-08 1982-12-08 Lead frame

Publications (1)

Publication Number Publication Date
JPS58112356A true JPS58112356A (en) 1983-07-04

Family

ID=16666350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57215076A Pending JPS58112356A (en) 1982-12-08 1982-12-08 Lead frame

Country Status (1)

Country Link
JP (1) JPS58112356A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108141A (en) * 1984-11-01 1986-05-26 Mitsubishi Electric Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108141A (en) * 1984-11-01 1986-05-26 Mitsubishi Electric Corp Semiconductor device

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