JPS5776849A - Bonding device for semiconductor pellel - Google Patents

Bonding device for semiconductor pellel

Info

Publication number
JPS5776849A
JPS5776849A JP15320280A JP15320280A JPS5776849A JP S5776849 A JPS5776849 A JP S5776849A JP 15320280 A JP15320280 A JP 15320280A JP 15320280 A JP15320280 A JP 15320280A JP S5776849 A JPS5776849 A JP S5776849A
Authority
JP
Japan
Prior art keywords
section
stages
nozzle
adsorbing
transfer head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15320280A
Other languages
Japanese (ja)
Inventor
Tatsuo Oketa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15320280A priority Critical patent/JPS5776849A/en
Publication of JPS5776849A publication Critical patent/JPS5776849A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To miniaturize the device without increasing the amount of a transfer head moved even when the dimensions of a wafer are enlarged by forming relative difference in stages among a pellet supply section, a positional correcting section and a bonding section. CONSTITUTION:Separate pellet 16 is separated by means of an adsorbing nozzle 22 of the transfer head 21 and a projecting pin 24 mounted to a lower section of an adhesive tape 15 while being opposed to the nozzle, transported to the positional correcting section 12 by means of the adsorbing nozzle 22 and corrected to a predetermined positon by means of a positional correcting pawl 18. The pellets are moved to the bonding section 13 be means of an adsorbing nozzle 23, and bonded at an island prescribed position of a lead frame 19. Here, the relative difference in stages H are formed among the supply section 11, the positional correcting section 12 and the bonding section 13, the adsorbing nozzles 22, 23 of the transfer head 21 are shifted along the difference in stages H, and a diameter of the wafer is enlarged at the supply section while the mutual interference of each section is removed even when the amount of an X-Y table moved is increased. Accordingly, the device can be miniaturized.
JP15320280A 1980-10-31 1980-10-31 Bonding device for semiconductor pellel Pending JPS5776849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15320280A JPS5776849A (en) 1980-10-31 1980-10-31 Bonding device for semiconductor pellel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15320280A JPS5776849A (en) 1980-10-31 1980-10-31 Bonding device for semiconductor pellel

Publications (1)

Publication Number Publication Date
JPS5776849A true JPS5776849A (en) 1982-05-14

Family

ID=15557267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15320280A Pending JPS5776849A (en) 1980-10-31 1980-10-31 Bonding device for semiconductor pellel

Country Status (1)

Country Link
JP (1) JPS5776849A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184843A (en) * 1984-10-02 1986-04-30 Matsushita Electric Ind Co Ltd Die-bonder
JPS61112336A (en) * 1984-11-07 1986-05-30 Nec Corp Die bonder
JP2002214289A (en) * 2001-01-17 2002-07-31 Nec Machinery Corp Leadless semiconductor element pickup device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184843A (en) * 1984-10-02 1986-04-30 Matsushita Electric Ind Co Ltd Die-bonder
JPS61112336A (en) * 1984-11-07 1986-05-30 Nec Corp Die bonder
JP2002214289A (en) * 2001-01-17 2002-07-31 Nec Machinery Corp Leadless semiconductor element pickup device

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