JPH04147661A - Lead frame for semiconductor integrated circuit device - Google Patents

Lead frame for semiconductor integrated circuit device

Info

Publication number
JPH04147661A
JPH04147661A JP2272753A JP27275390A JPH04147661A JP H04147661 A JPH04147661 A JP H04147661A JP 2272753 A JP2272753 A JP 2272753A JP 27275390 A JP27275390 A JP 27275390A JP H04147661 A JPH04147661 A JP H04147661A
Authority
JP
Japan
Prior art keywords
bonding wire
integrated circuit
island
chip
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2272753A
Other languages
Japanese (ja)
Inventor
Koichi Tanabe
Original Assignee
Nec Ic Microcomput Syst Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Ic Microcomput Syst Ltd filed Critical Nec Ic Microcomput Syst Ltd
Priority to JP2272753A priority Critical patent/JPH04147661A/en
Publication of JPH04147661A publication Critical patent/JPH04147661A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4899Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H01L2224/48996Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/48998Alignment aids
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Abstract

PURPOSE: To prevent a bonding wire from drooping to touch an island and a chip by upwardly bending a tip part of the package inside of at least one lead of a plurality of leads.
CONSTITUTION: A chip 2 is mounted on an island 1 and connected to a lead 3 by a bonding wire 4. In this case, the size of the chip 2 is relatively small to that of the island 1 so that drooping of the bonding wire 4 big, however, a tip part of the lead 3 is upwardly bend so that the tip part holds the bonding wire 4 so as to reduce drooping of the bonding wire 4 while preventing the bonding wire 4 to touch the chip 2 and the island 1.
COPYRIGHT: (C)1992,JPO&Japio
JP2272753A 1990-10-11 1990-10-11 Lead frame for semiconductor integrated circuit device Pending JPH04147661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2272753A JPH04147661A (en) 1990-10-11 1990-10-11 Lead frame for semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2272753A JPH04147661A (en) 1990-10-11 1990-10-11 Lead frame for semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPH04147661A true JPH04147661A (en) 1992-05-21

Family

ID=17518275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2272753A Pending JPH04147661A (en) 1990-10-11 1990-10-11 Lead frame for semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPH04147661A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6372625B1 (en) * 1997-08-26 2002-04-16 Sanyo Electric Co., Ltd. Semiconductor device having bonding wire spaced from semiconductor chip
JP2017059775A (en) * 2015-09-18 2017-03-23 エスアイアイ・セミコンダクタ株式会社 Semiconductor device, lead frame and manufacturing method of the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122251A (en) * 1985-11-22 1987-06-03 Hitachi Ltd Electronic device
JPH01102950A (en) * 1987-10-16 1989-04-20 Dainippon Printing Co Ltd Lead frame
JPH02139955A (en) * 1988-11-21 1990-05-29 Mitsubishi Electric Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122251A (en) * 1985-11-22 1987-06-03 Hitachi Ltd Electronic device
JPH01102950A (en) * 1987-10-16 1989-04-20 Dainippon Printing Co Ltd Lead frame
JPH02139955A (en) * 1988-11-21 1990-05-29 Mitsubishi Electric Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6372625B1 (en) * 1997-08-26 2002-04-16 Sanyo Electric Co., Ltd. Semiconductor device having bonding wire spaced from semiconductor chip
JP2017059775A (en) * 2015-09-18 2017-03-23 エスアイアイ・セミコンダクタ株式会社 Semiconductor device, lead frame and manufacturing method of the same

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