JPS5747869A - Vacuum depositing method - Google Patents

Vacuum depositing method

Info

Publication number
JPS5747869A
JPS5747869A JP12179980A JP12179980A JPS5747869A JP S5747869 A JPS5747869 A JP S5747869A JP 12179980 A JP12179980 A JP 12179980A JP 12179980 A JP12179980 A JP 12179980A JP S5747869 A JPS5747869 A JP S5747869A
Authority
JP
Japan
Prior art keywords
crucible
stand
depositing material
copper
packing density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12179980A
Other languages
Japanese (ja)
Inventor
Hitoshi Mikoshiba
Masato Sugiyama
Kimio Kinoshita
Yuji Mitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP12179980A priority Critical patent/JPS5747869A/en
Publication of JPS5747869A publication Critical patent/JPS5747869A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To enable stable vacuum deposition over a long time by making an outer circular channel part holding a depositing material attachable to a rotary part and detachable from it so as to make the packing density of the depositing material in the holding part constant. CONSTITUTION:The bottom of a copper crucible 2 supported on a support stand 1 made of copper is in close contact with the upper surface of the stand 1, and it is cooled with water passing through the internal cavity of the stand 1. The crucible 2 is detached from the stand 1, and the required amount of a depositing material 3 is put in a ringlike channel having 2 concentric circules of the crucible as the edges. After pressing the material to the desired packing density with a press, the crucible 2 is set on the stand 1, and while turning the crucible 2 on its rotary axis O in a vacuum vessel, the part E is heated with electron beams to continuously evaporate the material 3.
JP12179980A 1980-09-04 1980-09-04 Vacuum depositing method Pending JPS5747869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12179980A JPS5747869A (en) 1980-09-04 1980-09-04 Vacuum depositing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12179980A JPS5747869A (en) 1980-09-04 1980-09-04 Vacuum depositing method

Publications (1)

Publication Number Publication Date
JPS5747869A true JPS5747869A (en) 1982-03-18

Family

ID=14820201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12179980A Pending JPS5747869A (en) 1980-09-04 1980-09-04 Vacuum depositing method

Country Status (1)

Country Link
JP (1) JPS5747869A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042764A (en) * 1990-04-18 1992-01-07 Sharp Corp Production of thin-film el element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042764A (en) * 1990-04-18 1992-01-07 Sharp Corp Production of thin-film el element

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