JPS5743427A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5743427A JPS5743427A JP55119963A JP11996380A JPS5743427A JP S5743427 A JPS5743427 A JP S5743427A JP 55119963 A JP55119963 A JP 55119963A JP 11996380 A JP11996380 A JP 11996380A JP S5743427 A JPS5743427 A JP S5743427A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- jig
- phenyl salicylate
- semiconductor device
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 abstract 8
- 229960000969 phenyl salicylate Drugs 0.000 abstract 4
- 238000003754 machining Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55119963A JPS5743427A (en) | 1980-08-28 | 1980-08-28 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55119963A JPS5743427A (en) | 1980-08-28 | 1980-08-28 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5743427A true JPS5743427A (en) | 1982-03-11 |
| JPS6145377B2 JPS6145377B2 (enrdf_load_stackoverflow) | 1986-10-07 |
Family
ID=14774527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55119963A Granted JPS5743427A (en) | 1980-08-28 | 1980-08-28 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5743427A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003060032A1 (fr) * | 2002-01-10 | 2003-07-24 | Api Corporation | Composition adhesive sensible a la pression et a la chaleur |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0178030U (enrdf_load_stackoverflow) * | 1987-11-11 | 1989-05-25 | ||
| JPH0653514U (ja) * | 1992-12-22 | 1994-07-22 | 株式会社アマダ | 製品等収納装置 |
-
1980
- 1980-08-28 JP JP55119963A patent/JPS5743427A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003060032A1 (fr) * | 2002-01-10 | 2003-07-24 | Api Corporation | Composition adhesive sensible a la pression et a la chaleur |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6145377B2 (enrdf_load_stackoverflow) | 1986-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69211074D1 (de) | Verfahren und Apparat zum Kühlen von Mehrchip-Moduln durch die vollständige Wärmerohr-Technologie | |
| JPS5743427A (en) | Manufacture of semiconductor device | |
| ATE32331T1 (de) | Verfahren und vorrichtung zum speisen eines schmelzvorganges durch oberflaechliches abschmelzen. | |
| EP0094302A3 (en) | A method of removing impurities from semiconductor wafers | |
| JPS57146283A (en) | Forming method for hologram sealing material | |
| JPS54133150A (en) | Adhesion method of polarizing film in liquid crystal cell | |
| JPS57143844A (en) | Chip composition of wafer | |
| JPS5745929A (en) | Grinding method for semiconductor wafer | |
| JPS55166935A (en) | Automatic wireless bonding device | |
| JPS57147241A (en) | Bonding method for crystal wafer | |
| JPS5612724A (en) | Method for diffusing impurity into semiconductor substrate | |
| JPS576195A (en) | Manufacturing method of vacuume structure | |
| JPS56133843A (en) | Probe grinder for probe card | |
| JPS5660022A (en) | Processing method and device for semiconductor wafer | |
| JPS56114353A (en) | Method of separating semiconductor wafer and wafer fixing plate | |
| JPS5419624A (en) | Adhering method of adhesive tape | |
| JPS54113253A (en) | Bonding method of semiconductor pellet | |
| JPS6464772A (en) | Tacky sheet for polishing | |
| JPS5519847A (en) | Deviding method of semiconductor wafer | |
| JPS5660025A (en) | Bonding method for semiconductor element | |
| JPS5586135A (en) | Preparation of semiconductor device | |
| JPS5310966A (en) | Semiconductor wafer | |
| JPS5714488A (en) | Ultrasonic depositing method | |
| JPS5638219A (en) | Method and device for adhering tablet | |
| JPS5262589A (en) | Seal-packaging method using ultra-thin film |