JPS575345A - Isolating and picking up method for pellet - Google Patents
Isolating and picking up method for pelletInfo
- Publication number
- JPS575345A JPS575345A JP7903080A JP7903080A JPS575345A JP S575345 A JPS575345 A JP S575345A JP 7903080 A JP7903080 A JP 7903080A JP 7903080 A JP7903080 A JP 7903080A JP S575345 A JPS575345 A JP S575345A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- block
- pellets
- picking
- pickup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 title abstract 11
- 239000011159 matrix material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7903080A JPS575345A (en) | 1980-06-13 | 1980-06-13 | Isolating and picking up method for pellet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7903080A JPS575345A (en) | 1980-06-13 | 1980-06-13 | Isolating and picking up method for pellet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS575345A true JPS575345A (en) | 1982-01-12 |
| JPS6250977B2 JPS6250977B2 (cg-RX-API-DMAC7.html) | 1987-10-28 |
Family
ID=13678524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7903080A Granted JPS575345A (en) | 1980-06-13 | 1980-06-13 | Isolating and picking up method for pellet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS575345A (cg-RX-API-DMAC7.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125837A (ja) * | 1982-01-22 | 1983-07-27 | Mitsubishi Electric Corp | 自動ダイボンダのペレツト位置決め装置 |
| JPS6387832U (cg-RX-API-DMAC7.html) * | 1986-11-26 | 1988-06-08 | ||
| JP2013026537A (ja) * | 2011-07-25 | 2013-02-04 | Panasonic Corp | チップピックアップ方法およびチップ実装方法ならびにチップ実装装置 |
-
1980
- 1980-06-13 JP JP7903080A patent/JPS575345A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125837A (ja) * | 1982-01-22 | 1983-07-27 | Mitsubishi Electric Corp | 自動ダイボンダのペレツト位置決め装置 |
| JPS6387832U (cg-RX-API-DMAC7.html) * | 1986-11-26 | 1988-06-08 | ||
| JP2013026537A (ja) * | 2011-07-25 | 2013-02-04 | Panasonic Corp | チップピックアップ方法およびチップ実装方法ならびにチップ実装装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6250977B2 (cg-RX-API-DMAC7.html) | 1987-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69128861T2 (de) | Vakuumsbehandlungsvorrichtung und Reinigungsverfahren dafür | |
| US3727284A (en) | Apparatus for selecting and inserting dual in-line components | |
| EP0317136A3 (en) | A method of producing a semiconductor integrated circuit device | |
| JPS575345A (en) | Isolating and picking up method for pellet | |
| JPS5494183A (en) | Automatic assembling and processing method | |
| JPS53104168A (en) | Semiconductor pellet bonding method | |
| JPS5768042A (en) | Pellet pickup method | |
| JPS6490718A (en) | Molding machine provided with working state recording device | |
| JPS51142060A (en) | A method for manufacturing a particle board | |
| JPS57177536A (en) | Vacuum attracting stand and method for vacuum attraction | |
| JPS5421696A (en) | N.c. lathe and processing method making use of the same | |
| JPS6462033A (en) | Automatic equalizer | |
| JPS5727042A (en) | Inspecting method for wafer | |
| JPS553608A (en) | Supplying method for plurality of article | |
| JPH09115930A (ja) | 半導体チップのピックアップ方法 | |
| JPS526093A (en) | Production method of semiconductor device | |
| JPS56120136A (en) | Pellet mounting method | |
| JPS5694637A (en) | Method and device for pellet bonding | |
| JPS57124433A (en) | Patterning data processing for electron beam expossing device | |
| JPS6398782A (ja) | 微小ワ−ク片の認識方法 | |
| JPS642144A (en) | Task scheduling processing system | |
| JPS54148976A (en) | Control method of nc tool machine | |
| JPS5423466A (en) | Manufacture for semiconductor device | |
| JPS5797622A (en) | Diffusion heat treating jig of semiconductor substrate | |
| JPH0329309A (ja) | ウェーハ管理方法 |