JPS5760846A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPS5760846A
JPS5760846A JP55136589A JP13658980A JPS5760846A JP S5760846 A JPS5760846 A JP S5760846A JP 55136589 A JP55136589 A JP 55136589A JP 13658980 A JP13658980 A JP 13658980A JP S5760846 A JPS5760846 A JP S5760846A
Authority
JP
Japan
Prior art keywords
layer
insulating
heat
al2o3
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55136589A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6262470B2 (https=
Inventor
Kenji Nagashima
Hiroshi Ohira
Masataka Tanaka
Hiroshi Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55136589A priority Critical patent/JPS5760846A/ja
Publication of JPS5760846A publication Critical patent/JPS5760846A/ja
Publication of JPS6262470B2 publication Critical patent/JPS6262470B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Die Bonding (AREA)
JP55136589A 1980-09-30 1980-09-30 Semiconductor device and its manufacture Granted JPS5760846A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55136589A JPS5760846A (en) 1980-09-30 1980-09-30 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55136589A JPS5760846A (en) 1980-09-30 1980-09-30 Semiconductor device and its manufacture

Publications (2)

Publication Number Publication Date
JPS5760846A true JPS5760846A (en) 1982-04-13
JPS6262470B2 JPS6262470B2 (https=) 1987-12-26

Family

ID=15178812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55136589A Granted JPS5760846A (en) 1980-09-30 1980-09-30 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS5760846A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0754877B2 (ja) * 1985-07-30 1995-06-07 ロ−ベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電気的スイツチング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0754877B2 (ja) * 1985-07-30 1995-06-07 ロ−ベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電気的スイツチング装置

Also Published As

Publication number Publication date
JPS6262470B2 (https=) 1987-12-26

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