JPS5798529A - Metal plating on polyamide resin - Google Patents

Metal plating on polyamide resin

Info

Publication number
JPS5798529A
JPS5798529A JP17339680A JP17339680A JPS5798529A JP S5798529 A JPS5798529 A JP S5798529A JP 17339680 A JP17339680 A JP 17339680A JP 17339680 A JP17339680 A JP 17339680A JP S5798529 A JPS5798529 A JP S5798529A
Authority
JP
Japan
Prior art keywords
chloride
polyamide resin
molded product
product
iii
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17339680A
Other languages
Japanese (ja)
Inventor
Hitoshi Terakubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Rayon Co Ltd
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Priority to JP17339680A priority Critical patent/JPS5798529A/en
Publication of JPS5798529A publication Critical patent/JPS5798529A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To obtain a metal plated polyamide molded product of excellent adherence and high gloss, by conducting a metal plating on the surface thereof after roughing the surface of a polyamide resin molded product with an aqueous solution of chloride of an element belonging to the group II or III of the periodic table.
CONSTITUTION: A molded product of polyamide resin is preferably first degreased by an organic solvent such as methyl ethy ketone or acetone or a surface active agent. Next, the product is etched with an aqueous solution of chloride of an element belonging to the group II or III of the periodic table. Thereafter the product is washed with water and neutralized preferably with an aqueous sodium hydroxide or ammonia solution to remove the ethcing solution left on the resin surface. Next, a chemical or electric plating may be conducted on the roughed surface. Preferable chloride is zinc chloride, calcium chloride or aluminium chloride, and particularly zinc chloride.
COPYRIGHT: (C)1982,JPO&Japio
JP17339680A 1980-12-09 1980-12-09 Metal plating on polyamide resin Pending JPS5798529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17339680A JPS5798529A (en) 1980-12-09 1980-12-09 Metal plating on polyamide resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17339680A JPS5798529A (en) 1980-12-09 1980-12-09 Metal plating on polyamide resin

Publications (1)

Publication Number Publication Date
JPS5798529A true JPS5798529A (en) 1982-06-18

Family

ID=15959624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17339680A Pending JPS5798529A (en) 1980-12-09 1980-12-09 Metal plating on polyamide resin

Country Status (1)

Country Link
JP (1) JPS5798529A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58225130A (en) * 1982-06-24 1983-12-27 Kizai Kk Etching of polyamide resin item
EP1785507A2 (en) 2005-10-28 2007-05-16 Enthone, Inc. Method for etching non-conductive substrate surfaces
US20110287272A1 (en) * 2008-12-23 2011-11-24 E.I.Du Pont De Nemours And Company Polymer compositions for metal coating, articles made therefrom and process for same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56143224A (en) * 1980-04-09 1981-11-07 Unitika Ltd Pretreatment for electroless plating of polyamide molded article

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56143224A (en) * 1980-04-09 1981-11-07 Unitika Ltd Pretreatment for electroless plating of polyamide molded article

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58225130A (en) * 1982-06-24 1983-12-27 Kizai Kk Etching of polyamide resin item
JPH0210226B2 (en) * 1982-06-24 1990-03-07 Kizai Kk
EP1785507A2 (en) 2005-10-28 2007-05-16 Enthone, Inc. Method for etching non-conductive substrate surfaces
JP2007119919A (en) * 2005-10-28 2007-05-17 Enthone Inc Method for etching non-conductive substrate surface
EP1785507A3 (en) * 2005-10-28 2008-07-09 Enthone, Inc. Method for etching non-conductive substrate surfaces
US7578947B2 (en) 2005-10-28 2009-08-25 Enthone Inc. Method for etching non-conductive substrate surfaces
US20110287272A1 (en) * 2008-12-23 2011-11-24 E.I.Du Pont De Nemours And Company Polymer compositions for metal coating, articles made therefrom and process for same
CN102264810A (en) * 2008-12-23 2011-11-30 纳幕尔杜邦公司 Polymer compositions for metal coating, articles made therefrom and process for same

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