JPS5810360Y2 - 半導体装置用パツケ−ジ - Google Patents

半導体装置用パツケ−ジ

Info

Publication number
JPS5810360Y2
JPS5810360Y2 JP1976091976U JP9197676U JPS5810360Y2 JP S5810360 Y2 JPS5810360 Y2 JP S5810360Y2 JP 1976091976 U JP1976091976 U JP 1976091976U JP 9197676 U JP9197676 U JP 9197676U JP S5810360 Y2 JPS5810360 Y2 JP S5810360Y2
Authority
JP
Japan
Prior art keywords
lead
ceramic
metal
base block
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976091976U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5310273U (enrdf_load_stackoverflow
Inventor
洋一郎 高山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1976091976U priority Critical patent/JPS5810360Y2/ja
Publication of JPS5310273U publication Critical patent/JPS5310273U/ja
Application granted granted Critical
Publication of JPS5810360Y2 publication Critical patent/JPS5810360Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1976091976U 1976-07-09 1976-07-09 半導体装置用パツケ−ジ Expired JPS5810360Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976091976U JPS5810360Y2 (ja) 1976-07-09 1976-07-09 半導体装置用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976091976U JPS5810360Y2 (ja) 1976-07-09 1976-07-09 半導体装置用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5310273U JPS5310273U (enrdf_load_stackoverflow) 1978-01-27
JPS5810360Y2 true JPS5810360Y2 (ja) 1983-02-25

Family

ID=28702559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976091976U Expired JPS5810360Y2 (ja) 1976-07-09 1976-07-09 半導体装置用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5810360Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59131163U (ja) * 1983-02-23 1984-09-03 日本特殊陶業株式会社 半導体容器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5728951B2 (enrdf_load_stackoverflow) * 1974-11-07 1982-06-19

Also Published As

Publication number Publication date
JPS5310273U (enrdf_load_stackoverflow) 1978-01-27

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