JPS57100138A - Metallizing of polyamide resin - Google Patents

Metallizing of polyamide resin

Info

Publication number
JPS57100138A
JPS57100138A JP17675780A JP17675780A JPS57100138A JP S57100138 A JPS57100138 A JP S57100138A JP 17675780 A JP17675780 A JP 17675780A JP 17675780 A JP17675780 A JP 17675780A JP S57100138 A JPS57100138 A JP S57100138A
Authority
JP
Japan
Prior art keywords
aqueous solution
polyamide
stannic chloride
softened
molded article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17675780A
Other languages
Japanese (ja)
Other versions
JPS6340861B2 (en
Inventor
Hitoshi Terakubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Rayon Co Ltd
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Priority to JP17675780A priority Critical patent/JPS57100138A/en
Publication of JPS57100138A publication Critical patent/JPS57100138A/en
Publication of JPS6340861B2 publication Critical patent/JPS6340861B2/ja
Granted legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To enable metallizing having improved adhesivity, by immersing a molded article of polyamide resin in an aqueous solution diluted with an organic solvent for polyamide so that the surface is softened, followed by making the surface of the article rough with an aqueous solution of stannic chloride or a mixed aqueous solution of stannic chloride and an acid.
CONSTITUTION: A molded article of polyamide is immersed in an aqueous solution diluted with an organic solvent for polyamide, e.g., ≤10wt% aqueous solution of a phenolic compound, ethylene glycol, etc. so that the surface is softened, and etched with 5W50wt%, preferably 5W30wt% aqueous solution of stannic chloride or mixed aqueous solution of stannic chloride and an acid. When a polyamide resin blended with 10W50wt% talc, etc. is used as the polyamide, it preferably provides improved adhesivity. The immersion is carried out at 20W 30°C for 10secW10min. After being softened, preferably the molded article is washed with water, immersed in caustic soda to remove phenolic compounds.
COPYRIGHT: (C)1982,JPO&Japio
JP17675780A 1980-12-15 1980-12-15 Metallizing of polyamide resin Granted JPS57100138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17675780A JPS57100138A (en) 1980-12-15 1980-12-15 Metallizing of polyamide resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17675780A JPS57100138A (en) 1980-12-15 1980-12-15 Metallizing of polyamide resin

Publications (2)

Publication Number Publication Date
JPS57100138A true JPS57100138A (en) 1982-06-22
JPS6340861B2 JPS6340861B2 (en) 1988-08-12

Family

ID=16019274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17675780A Granted JPS57100138A (en) 1980-12-15 1980-12-15 Metallizing of polyamide resin

Country Status (1)

Country Link
JP (1) JPS57100138A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56161432A (en) * 1980-05-16 1981-12-11 Unitika Ltd Preparating method for electroless plating of polyamide molded item

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56161432A (en) * 1980-05-16 1981-12-11 Unitika Ltd Preparating method for electroless plating of polyamide molded item

Also Published As

Publication number Publication date
JPS6340861B2 (en) 1988-08-12

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