JPS5780765A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5780765A
JPS5780765A JP15587980A JP15587980A JPS5780765A JP S5780765 A JPS5780765 A JP S5780765A JP 15587980 A JP15587980 A JP 15587980A JP 15587980 A JP15587980 A JP 15587980A JP S5780765 A JPS5780765 A JP S5780765A
Authority
JP
Japan
Prior art keywords
substrate
junction
protective film
main
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15587980A
Other languages
Japanese (ja)
Inventor
Keizo Tani
Makoto Hideshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15587980A priority Critical patent/JPS5780765A/en
Publication of JPS5780765A publication Critical patent/JPS5780765A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions

Abstract

PURPOSE:To enable always introduction of maximum reverse withstand voltage characteristics in a semiconductor device by forming a P-N junction in a semiconductor substrate, and then etching and removing in advance the surface of the substrate to form a protective film. CONSTITUTION:A P type region is formed on one main surface of an N type substrate 1, a main junction 2 and a guard ring junction 3 are annularly formed, and a protective film 4' of glass member is formed in the range containing the main junction 2 outside the junction 3. A protective film 4'' such as SiO2 is formed in the surface region in which the film 4' of the main junction 2 is not formed. The film 4' is formed by etching and removing the surface of the substrate wider than the range laterally extending under the surface of the substrate in the extension of a depletion layer when the maximum reverse withstand voltage in designing the diode is applied and filling and baking the glass member thereto. In this manner, the surface insulating breakdown by the charge storage in the boundary between the protective film such as SiO2 and the Si substrate can be prevented.
JP15587980A 1980-11-07 1980-11-07 Semiconductor device Pending JPS5780765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15587980A JPS5780765A (en) 1980-11-07 1980-11-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15587980A JPS5780765A (en) 1980-11-07 1980-11-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5780765A true JPS5780765A (en) 1982-05-20

Family

ID=15615496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15587980A Pending JPS5780765A (en) 1980-11-07 1980-11-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5780765A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0526100U (en) * 1991-09-13 1993-04-06 吉村精機株式会社 Clothes wrinkle remover
JP2006222213A (en) * 2005-02-09 2006-08-24 Matsushita Electric Ind Co Ltd Surge protecting semiconductor device and its manufacturing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111287A (en) * 1978-02-21 1979-08-31 Fuji Electric Co Ltd Resin seal planar-structure semiconductor element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111287A (en) * 1978-02-21 1979-08-31 Fuji Electric Co Ltd Resin seal planar-structure semiconductor element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0526100U (en) * 1991-09-13 1993-04-06 吉村精機株式会社 Clothes wrinkle remover
JP2006222213A (en) * 2005-02-09 2006-08-24 Matsushita Electric Ind Co Ltd Surge protecting semiconductor device and its manufacturing method

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