JPS5785056A - Preparation of metallic substrate - Google Patents
Preparation of metallic substrateInfo
- Publication number
- JPS5785056A JPS5785056A JP16229980A JP16229980A JPS5785056A JP S5785056 A JPS5785056 A JP S5785056A JP 16229980 A JP16229980 A JP 16229980A JP 16229980 A JP16229980 A JP 16229980A JP S5785056 A JPS5785056 A JP S5785056A
- Authority
- JP
- Japan
- Prior art keywords
- metallic
- film
- pinholes
- substrate
- transparent substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To raise yield of a photomask of a metallic substrate, by coating a positive type photoresist film on a transparent substrate coated with a metallic film having pinholes, irradiating the reverse side of the transparent substrate with light, and, after removing the exposed resist film, vapor depositing the second metallic film. CONSTITUTION:To correct a transparent substrate coated with a metallic film having pinholes of the metallic substrate of a photomask or the like for manufacturing integrated circuits, a photoresist film 7 is formed on the whole surface of a metallic pattern 2 having pinholes 3 on the substrate 1. Then, the reverse side is exposed to light 8, the exposed parts 3 of the resist film 7 are removed by development, and the second metallic film 2 is formed by the vapor deposition method or the like. The remaining film 7 and the second metallic film 2 left are removed to obtain the metallic pattern with the pinholes 3 corrected, thus permitting yield of the metallic substrate for a mask or the like to be enhanced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16229980A JPS5785056A (en) | 1980-11-18 | 1980-11-18 | Preparation of metallic substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16229980A JPS5785056A (en) | 1980-11-18 | 1980-11-18 | Preparation of metallic substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5785056A true JPS5785056A (en) | 1982-05-27 |
Family
ID=15751852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16229980A Pending JPS5785056A (en) | 1980-11-18 | 1980-11-18 | Preparation of metallic substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5785056A (en) |
-
1980
- 1980-11-18 JP JP16229980A patent/JPS5785056A/en active Pending
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