JPS5738851A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS5738851A JPS5738851A JP11253880A JP11253880A JPS5738851A JP S5738851 A JPS5738851 A JP S5738851A JP 11253880 A JP11253880 A JP 11253880A JP 11253880 A JP11253880 A JP 11253880A JP S5738851 A JPS5738851 A JP S5738851A
- Authority
- JP
- Japan
- Prior art keywords
- adduct
- compsn
- 30w70wt
- inorg
- bismaleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title 1
- 229920001187 thermosetting polymer Polymers 0.000 title 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 abstract 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 229910052736 halogen Inorganic materials 0.000 abstract 2
- 150000002367 halogens Chemical class 0.000 abstract 2
- 229920003986 novolac Polymers 0.000 abstract 2
- 229920001568 phenolic resin Polymers 0.000 abstract 2
- 239000005011 phenolic resin Substances 0.000 abstract 2
- 229920003192 poly(bis maleimide) Polymers 0.000 abstract 2
- 239000012778 molding material Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 238000003756 stirring Methods 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11253880A JPS5738851A (en) | 1980-08-15 | 1980-08-15 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11253880A JPS5738851A (en) | 1980-08-15 | 1980-08-15 | Thermosetting resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5738851A true JPS5738851A (en) | 1982-03-03 |
| JPS6334899B2 JPS6334899B2 (enrdf_load_stackoverflow) | 1988-07-12 |
Family
ID=14589144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11253880A Granted JPS5738851A (en) | 1980-08-15 | 1980-08-15 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5738851A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011078339A1 (ja) * | 2009-12-25 | 2011-06-30 | 日立化成工業株式会社 | 熱硬化性樹脂組成物、樹脂組成物ワニスの製造方法、プリプレグ及び積層板 |
| JP2011137054A (ja) * | 2009-12-25 | 2011-07-14 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
| CN102558505A (zh) * | 2006-09-29 | 2012-07-11 | 日立化成工业株式会社 | 热固性树脂组合物及用其形成的预浸料及层叠板 |
| US8461332B2 (en) | 2006-06-06 | 2013-06-11 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| US20170022353A1 (en) * | 2007-12-25 | 2017-01-26 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition and prepreg and laminate both made with the same |
-
1980
- 1980-08-15 JP JP11253880A patent/JPS5738851A/ja active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8461332B2 (en) | 2006-06-06 | 2013-06-11 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| US8796473B2 (en) | 2006-06-06 | 2014-08-05 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| CN102558505A (zh) * | 2006-09-29 | 2012-07-11 | 日立化成工业株式会社 | 热固性树脂组合物及用其形成的预浸料及层叠板 |
| KR101398731B1 (ko) * | 2006-09-29 | 2014-05-27 | 히타치가세이가부시끼가이샤 | 열경화성 수지 조성물 및 이것을 이용한 프리프레그 및 적층판 |
| US9603244B2 (en) | 2006-09-29 | 2017-03-21 | Hitachi Chemical Company, Ltd | Thermosetting resin composition and prepreg and laminate obtained with the same |
| US20170022353A1 (en) * | 2007-12-25 | 2017-01-26 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition and prepreg and laminate both made with the same |
| US10604641B2 (en) | 2007-12-25 | 2020-03-31 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition and prepreg and laminate both made with the same |
| WO2011078339A1 (ja) * | 2009-12-25 | 2011-06-30 | 日立化成工業株式会社 | 熱硬化性樹脂組成物、樹脂組成物ワニスの製造方法、プリプレグ及び積層板 |
| JP2011137054A (ja) * | 2009-12-25 | 2011-07-14 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
| CN102656234A (zh) * | 2009-12-25 | 2012-09-05 | 日立化成工业株式会社 | 热固化性树脂组合物、树脂组合物清漆的制造方法、预浸料及层叠板 |
| US10414943B2 (en) | 2009-12-25 | 2019-09-17 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6334899B2 (enrdf_load_stackoverflow) | 1988-07-12 |
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