JPS5776849A - Bonding device for semiconductor pellel - Google Patents
Bonding device for semiconductor pellelInfo
- Publication number
- JPS5776849A JPS5776849A JP15320280A JP15320280A JPS5776849A JP S5776849 A JPS5776849 A JP S5776849A JP 15320280 A JP15320280 A JP 15320280A JP 15320280 A JP15320280 A JP 15320280A JP S5776849 A JPS5776849 A JP S5776849A
- Authority
- JP
- Japan
- Prior art keywords
- section
- stages
- nozzle
- adsorbing
- transfer head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To miniaturize the device without increasing the amount of a transfer head moved even when the dimensions of a wafer are enlarged by forming relative difference in stages among a pellet supply section, a positional correcting section and a bonding section. CONSTITUTION:Separate pellet 16 is separated by means of an adsorbing nozzle 22 of the transfer head 21 and a projecting pin 24 mounted to a lower section of an adhesive tape 15 while being opposed to the nozzle, transported to the positional correcting section 12 by means of the adsorbing nozzle 22 and corrected to a predetermined positon by means of a positional correcting pawl 18. The pellets are moved to the bonding section 13 be means of an adsorbing nozzle 23, and bonded at an island prescribed position of a lead frame 19. Here, the relative difference in stages H are formed among the supply section 11, the positional correcting section 12 and the bonding section 13, the adsorbing nozzles 22, 23 of the transfer head 21 are shifted along the difference in stages H, and a diameter of the wafer is enlarged at the supply section while the mutual interference of each section is removed even when the amount of an X-Y table moved is increased. Accordingly, the device can be miniaturized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15320280A JPS5776849A (en) | 1980-10-31 | 1980-10-31 | Bonding device for semiconductor pellel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15320280A JPS5776849A (en) | 1980-10-31 | 1980-10-31 | Bonding device for semiconductor pellel |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5776849A true JPS5776849A (en) | 1982-05-14 |
Family
ID=15557267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15320280A Pending JPS5776849A (en) | 1980-10-31 | 1980-10-31 | Bonding device for semiconductor pellel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5776849A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6184843A (en) * | 1984-10-02 | 1986-04-30 | Matsushita Electric Ind Co Ltd | Die-bonder |
JPS61112336A (en) * | 1984-11-07 | 1986-05-30 | Nec Corp | Die bonder |
JP2002214289A (en) * | 2001-01-17 | 2002-07-31 | Nec Machinery Corp | Leadless semiconductor element pickup device |
-
1980
- 1980-10-31 JP JP15320280A patent/JPS5776849A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6184843A (en) * | 1984-10-02 | 1986-04-30 | Matsushita Electric Ind Co Ltd | Die-bonder |
JPS61112336A (en) * | 1984-11-07 | 1986-05-30 | Nec Corp | Die bonder |
JP2002214289A (en) * | 2001-01-17 | 2002-07-31 | Nec Machinery Corp | Leadless semiconductor element pickup device |
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