JPS58112348A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58112348A
JPS58112348A JP56211715A JP21171581A JPS58112348A JP S58112348 A JPS58112348 A JP S58112348A JP 56211715 A JP56211715 A JP 56211715A JP 21171581 A JP21171581 A JP 21171581A JP S58112348 A JPS58112348 A JP S58112348A
Authority
JP
Japan
Prior art keywords
chip
external conductive
semiconductor
terminal
conductive terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56211715A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0445981B2 (cg-RX-API-DMAC10.html
Inventor
Nobuhiko Mizuo
水尾　允彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56211715A priority Critical patent/JPS58112348A/ja
Publication of JPS58112348A publication Critical patent/JPS58112348A/ja
Publication of JPH0445981B2 publication Critical patent/JPH0445981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H10W70/60—
    • H10W70/682—
    • H10W72/801—
    • H10W72/884—
    • H10W90/722—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP56211715A 1981-12-25 1981-12-25 半導体装置 Granted JPS58112348A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56211715A JPS58112348A (ja) 1981-12-25 1981-12-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56211715A JPS58112348A (ja) 1981-12-25 1981-12-25 半導体装置

Publications (2)

Publication Number Publication Date
JPS58112348A true JPS58112348A (ja) 1983-07-04
JPH0445981B2 JPH0445981B2 (cg-RX-API-DMAC10.html) 1992-07-28

Family

ID=16610394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56211715A Granted JPS58112348A (ja) 1981-12-25 1981-12-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS58112348A (cg-RX-API-DMAC10.html)

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943556A (ja) * 1982-09-03 1984-03-10 Matsushita Electric Ind Co Ltd 端面電極形成方法
JPS60181072U (ja) * 1984-05-12 1985-12-02 イビデン株式会社 チツプ搭載用プリント配線基板
US4939568A (en) * 1986-03-20 1990-07-03 Fujitsu Limited Three-dimensional integrated circuit and manufacturing method thereof
US5091762A (en) * 1988-07-05 1992-02-25 Kabushiki Kaisha Toshiba Semiconductor memory device with a 3-dimensional structure
US5369058A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5420751A (en) * 1990-08-01 1995-05-30 Staktek Corporation Ultra high density modular integrated circuit package
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5455740A (en) * 1994-03-07 1995-10-03 Staktek Corporation Bus communication system for stacked high density integrated circuit packages
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5499160A (en) * 1990-08-01 1996-03-12 Staktek Corporation High density integrated circuit module with snap-on rail assemblies
US5541812A (en) * 1995-05-22 1996-07-30 Burns; Carmen D. Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame
US5572065A (en) * 1992-06-26 1996-11-05 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package
US5588205A (en) * 1995-01-24 1996-12-31 Staktek Corporation Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
FR2747510A1 (fr) * 1996-04-15 1997-10-17 Nec Corp Assemblage de dispositifs electroniques
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US6806120B2 (en) 2001-03-27 2004-10-19 Staktek Group, L.P. Contact member stacking system and method
US6914324B2 (en) 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
KR100800140B1 (ko) 2005-06-27 2008-02-01 주식회사 하이닉스반도체 패키지 스택
US7371609B2 (en) 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method

Cited By (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943556A (ja) * 1982-09-03 1984-03-10 Matsushita Electric Ind Co Ltd 端面電極形成方法
JPS60181072U (ja) * 1984-05-12 1985-12-02 イビデン株式会社 チツプ搭載用プリント配線基板
US4939568A (en) * 1986-03-20 1990-07-03 Fujitsu Limited Three-dimensional integrated circuit and manufacturing method thereof
US5091762A (en) * 1988-07-05 1992-02-25 Kabushiki Kaisha Toshiba Semiconductor memory device with a 3-dimensional structure
US5420751A (en) * 1990-08-01 1995-05-30 Staktek Corporation Ultra high density modular integrated circuit package
US6168970B1 (en) 1990-08-01 2001-01-02 Staktek Group L.P. Ultra high density integrated circuit packages
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5550711A (en) * 1990-08-01 1996-08-27 Staktek Corporation Ultra high density integrated circuit packages
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5543664A (en) * 1990-08-01 1996-08-06 Staktek Corporation Ultra high density integrated circuit package
US5561591A (en) * 1990-08-01 1996-10-01 Staktek Corporation Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5499160A (en) * 1990-08-01 1996-03-12 Staktek Corporation High density integrated circuit module with snap-on rail assemblies
US6049123A (en) * 1990-08-01 2000-04-11 Staktek Corporation Ultra high density integrated circuit packages
US5566051A (en) * 1990-08-01 1996-10-15 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5572065A (en) * 1992-06-26 1996-11-05 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5631193A (en) * 1992-12-11 1997-05-20 Staktek Corporation High density lead-on-package fabrication method
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US6919626B2 (en) 1992-12-11 2005-07-19 Staktek Group L.P. High density integrated circuit module
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5978227A (en) * 1993-03-29 1999-11-02 Staktek Corporation Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends
US5369058A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5581121A (en) * 1993-03-29 1996-12-03 Staktek Corporation Warp-resistant ultra-thin integrated circuit package
US5895232A (en) * 1993-03-29 1999-04-20 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US6194247B1 (en) 1993-03-29 2001-02-27 Staktek Group L.P. Warp-resistent ultra-thin integrated circuit package fabrication method
US5828125A (en) * 1993-03-29 1998-10-27 Staktek Corporation Ultra-high density warp-resistant memory module
US5843807A (en) * 1993-03-29 1998-12-01 Staktek Corporation Method of manufacturing an ultra-high density warp-resistant memory module
US5864175A (en) * 1993-03-29 1999-01-26 Staktek Corporation Wrap-resistant ultra-thin integrated circuit package fabrication method
US5455740A (en) * 1994-03-07 1995-10-03 Staktek Corporation Bus communication system for stacked high density integrated circuit packages
US5493476A (en) * 1994-03-07 1996-02-20 Staktek Corporation Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends
US5552963A (en) * 1994-03-07 1996-09-03 Staktek Corporation Bus communication system for stacked high density integrated circuit packages
US5479318A (en) * 1994-03-07 1995-12-26 Staktek Corporation Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends
US5588205A (en) * 1995-01-24 1996-12-31 Staktek Corporation Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
US5541812A (en) * 1995-05-22 1996-07-30 Burns; Carmen D. Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
FR2747510A1 (fr) * 1996-04-15 1997-10-17 Nec Corp Assemblage de dispositifs electroniques
US6190939B1 (en) 1997-03-12 2001-02-20 Staktek Group L.P. Method of manufacturing a warp resistant thermally conductive circuit package
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US7066741B2 (en) 1999-09-24 2006-06-27 Staktek Group L.P. Flexible circuit connector for stacked chip module
US6806120B2 (en) 2001-03-27 2004-10-19 Staktek Group, L.P. Contact member stacking system and method
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US6914324B2 (en) 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7371609B2 (en) 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
KR100800140B1 (ko) 2005-06-27 2008-02-01 주식회사 하이닉스반도체 패키지 스택

Also Published As

Publication number Publication date
JPH0445981B2 (cg-RX-API-DMAC10.html) 1992-07-28

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