JPS5759330A - Silicon structure - Google Patents

Silicon structure

Info

Publication number
JPS5759330A
JPS5759330A JP10716381A JP10716381A JPS5759330A JP S5759330 A JPS5759330 A JP S5759330A JP 10716381 A JP10716381 A JP 10716381A JP 10716381 A JP10716381 A JP 10716381A JP S5759330 A JPS5759330 A JP S5759330A
Authority
JP
Japan
Prior art keywords
silicon structure
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10716381A
Other languages
English (en)
Inventor
Gureshiyunaa Yohan
Kurausu Georugu
Ee Shiyumitsuto Geruharuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5759330A publication Critical patent/JPS5759330A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray
    • Y10S430/168—X-ray exposure process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31707—Next to natural rubber
    • Y10T428/3171—With natural rubber next to second layer of natural rubber

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Beam Exposure (AREA)
JP10716381A 1980-09-19 1981-07-10 Silicon structure Pending JPS5759330A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19800105618 EP0048291B1 (de) 1980-09-19 1980-09-19 Struktur mit einem eine durchgehende Öffnung aufweisenden Siliciumkörper und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
JPS5759330A true JPS5759330A (en) 1982-04-09

Family

ID=8186802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10716381A Pending JPS5759330A (en) 1980-09-19 1981-07-10 Silicon structure

Country Status (4)

Country Link
US (1) US4393127A (ja)
EP (1) EP0048291B1 (ja)
JP (1) JPS5759330A (ja)
DE (1) DE3070833D1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63255918A (ja) * 1987-04-13 1988-10-24 Nissin Electric Co Ltd Ｘ線露光用マスクとその製造方法
JP2012060178A (ja) * 2005-04-20 2012-03-22 Carl Zeiss Smt Gmbh 投影露光系、このような投影露光系の補助により微細構造の構成部材を製造する方法、このような系において使用するために適応させた偏光光学素子

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DE3275447D1 (en) * 1982-07-03 1987-03-19 Ibm Deutschland Process for the formation of grooves having essentially vertical lateral silicium walls by reactive ion etching
JPS6195356A (ja) * 1984-10-16 1986-05-14 Mitsubishi Electric Corp フオトマスクブランク
JPS61116358A (ja) * 1984-11-09 1986-06-03 Mitsubishi Electric Corp フオトマスク材料
JPS61173251A (ja) * 1985-01-28 1986-08-04 Mitsubishi Electric Corp フオトマスクの製造方法
JPS61273546A (ja) * 1985-05-29 1986-12-03 Mitsubishi Electric Corp 金属シリサイドフオトマスクの製造方法
US4708919A (en) * 1985-08-02 1987-11-24 Micronix Corporation Process for manufacturing a mask for use in X-ray photolithography using a monolithic support and resulting structure
EP0244246A3 (en) * 1986-05-02 1990-03-21 Hampshire Instruments, Inc A method of making a dimensionally stable x-ray mask
EP0244496B1 (de) * 1986-05-06 1991-01-16 Ibm Deutschland Gmbh Maske für die Ionen-, Elektronen- oder Röntgenstrahllithographie und Verfahren zur ihrer Herstellung
US4862490A (en) * 1986-10-23 1989-08-29 Hewlett-Packard Company Vacuum windows for soft x-ray machines
US4870648A (en) * 1987-08-07 1989-09-26 The United States Department Of Energy X-ray beamsplitter
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
EP0344513A3 (de) * 1988-05-31 1991-01-16 Siemens Aktiengesellschaft Verfahren zur Herstellung einer Steuerplatte für ein Lithographiegerät
US4933557A (en) * 1988-06-06 1990-06-12 Brigham Young University Radiation detector window structure and method of manufacturing thereof
JPH02199099A (ja) * 1988-10-21 1990-08-07 Crystallume 連続ダイヤモンド薄膜およびその製法
US5020083A (en) * 1989-04-21 1991-05-28 Lepton Inc. X-ray masks, their fabrication and use
US5273829A (en) * 1991-10-08 1993-12-28 International Business Machines Corporation Epitaxial silicon membranes
US5231654A (en) * 1991-12-06 1993-07-27 General Electric Company Radiation imager collimator
US6714625B1 (en) 1992-04-08 2004-03-30 Elm Technology Corporation Lithography device for semiconductor circuit pattern generation
JPH0677115A (ja) * 1992-06-25 1994-03-18 Seiko Epson Corp フォトマスクおよび半導体装置の製造方法
JP2766174B2 (ja) * 1993-12-28 1998-06-18 日本電気株式会社 電界放出冷陰極とこれを用いた電子管
JP2606127B2 (ja) * 1994-04-22 1997-04-30 日本電気株式会社 電子線による描画方法および描画装置
US5915167A (en) 1997-04-04 1999-06-22 Elm Technology Corporation Three dimensional structure memory
US6551857B2 (en) 1997-04-04 2003-04-22 Elm Technology Corporation Three dimensional structure integrated circuits
US6355381B1 (en) 1998-09-25 2002-03-12 Intel Corporation Method to fabricate extreme ultraviolet lithography masks
US6157703A (en) * 1998-10-06 2000-12-05 Cardiac Mariners, Inc. Beam hardening filter for x-ray source
US6118854A (en) * 1998-10-06 2000-09-12 Cardiac Mariners, Inc. Method of making x-ray beam hardening filter and assembly
WO2000021096A1 (en) * 1998-10-06 2000-04-13 Cardiac Mariners, Inc. Beam hardening filter for x-ray source
US6756158B2 (en) * 2001-06-30 2004-06-29 Intel Corporation Thermal generation of mask pattern
DE10137834A1 (de) * 2001-08-02 2003-02-13 Team Nanotec Gmbh Maske und Maskenherstellungsverfahren
DE10314212B4 (de) 2002-03-29 2010-06-02 Hoya Corp. Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske
WO2004015764A2 (en) 2002-08-08 2004-02-19 Leedy Glenn J Vertical system integration
US6855945B1 (en) * 2003-01-27 2005-02-15 Stephen H. Silder Electrically conductive synthetic diamond apertures for electron and other particulate beam systems
US6859330B2 (en) * 2003-06-04 2005-02-22 Intel Corporation Micromachined pellicle splitters and tunable laser modules incorporating same
DE10339823B4 (de) * 2003-08-25 2005-06-16 Hahn-Meitner-Institut Berlin Gmbh Verwendung eines Fensters in einer Ultrahochvakuum-Kammer
US8486287B2 (en) * 2004-03-19 2013-07-16 The Regents Of The University Of California Methods for fabrication of positional and compositionally controlled nanostructures on substrate
US7709820B2 (en) * 2007-06-01 2010-05-04 Moxtek, Inc. Radiation window with coated silicon support structure
US7737424B2 (en) * 2007-06-01 2010-06-15 Moxtek, Inc. X-ray window with grid structure
US20080296479A1 (en) * 2007-06-01 2008-12-04 Anderson Eric C Polymer X-Ray Window with Diamond Support Structure
WO2009045915A2 (en) 2007-09-28 2009-04-09 Brigham Young University Carbon nanotube assembly
US8498381B2 (en) 2010-10-07 2013-07-30 Moxtek, Inc. Polymer layer on X-ray window
US9305735B2 (en) 2007-09-28 2016-04-05 Brigham Young University Reinforced polymer x-ray window
WO2009085351A2 (en) * 2007-09-28 2009-07-09 Brigham Young University X-ray window with carbon nanotube frame
US8247971B1 (en) 2009-03-19 2012-08-21 Moxtek, Inc. Resistively heated small planar filament
US7983394B2 (en) 2009-12-17 2011-07-19 Moxtek, Inc. Multiple wavelength X-ray source
US8995621B2 (en) 2010-09-24 2015-03-31 Moxtek, Inc. Compact X-ray source
US8526574B2 (en) 2010-09-24 2013-09-03 Moxtek, Inc. Capacitor AC power coupling across high DC voltage differential
US8804910B1 (en) 2011-01-24 2014-08-12 Moxtek, Inc. Reduced power consumption X-ray source
US8750458B1 (en) 2011-02-17 2014-06-10 Moxtek, Inc. Cold electron number amplifier
US8929515B2 (en) * 2011-02-23 2015-01-06 Moxtek, Inc. Multiple-size support for X-ray window
US8792619B2 (en) 2011-03-30 2014-07-29 Moxtek, Inc. X-ray tube with semiconductor coating
US8989354B2 (en) 2011-05-16 2015-03-24 Brigham Young University Carbon composite support structure
US9076628B2 (en) 2011-05-16 2015-07-07 Brigham Young University Variable radius taper x-ray window support structure
US9174412B2 (en) 2011-05-16 2015-11-03 Brigham Young University High strength carbon fiber composite wafers for microfabrication
US8817950B2 (en) 2011-12-22 2014-08-26 Moxtek, Inc. X-ray tube to power supply connector
US8761344B2 (en) 2011-12-29 2014-06-24 Moxtek, Inc. Small x-ray tube with electron beam control optics
DE102012208710B3 (de) 2012-05-24 2013-09-19 Incoatec Gmbh Verfahren zur Herstellung einer einkristallinen Röntgenblende und Röntgenanalysegerät mit einkristalliner Röntgenblende
US9173623B2 (en) 2013-04-19 2015-11-03 Samuel Soonho Lee X-ray tube and receiver inside mouth
US9152036B2 (en) * 2013-09-23 2015-10-06 National Synchrotron Radiation Research Center X-ray mask structure and method for preparing the same
JP6667215B2 (ja) * 2014-07-24 2020-03-18 キヤノン株式会社 Ｘ線遮蔽格子、構造体、トールボット干渉計、ｘ線遮蔽格子の製造方法

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GB1235077A (en) * 1969-05-07 1971-06-09 Standard Telephones Cables Ltd Improvements in or relating to pressure transducers
US3648131A (en) * 1969-11-07 1972-03-07 Ibm Hourglass-shaped conductive connection through semiconductor structures
US3713922A (en) * 1970-12-28 1973-01-30 Bell Telephone Labor Inc High resolution shadow masks and their preparation
BE794343A (fr) * 1972-01-21 1973-07-19 Westinghouse Electric Corp Methode de protection d'une partie d'un substrat soumis a l'action d'1n faisceau electronique
DE2536718C3 (de) * 1975-08-18 1978-04-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung geätzter Strukturen in Festkörperoberflächen durch Ionenätzung und Bestrahlungsmaske zur Verwendung in diesem Verfahren
US4021276A (en) * 1975-12-29 1977-05-03 Western Electric Company, Inc. Method of making rib-structure shadow mask for ion implantation
DE2604939C3 (de) * 1976-02-09 1978-07-27 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Herstellen von wenigstens einem Durchgangsloch insbesondere einer Düse für Tintenstrahldrucker
US4198263A (en) * 1976-03-30 1980-04-15 Tokyo Shibaura Electric Co., Ltd. Mask for soft X-rays and method of manufacture
JPS5350680A (en) * 1976-10-19 1978-05-09 Nec Corp Transfer mask for x-ray exposure and its production
US4092211A (en) * 1976-11-18 1978-05-30 Northern Telecom Limited Control of etch rate of silicon dioxide in boiling phosphoric acid
IT1109829B (it) * 1977-07-05 1985-12-23 Ibm Processo di fabbricazione di cercuiti integrati
US4269654A (en) * 1977-11-18 1981-05-26 Rca Corporation Silicon nitride and silicon oxide etchant
DE2922416A1 (de) * 1979-06-01 1980-12-11 Ibm Deutschland Schattenwurfmaske zum strukturieren von oberflaechenbereichen und verfahren zu ihrer herstellung
US4324611A (en) * 1980-06-26 1982-04-13 Branson International Plasma Corporation Process and gas mixture for etching silicon dioxide and silicon nitride

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63255918A (ja) * 1987-04-13 1988-10-24 Nissin Electric Co Ltd Ｘ線露光用マスクとその製造方法
JP2012060178A (ja) * 2005-04-20 2012-03-22 Carl Zeiss Smt Gmbh 投影露光系、このような投影露光系の補助により微細構造の構成部材を製造する方法、このような系において使用するために適応させた偏光光学素子

Also Published As

Publication number Publication date
DE3070833D1 (en) 1985-08-08
EP0048291B1 (de) 1985-07-03
US4393127A (en) 1983-07-12
EP0048291A1 (de) 1982-03-31

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