JPS5799768A - Manufacture of complementary type metal oxide semiconductor device - Google Patents
Manufacture of complementary type metal oxide semiconductor deviceInfo
- Publication number
- JPS5799768A JPS5799768A JP55175301A JP17530180A JPS5799768A JP S5799768 A JPS5799768 A JP S5799768A JP 55175301 A JP55175301 A JP 55175301A JP 17530180 A JP17530180 A JP 17530180A JP S5799768 A JPS5799768 A JP S5799768A
- Authority
- JP
- Japan
- Prior art keywords
- drain
- source
- channel
- high temperature
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To prevent the shortening of a channel by treating a source and a drain of a P channel FET at a high temperature so to be proper to the diffusion of B after completing treatment at a high temperature for forming a source and a drain of an N channel FET. CONSTITUTION:A P well 2 is shaped to an N type Si substrate through the diffusion of B, and separated by oxide films 4, a gate oxide film 51 and gate electrodes 61, 62 are formed selectively, and the surface is coated with poly Si 8 to which As is added. The whole is treated at a high temperature in an oxidizing atmosphere, the N<+> source and drain 9, 10 are shaped, and the layer 8 is changed into an As added oxide film. The layer 8 is removed, the electrodes are coated with oxide films 11, a resist mask 12 is formed, B ion injecting layers 131, 132 are shaped selectively, thermally treated and activated, and the P<+> source and drain layers 14, 15 are molded. According to this constitution, the CMOS, which has predetermined threshold voltage and drain dielectric resistance and works at high speed even when each FET is fined, is obtained because the P<+> layers 41, 15 can be formed shallowly and the shortening of the channel of the P channel FET can be inhibited.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55175301A JPS5799768A (en) | 1980-12-12 | 1980-12-12 | Manufacture of complementary type metal oxide semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55175301A JPS5799768A (en) | 1980-12-12 | 1980-12-12 | Manufacture of complementary type metal oxide semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5799768A true JPS5799768A (en) | 1982-06-21 |
Family
ID=15993697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55175301A Pending JPS5799768A (en) | 1980-12-12 | 1980-12-12 | Manufacture of complementary type metal oxide semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5799768A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57167680A (en) * | 1981-04-08 | 1982-10-15 | Matsushita Electric Ind Co Ltd | Manufacture of complementary mis field-effect transistor |
JPS6477956A (en) * | 1987-09-19 | 1989-03-23 | Nec Corp | Manufacture of complementary mos transistor |
-
1980
- 1980-12-12 JP JP55175301A patent/JPS5799768A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57167680A (en) * | 1981-04-08 | 1982-10-15 | Matsushita Electric Ind Co Ltd | Manufacture of complementary mis field-effect transistor |
JPS6477956A (en) * | 1987-09-19 | 1989-03-23 | Nec Corp | Manufacture of complementary mos transistor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS56155572A (en) | Insulated gate field effect type semiconductor device | |
JPS5626467A (en) | Semiconductor device and the manufacturing process | |
JPS5688354A (en) | Semiconductor integrated circuit device | |
JPS5799768A (en) | Manufacture of complementary type metal oxide semiconductor device | |
JPS57192063A (en) | Manufacture of semiconductor device | |
JPS56124270A (en) | Manufacture of semiconductor device | |
JPS5632742A (en) | Manufacture of semiconductor device | |
JPS56162850A (en) | Manufacture of semiconductor device | |
JPS5775460A (en) | Manufacture of semiconductor device | |
JPS5783059A (en) | Manufacture of mos type semiconductor device | |
JPS54117691A (en) | Production of insulating gate-type semiconductor device | |
JPS56103445A (en) | Production of semiconductor device | |
JPS57107066A (en) | Complementary semiconductor device and manufacture thereof | |
JPS57107068A (en) | Complementary mis semiconductor device | |
JPS5529105A (en) | Manufacturing of complementary mos integrated circuit | |
JPS57128957A (en) | Semiconductor integrated circuit device and manufacture thereof | |
JPS56147472A (en) | Read only semiconductor memory | |
JPS5752167A (en) | Insulated gate type field effect transistor and manufacture thereof | |
JPS56161673A (en) | Semiconductor device and manufacture thereof | |
JPS5454576A (en) | Selective oxidation method of semiconductor substrate | |
JPS57106123A (en) | Manufacture of semiconductor device | |
JPS56104470A (en) | Semiconductor device and manufacture thereof | |
JPS57207375A (en) | Manufacture of semiconductor device | |
JPS56131958A (en) | Manufacture of semiconductor device | |
JPS5513951A (en) | Manufacturing method of semiconductor device |