JPS58106853A - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS58106853A
JPS58106853A JP56203754A JP20375481A JPS58106853A JP S58106853 A JPS58106853 A JP S58106853A JP 56203754 A JP56203754 A JP 56203754A JP 20375481 A JP20375481 A JP 20375481A JP S58106853 A JPS58106853 A JP S58106853A
Authority
JP
Japan
Prior art keywords
pellet
wires
lead frame
plated film
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56203754A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6366427B2 (cg-RX-API-DMAC10.html
Inventor
Usuke Enomoto
榎本　宇佑
Hisayoshi Chigira
千輝　久良
Kunio Tsushima
津島　邦夫
Haruo Kugimiya
釘宮　晴夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56203754A priority Critical patent/JPS58106853A/ja
Publication of JPS58106853A publication Critical patent/JPS58106853A/ja
Publication of JPS6366427B2 publication Critical patent/JPS6366427B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H10W70/457—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5445—
    • H10W72/5522—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
JP56203754A 1981-12-18 1981-12-18 リ−ドフレ−ム Granted JPS58106853A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56203754A JPS58106853A (ja) 1981-12-18 1981-12-18 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56203754A JPS58106853A (ja) 1981-12-18 1981-12-18 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58106853A true JPS58106853A (ja) 1983-06-25
JPS6366427B2 JPS6366427B2 (cg-RX-API-DMAC10.html) 1988-12-20

Family

ID=16479279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56203754A Granted JPS58106853A (ja) 1981-12-18 1981-12-18 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58106853A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130651U (ja) * 1984-02-13 1985-09-02 凸版印刷株式会社 リ−ドフレ−ム
EP0731505A3 (en) * 1995-03-06 1998-04-15 Motorola, Inc. Semiconductor leadframe structure and method of manufacturing the same
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法
EP3462482A1 (en) * 2017-09-27 2019-04-03 Nexperia B.V. Surface mount semiconductor device and method of manufacture

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5373969A (en) * 1976-12-14 1978-06-30 Toshiba Corp Lead frame for semicinductor
JPS53108757A (en) * 1977-03-04 1978-09-21 Matsushita Electric Ind Co Ltd Coding method
JPS5596662A (en) * 1979-01-17 1980-07-23 Toshiba Corp Electronic component member

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5373969A (en) * 1976-12-14 1978-06-30 Toshiba Corp Lead frame for semicinductor
JPS53108757A (en) * 1977-03-04 1978-09-21 Matsushita Electric Ind Co Ltd Coding method
JPS5596662A (en) * 1979-01-17 1980-07-23 Toshiba Corp Electronic component member

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130651U (ja) * 1984-02-13 1985-09-02 凸版印刷株式会社 リ−ドフレ−ム
EP0731505A3 (en) * 1995-03-06 1998-04-15 Motorola, Inc. Semiconductor leadframe structure and method of manufacturing the same
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法
EP3462482A1 (en) * 2017-09-27 2019-04-03 Nexperia B.V. Surface mount semiconductor device and method of manufacture
US11728179B2 (en) 2017-09-27 2023-08-15 Nexperia B.V. Surface mount semiconductor device and method of manufacture

Also Published As

Publication number Publication date
JPS6366427B2 (cg-RX-API-DMAC10.html) 1988-12-20

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