JPS5481127A - Method of forming chemical plating foundation - Google Patents
Method of forming chemical plating foundationInfo
- Publication number
- JPS5481127A JPS5481127A JP14881377A JP14881377A JPS5481127A JP S5481127 A JPS5481127 A JP S5481127A JP 14881377 A JP14881377 A JP 14881377A JP 14881377 A JP14881377 A JP 14881377A JP S5481127 A JPS5481127 A JP S5481127A
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- bonding agent
- agent layer
- weight
- etching solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
PURPOSE: To provide the subject method comprising the steps of providing a bonding agent layer containing a diene synthetic rubber on an insulated base plate, and bringing an oxidation etching solution consisting of silver salts and persulfates into contact with said bonding agent layer, thereby to improve the tightness between the base plate and the circuit layer.
CONSTITUTION: A bonding agent layer containing a diene synthetic rubber such as a butadiene aingle polymer or the like is applied and dried on an insulated base plate such as a plastic plate or the like. On the other hand, at least a member of silver salts such as silver nitrate and the like, and two-valent iron salts and three- valent iron salts such as ferric ammonium sulfate, ferrous ammonium sulfate and the like, is mixed in a quantity of 0.1 to 40 part by weight with 100 part by weight with 100 part by weight of persulfuric acid, thereby to prepare an oxidative etching solution. When this oxidative etching solution is brought into contact with the bonding agent layer coated and formed on the insulated base plate, it is possible to obtain a plating foundation capable of forming a circuit layer excellent in tight adherence strength in chemical plating without carrying out a stratment of chromic sulfuric acid solution.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14881377A JPS5481127A (en) | 1977-12-13 | 1977-12-13 | Method of forming chemical plating foundation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14881377A JPS5481127A (en) | 1977-12-13 | 1977-12-13 | Method of forming chemical plating foundation |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5481127A true JPS5481127A (en) | 1979-06-28 |
Family
ID=15461277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14881377A Pending JPS5481127A (en) | 1977-12-13 | 1977-12-13 | Method of forming chemical plating foundation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5481127A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6190497A (en) * | 1984-10-05 | 1986-05-08 | シエーリング・アクチエンゲゼルシヤフト | Roughing of resin layer securely without corrosion and cracking |
JP2014528515A (en) * | 2011-09-29 | 2014-10-27 | マクダーミッド アキューメン インコーポレーテッド | Treatment of plastic surfaces after etching in nitric acid-containing media. |
JP2019203168A (en) * | 2018-05-23 | 2019-11-28 | 奥野製薬工業株式会社 | Pretreatment composition for electroless plating, pretreatment method for electroless plating, and electroless plating method |
-
1977
- 1977-12-13 JP JP14881377A patent/JPS5481127A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6190497A (en) * | 1984-10-05 | 1986-05-08 | シエーリング・アクチエンゲゼルシヤフト | Roughing of resin layer securely without corrosion and cracking |
JPH0317391B2 (en) * | 1984-10-05 | 1991-03-07 | Schering Ag | |
JP2014528515A (en) * | 2011-09-29 | 2014-10-27 | マクダーミッド アキューメン インコーポレーテッド | Treatment of plastic surfaces after etching in nitric acid-containing media. |
JP2019203168A (en) * | 2018-05-23 | 2019-11-28 | 奥野製薬工業株式会社 | Pretreatment composition for electroless plating, pretreatment method for electroless plating, and electroless plating method |
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