JPS6146975B2 - - Google Patents

Info

Publication number
JPS6146975B2
JPS6146975B2 JP54003250A JP325079A JPS6146975B2 JP S6146975 B2 JPS6146975 B2 JP S6146975B2 JP 54003250 A JP54003250 A JP 54003250A JP 325079 A JP325079 A JP 325079A JP S6146975 B2 JPS6146975 B2 JP S6146975B2
Authority
JP
Japan
Prior art keywords
metal
semiconductor
wall member
integrated circuit
external leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54003250A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5595343A (en
Inventor
Isamu Nagameguri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP325079A priority Critical patent/JPS5595343A/ja
Publication of JPS5595343A publication Critical patent/JPS5595343A/ja
Publication of JPS6146975B2 publication Critical patent/JPS6146975B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP325079A 1979-01-11 1979-01-11 Container for semiconductor Granted JPS5595343A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP325079A JPS5595343A (en) 1979-01-11 1979-01-11 Container for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP325079A JPS5595343A (en) 1979-01-11 1979-01-11 Container for semiconductor

Publications (2)

Publication Number Publication Date
JPS5595343A JPS5595343A (en) 1980-07-19
JPS6146975B2 true JPS6146975B2 (enrdf_load_stackoverflow) 1986-10-16

Family

ID=11552207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP325079A Granted JPS5595343A (en) 1979-01-11 1979-01-11 Container for semiconductor

Country Status (1)

Country Link
JP (1) JPS5595343A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4953001A (en) * 1985-09-27 1990-08-28 Raytheon Company Semiconductor device package and packaging method
JPS62293624A (ja) * 1986-06-13 1987-12-21 Nippon Telegr & Teleph Corp <Ntt> Ｉｃパツケ−ジ
JPH0793392B2 (ja) * 1986-10-25 1995-10-09 新光電気工業株式会社 超高周波素子用パツケ−ジ
JPH0524399U (ja) * 1991-09-02 1993-03-30 コクヨ株式会社 額 縁
JPH0846073A (ja) * 1994-07-28 1996-02-16 Mitsubishi Electric Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5587461A (en) * 1978-12-26 1980-07-02 Fujitsu Ltd Microwave integrated circuit package

Also Published As

Publication number Publication date
JPS5595343A (en) 1980-07-19

Similar Documents

Publication Publication Date Title
US3683241A (en) Radio frequency transistor package
US4172261A (en) Semiconductor device having a highly air-tight package
US3784883A (en) Transistor package
US5602421A (en) Microwave monolithic integrated circuit package with improved RF ports
US3489956A (en) Semiconductor device container
JPH02280502A (ja) Ｖｈｆ集積回路用パッケージ
JPS6146975B2 (enrdf_load_stackoverflow)
JPH07321140A (ja) 半導体装置
JPH0680746B2 (ja) マイクロ波用チツプキヤリヤ
CA1256589A (en) Hermetic high frequency surface mount microelectronic package
US3767979A (en) Microwave hermetic transistor package
JPH05121913A (ja) 高周波素子用パツケージ
JPS5830764B2 (ja) 導波管マウント
JPH05166957A (ja) 高周波素子用パッケージ
JPS5810360Y2 (ja) 半導体装置用パツケ−ジ
JP3126503B2 (ja) 半導体装置
JPS6056298B2 (ja) 半導体装置
JPS6129155B2 (enrdf_load_stackoverflow)
JP2920066B2 (ja) 半導体装置及びその製造方法
JPS623984B2 (enrdf_load_stackoverflow)
JPS584821B2 (ja) マイクロ波集積回路用基板
JPS5999745A (ja) マイクロ波ロ−ノイズ電界効果トランジスタ用容器
JPH07307420A (ja) 半導体装置
JP2746802B2 (ja) 半導体装置
JPS6032977B2 (ja) 半導体外囲器