JPS56143224A - Pretreatment for electroless plating of polyamide molded article - Google Patents

Pretreatment for electroless plating of polyamide molded article

Info

Publication number
JPS56143224A
JPS56143224A JP4711380A JP4711380A JPS56143224A JP S56143224 A JPS56143224 A JP S56143224A JP 4711380 A JP4711380 A JP 4711380A JP 4711380 A JP4711380 A JP 4711380A JP S56143224 A JPS56143224 A JP S56143224A
Authority
JP
Japan
Prior art keywords
molded article
polyamide molded
pretreatment
electroless plating
electrolessly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4711380A
Other languages
Japanese (ja)
Inventor
Katsuyuki Toma
Koichiro Nakai
Yasunobu Hashimoto
Eriko Sanada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitika Ltd
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Priority to JP4711380A priority Critical patent/JPS56143224A/en
Publication of JPS56143224A publication Critical patent/JPS56143224A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a metal plated polyamide molded article having excellent adhesion and color tone without losing proper physical properties of polyamides, by preheating a polyamide molded article with di- or triethylene glycol and thereafter plating it electrolessly.
CONSTITUTION: A polyamide molded article is degreased by an ordinary method, dipped into a 20W90wt% solution of ethylene, diethylene or triethylene glycol in water for 5W20min, and subjected to well-known sensitization and activation treatments, and thereafter it is plated electrolessly. Thus a metal plated polyamide molded article is obtained. It is particularly desirable that the sensitization treatment is carried out using an aqueous SnCl2 solution containing ZnCl2 or SnCl4.
COPYRIGHT: (C)1981,JPO&Japio
JP4711380A 1980-04-09 1980-04-09 Pretreatment for electroless plating of polyamide molded article Pending JPS56143224A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4711380A JPS56143224A (en) 1980-04-09 1980-04-09 Pretreatment for electroless plating of polyamide molded article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4711380A JPS56143224A (en) 1980-04-09 1980-04-09 Pretreatment for electroless plating of polyamide molded article

Publications (1)

Publication Number Publication Date
JPS56143224A true JPS56143224A (en) 1981-11-07

Family

ID=12766114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4711380A Pending JPS56143224A (en) 1980-04-09 1980-04-09 Pretreatment for electroless plating of polyamide molded article

Country Status (1)

Country Link
JP (1) JPS56143224A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5798529A (en) * 1980-12-09 1982-06-18 Mitsubishi Rayon Co Ltd Metal plating on polyamide resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5798529A (en) * 1980-12-09 1982-06-18 Mitsubishi Rayon Co Ltd Metal plating on polyamide resin

Similar Documents

Publication Publication Date Title
ES8603532A1 (en) Metal plating of polyamide thermoplastics
SE7907373L (en) PROCEDURE KIT FOR CONTINUOUS ELECTROPHERIC COPPER PREPARATION UNDER THE USE OF A HYPOPHOSPHITE REDUCING AGENT IN THE PRESENT OF COBOLK AND NICKELION AND COMPOSITION FOR EXERCISE OF PROCEDURAL KIT
ES8701853A1 (en) Formaldehyde-free autocatalytic electroless copper plating
GB1401815A (en) Method for producing material for printed circuits
SE8203085L (en) BATH COMPOSITION FOR STREAM-FREE GOLD PLATING
ATE68018T1 (en) PROCESS FOR CHEMICAL TREATMENT OF CERAMIC BODIES WITH SUBSEQUENT METALLIZATION.
CA2023871A1 (en) Electrodeposition of palladium films
JPS56143224A (en) Pretreatment for electroless plating of polyamide molded article
GB1206741A (en) Process for electroplating polyoxymethylene resins
JPS5440236A (en) Plating process
JPS56161432A (en) Preparating method for electroless plating of polyamide molded item
ES8304223A1 (en) Composition and process for electroplating white palladium
JPS57210968A (en) Partially plating method for cloth
JPS6436788A (en) Pretreatment for plating titanium material with noble metal
KR890006849A (en) Manufacturing method of metal fiber body
JPS56163294A (en) Semibright palladium plating bath
JPS56163295A (en) Palladium plating method
DE3872505D1 (en) METHOD FOR PRODUCING PARTIALLY METALLIZED CAST ITEMS.
JPS56108869A (en) Nickel coat forming method
JPS5566932A (en) Metal plating of molded phenolic resin article
Kondo et al. Electroless copper plating solution and process for formation of copper film
Vaccari New Ways to Skimp on Gold
JPS5415433A (en) Method of producing tin electro-plate
Srinivasan et al. Pretreatments for Plating for Nonconductors
JPS558491A (en) Surface treating method of copper product