JPS6366427B2 - - Google Patents

Info

Publication number
JPS6366427B2
JPS6366427B2 JP56203754A JP20375481A JPS6366427B2 JP S6366427 B2 JPS6366427 B2 JP S6366427B2 JP 56203754 A JP56203754 A JP 56203754A JP 20375481 A JP20375481 A JP 20375481A JP S6366427 B2 JPS6366427 B2 JP S6366427B2
Authority
JP
Japan
Prior art keywords
plating film
silver plating
lead frame
leads
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56203754A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58106853A (ja
Inventor
Usuke Enomoto
Hisayoshi Chigira
Kunio Tsushima
Haruo Kugimya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56203754A priority Critical patent/JPS58106853A/ja
Publication of JPS58106853A publication Critical patent/JPS58106853A/ja
Publication of JPS6366427B2 publication Critical patent/JPS6366427B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H10W70/457—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5445—
    • H10W72/5522—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
JP56203754A 1981-12-18 1981-12-18 リ−ドフレ−ム Granted JPS58106853A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56203754A JPS58106853A (ja) 1981-12-18 1981-12-18 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56203754A JPS58106853A (ja) 1981-12-18 1981-12-18 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58106853A JPS58106853A (ja) 1983-06-25
JPS6366427B2 true JPS6366427B2 (cg-RX-API-DMAC10.html) 1988-12-20

Family

ID=16479279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56203754A Granted JPS58106853A (ja) 1981-12-18 1981-12-18 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58106853A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130651U (ja) * 1984-02-13 1985-09-02 凸版印刷株式会社 リ−ドフレ−ム
US5530284A (en) * 1995-03-06 1996-06-25 Motorola, Inc. Semiconductor leadframe structure compatible with differing bond wire materials
JP3685057B2 (ja) * 1999-12-08 2005-08-17 日亜化学工業株式会社 Ｌｅｄランプ及びその製造方法
EP3462482A1 (en) * 2017-09-27 2019-04-03 Nexperia B.V. Surface mount semiconductor device and method of manufacture

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5373969A (en) * 1976-12-14 1978-06-30 Toshiba Corp Lead frame for semicinductor
JPS53108757A (en) * 1977-03-04 1978-09-21 Matsushita Electric Ind Co Ltd Coding method
JPS5596662A (en) * 1979-01-17 1980-07-23 Toshiba Corp Electronic component member

Also Published As

Publication number Publication date
JPS58106853A (ja) 1983-06-25

Similar Documents

Publication Publication Date Title
KR940010546B1 (ko) 반도체장치
KR930004246B1 (ko) 수지밀봉형 반도체장치
JP2000012758A (ja) リードフレームおよびそれを用いた樹脂封止型半導体装置およびその製造方法
JPS60167454A (ja) 半導体装置
JPS6366427B2 (cg-RX-API-DMAC10.html)
JP3427492B2 (ja) 凸型ヒートシンク付き半導体装置及びその凸型ヒートシンクの製造方法
US8125060B2 (en) Electronic component with layered frame
JPS6232622B2 (cg-RX-API-DMAC10.html)
JP2756436B2 (ja) 半導体装置およびその製造方法
JPS62154769A (ja) 半導体装置
JPH0222850A (ja) 半導体装置用のリードフレーム
JPS6035552A (ja) 半導体装置
JP2577879B2 (ja) 半導体装置
JP2771475B2 (ja) 半導体装置
JP2633513B2 (ja) 半導体装置の製造方法
JP3644555B2 (ja) リードフレームおよび半導体装置
JP2577880B2 (ja) 半導体装置
KR100252862B1 (ko) 반도체 패키지 및 그의 제조방법
JP2633514B2 (ja) 半導体装置およびその製造方法
JPS6037754A (ja) フラツトパツケ−ジ
KR940011379B1 (ko) 반도체장치의 제조방법
JPS60119765A (ja) 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム
JP2002016210A (ja) 半導体装置
JPS635253Y2 (cg-RX-API-DMAC10.html)
JPS5988838A (ja) 半導体装置