JPS56143224A - Pretreatment for electroless plating of polyamide molded article - Google Patents
Pretreatment for electroless plating of polyamide molded articleInfo
- Publication number
- JPS56143224A JPS56143224A JP4711380A JP4711380A JPS56143224A JP S56143224 A JPS56143224 A JP S56143224A JP 4711380 A JP4711380 A JP 4711380A JP 4711380 A JP4711380 A JP 4711380A JP S56143224 A JPS56143224 A JP S56143224A
- Authority
- JP
- Japan
- Prior art keywords
- molded article
- polyamide molded
- pretreatment
- electroless plating
- electrolessly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To obtain a metal plated polyamide molded article having excellent adhesion and color tone without losing proper physical properties of polyamides, by preheating a polyamide molded article with di- or triethylene glycol and thereafter plating it electrolessly.
CONSTITUTION: A polyamide molded article is degreased by an ordinary method, dipped into a 20W90wt% solution of ethylene, diethylene or triethylene glycol in water for 5W20min, and subjected to well-known sensitization and activation treatments, and thereafter it is plated electrolessly. Thus a metal plated polyamide molded article is obtained. It is particularly desirable that the sensitization treatment is carried out using an aqueous SnCl2 solution containing ZnCl2 or SnCl4.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4711380A JPS56143224A (en) | 1980-04-09 | 1980-04-09 | Pretreatment for electroless plating of polyamide molded article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4711380A JPS56143224A (en) | 1980-04-09 | 1980-04-09 | Pretreatment for electroless plating of polyamide molded article |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56143224A true JPS56143224A (en) | 1981-11-07 |
Family
ID=12766114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4711380A Pending JPS56143224A (en) | 1980-04-09 | 1980-04-09 | Pretreatment for electroless plating of polyamide molded article |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56143224A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5798529A (en) * | 1980-12-09 | 1982-06-18 | Mitsubishi Rayon Co Ltd | Metal plating on polyamide resin |
-
1980
- 1980-04-09 JP JP4711380A patent/JPS56143224A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5798529A (en) * | 1980-12-09 | 1982-06-18 | Mitsubishi Rayon Co Ltd | Metal plating on polyamide resin |
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