JPS5481127A - Method of forming chemical plating foundation - Google Patents

Method of forming chemical plating foundation

Info

Publication number
JPS5481127A
JPS5481127A JP14881377A JP14881377A JPS5481127A JP S5481127 A JPS5481127 A JP S5481127A JP 14881377 A JP14881377 A JP 14881377A JP 14881377 A JP14881377 A JP 14881377A JP S5481127 A JPS5481127 A JP S5481127A
Authority
JP
Japan
Prior art keywords
base plate
bonding agent
agent layer
weight
etching solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14881377A
Other languages
Japanese (ja)
Inventor
Kunihiro Isori
Hitoshi Tomii
Jiro Kano
Tsutomu Takamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14881377A priority Critical patent/JPS5481127A/en
Publication of JPS5481127A publication Critical patent/JPS5481127A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

PURPOSE: To provide the subject method comprising the steps of providing a bonding agent layer containing a diene synthetic rubber on an insulated base plate, and bringing an oxidation etching solution consisting of silver salts and persulfates into contact with said bonding agent layer, thereby to improve the tightness between the base plate and the circuit layer.
CONSTITUTION: A bonding agent layer containing a diene synthetic rubber such as a butadiene aingle polymer or the like is applied and dried on an insulated base plate such as a plastic plate or the like. On the other hand, at least a member of silver salts such as silver nitrate and the like, and two-valent iron salts and three- valent iron salts such as ferric ammonium sulfate, ferrous ammonium sulfate and the like, is mixed in a quantity of 0.1 to 40 part by weight with 100 part by weight with 100 part by weight of persulfuric acid, thereby to prepare an oxidative etching solution. When this oxidative etching solution is brought into contact with the bonding agent layer coated and formed on the insulated base plate, it is possible to obtain a plating foundation capable of forming a circuit layer excellent in tight adherence strength in chemical plating without carrying out a stratment of chromic sulfuric acid solution.
COPYRIGHT: (C)1979,JPO&Japio
JP14881377A 1977-12-13 1977-12-13 Method of forming chemical plating foundation Pending JPS5481127A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14881377A JPS5481127A (en) 1977-12-13 1977-12-13 Method of forming chemical plating foundation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14881377A JPS5481127A (en) 1977-12-13 1977-12-13 Method of forming chemical plating foundation

Publications (1)

Publication Number Publication Date
JPS5481127A true JPS5481127A (en) 1979-06-28

Family

ID=15461277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14881377A Pending JPS5481127A (en) 1977-12-13 1977-12-13 Method of forming chemical plating foundation

Country Status (1)

Country Link
JP (1) JPS5481127A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6190497A (en) * 1984-10-05 1986-05-08 シエーリング・アクチエンゲゼルシヤフト Roughing of resin layer securely without corrosion and cracking
JP2014528515A (en) * 2011-09-29 2014-10-27 マクダーミッド アキューメン インコーポレーテッド Treatment of plastic surfaces after etching in nitric acid-containing media.
JP2019203168A (en) * 2018-05-23 2019-11-28 奥野製薬工業株式会社 Pretreatment composition for electroless plating, pretreatment method for electroless plating, and electroless plating method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6190497A (en) * 1984-10-05 1986-05-08 シエーリング・アクチエンゲゼルシヤフト Roughing of resin layer securely without corrosion and cracking
JPH0317391B2 (en) * 1984-10-05 1991-03-07 Schering Ag
JP2014528515A (en) * 2011-09-29 2014-10-27 マクダーミッド アキューメン インコーポレーテッド Treatment of plastic surfaces after etching in nitric acid-containing media.
JP2019203168A (en) * 2018-05-23 2019-11-28 奥野製薬工業株式会社 Pretreatment composition for electroless plating, pretreatment method for electroless plating, and electroless plating method

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