JPS578228A - Etching of polyamide molding - Google Patents
Etching of polyamide moldingInfo
- Publication number
- JPS578228A JPS578228A JP8088880A JP8088880A JPS578228A JP S578228 A JPS578228 A JP S578228A JP 8088880 A JP8088880 A JP 8088880A JP 8088880 A JP8088880 A JP 8088880A JP S578228 A JPS578228 A JP S578228A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- acid
- molding
- etching
- metal films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemically Coating (AREA)
Abstract
PURPOSE: To obtain a molded product having excellent adhesion to metal films, by treating a polyamide molding with a solvent having a dissolving power for polyamides and, then, etching the product with (boro)hydrofluoric acid.
CONSTITUTION: A polyamide molding obtained by molding a polyamide or a composition containing 100pts.wt. polyamide and 10W200pts.wt. inorganic filler, particle size 0.2W20μ, is immersed in a polyamide-dissolving mineral acid, organic acid or organic solvent, e.g., sulfuric acid, formic acid, methanol, at 20W60°C for 1W30min, and etched by immersing it in an aqueous borohydrofluoric acid solution, 10W30wt% concentration, or in hydrofluoric acid at 20W50°C for 5W30min.
EFFECT: It is possible to produce plated polyamide articles having strong adhesion to metal films, a low dispersion in adhesive force and excellent surface luster.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8088880A JPS578228A (en) | 1980-06-17 | 1980-06-17 | Etching of polyamide molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8088880A JPS578228A (en) | 1980-06-17 | 1980-06-17 | Etching of polyamide molding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS578228A true JPS578228A (en) | 1982-01-16 |
JPS6238374B2 JPS6238374B2 (en) | 1987-08-18 |
Family
ID=13730881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8088880A Granted JPS578228A (en) | 1980-06-17 | 1980-06-17 | Etching of polyamide molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS578228A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990007775A1 (en) * | 1989-01-07 | 1990-07-12 | Konica Corporation | Magnetic recording medium having balanced characteristics |
JPH0424270A (en) * | 1990-05-21 | 1992-01-28 | Kanebo Ltd | Continuous cleaning device for cloth |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4843068A (en) * | 1971-09-30 | 1973-06-22 | ||
JPS5092972A (en) * | 1973-12-24 | 1975-07-24 | ||
JPS5565237A (en) * | 1978-11-10 | 1980-05-16 | Ube Ind Ltd | Etching method of polyamide molding |
-
1980
- 1980-06-17 JP JP8088880A patent/JPS578228A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4843068A (en) * | 1971-09-30 | 1973-06-22 | ||
JPS5092972A (en) * | 1973-12-24 | 1975-07-24 | ||
JPS5565237A (en) * | 1978-11-10 | 1980-05-16 | Ube Ind Ltd | Etching method of polyamide molding |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990007775A1 (en) * | 1989-01-07 | 1990-07-12 | Konica Corporation | Magnetic recording medium having balanced characteristics |
JPH0424270A (en) * | 1990-05-21 | 1992-01-28 | Kanebo Ltd | Continuous cleaning device for cloth |
Also Published As
Publication number | Publication date |
---|---|
JPS6238374B2 (en) | 1987-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS578228A (en) | Etching of polyamide molding | |
US3595718A (en) | Dry etching system with inert particles coated with adsorbed acid | |
JPS5698495A (en) | Surface treatment method of magnesium or its alloy | |
US4355078A (en) | Nitrile elastomer surfaces receptive for bonding by epoxy adhesives and method therefor | |
JPS57100139A (en) | Metallizing of polyamide resin | |
JPS5798529A (en) | Metal plating on polyamide resin | |
JPS5579892A (en) | Silver plating method | |
JPS57100140A (en) | Metallizing of polyamide resin | |
JPS56129232A (en) | Metal plating of polyamide resin | |
JPS5798530A (en) | Metal plating on polyamide resin | |
JPS5251498A (en) | Corrosionproof aqueous epoxy resin compsoitons containing tannic acid | |
JPS5734136A (en) | Polyamide resin molding plated with metal and preparation thereof | |
JPS5565237A (en) | Etching method of polyamide molding | |
JPS57100138A (en) | Metallizing of polyamide resin | |
JPS5566932A (en) | Metal plating of molded phenolic resin article | |
JPS5322598A (en) | Aqueous epoxy resin composition using chelate-forming curing agent | |
JPS55154348A (en) | Manufacture of glass plate free from water droplet adheision and non-fogging glass | |
JPS5349026A (en) | Chelate-forming coating composition | |
JPS5481127A (en) | Method of forming chemical plating foundation | |
JPS52108497A (en) | Preparation of polyimide resins | |
JPS5548933A (en) | Forming of mesa groove | |
JPS57158236A (en) | Production of electroless-plated polyamide resin molding | |
JPS5778470A (en) | Preparation of water-soluble resol-type phenol rewin adhesive | |
SU553273A1 (en) | Etching solution for printed circuit boards | |
JPS558490A (en) | Production of artificial patina |