JPS58103148A - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置

Info

Publication number
JPS58103148A
JPS58103148A JP56202814A JP20281481A JPS58103148A JP S58103148 A JPS58103148 A JP S58103148A JP 56202814 A JP56202814 A JP 56202814A JP 20281481 A JP20281481 A JP 20281481A JP S58103148 A JPS58103148 A JP S58103148A
Authority
JP
Japan
Prior art keywords
arm
capillary
position detector
detects
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56202814A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6410093B2 (enExample
Inventor
Masayoshi Yamaguchi
政義 山口
Toshiro Tsuruta
鶴田　寿郎
Nobushi Suzuki
鈴木　悦四
Sumio Nagashima
永島　純雄
Koichi Chiba
宏一 千葉
Noriyasu Kashima
規安 加島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56202814A priority Critical patent/JPS58103148A/ja
Publication of JPS58103148A publication Critical patent/JPS58103148A/ja
Publication of JPS6410093B2 publication Critical patent/JPS6410093B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
JP56202814A 1981-12-16 1981-12-16 ワイヤボンディング装置 Granted JPS58103148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56202814A JPS58103148A (ja) 1981-12-16 1981-12-16 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56202814A JPS58103148A (ja) 1981-12-16 1981-12-16 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPS58103148A true JPS58103148A (ja) 1983-06-20
JPS6410093B2 JPS6410093B2 (enExample) 1989-02-21

Family

ID=16463638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56202814A Granted JPS58103148A (ja) 1981-12-16 1981-12-16 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JPS58103148A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214441A (ja) * 1985-03-19 1986-09-24 Toshiba Corp ボンデイング装置
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
US5219112A (en) * 1991-05-07 1993-06-15 Kabushiki Kaisha Shinkawa Wire bonding apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214441A (ja) * 1985-03-19 1986-09-24 Toshiba Corp ボンデイング装置
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
US5219112A (en) * 1991-05-07 1993-06-15 Kabushiki Kaisha Shinkawa Wire bonding apparatus

Also Published As

Publication number Publication date
JPS6410093B2 (enExample) 1989-02-21

Similar Documents

Publication Publication Date Title
JPS58103148A (ja) ワイヤボンディング装置
JP3022613B2 (ja) ワイヤボンディング装置
JP2588068B2 (ja) ワイヤボンディング装置及びその方法
JPH0443657A (ja) ワイヤボンディング装置
JPS6243336B2 (enExample)
KR100504036B1 (ko) 본딩장치
JP2003347346A (ja) ボンディング装置
US4610387A (en) Device for bonding wire leads in electronic components
JP4259646B2 (ja) ワイヤボンディング装置
JP2575066B2 (ja) 半導体組立装置
JPH01144642A (ja) ワイヤボンデイング方法
JPS6221234A (ja) ワイヤボンダ
JP3220483B2 (ja) ボンディング装置
JPH0680697B2 (ja) ワイヤボンデイング装置
JPS60138930A (ja) ワイヤボンデイング装置
JPH04363037A (ja) ワイヤボンディング装置
JPH04317342A (ja) ボンデイング装置
JPS61159744A (ja) ワイヤボンデイング装置
JPH0153505B2 (enExample)
JP2536269B2 (ja) ワイヤボンディング装置
JP2785153B2 (ja) 超音波ボンデング装置のキャピラリ位置検出装置
JPH046473A (ja) 加速度測定装置
JP2935296B2 (ja) ワイヤボンディング装置
JPH0379047A (ja) ワイヤボンディング装置
JP2950724B2 (ja) ワイヤボンディング装置および該装置を用いたワークタッチ検出方法