JPS56136815A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS56136815A
JPS56136815A JP4034480A JP4034480A JPS56136815A JP S56136815 A JPS56136815 A JP S56136815A JP 4034480 A JP4034480 A JP 4034480A JP 4034480 A JP4034480 A JP 4034480A JP S56136815 A JPS56136815 A JP S56136815A
Authority
JP
Japan
Prior art keywords
ingredient
resin composition
epoxy resin
diamine
backbone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4034480A
Other languages
Japanese (ja)
Inventor
Akio Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4034480A priority Critical patent/JPS56136815A/en
Publication of JPS56136815A publication Critical patent/JPS56136815A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: An epoxy resin composition for preparing a cured material having improved heat distortion temperature and mechanical strength, obtained by blending a polyfunctional epoxy compound with a diamine compound having a specific carborane silicone backbone as a curing agent.
CONSTITUTION: (A) A diamine (e.g., diaminodimethylsilane-methcarborane, etc.) having a backbone of a carbosilicone shown by the formula (R is H, methyl, ethyl, lower alkoxy, or phenyl) is blended with (B) a polyfunctional epoxy compound (e.g., glycidyl ether of bisphenol A, etc.), preferably in a ratio of hydrogen atom of NH2 in the ingredient A to epoxy group in the ingredient B of 1:0.8W1.2. If necessary, (C) a phenol aldehydenovolak resin is added to the blend, for example, in a weight ratio of the ingredient B:C of 100:1W50.
EFFECT: Satisfying both shelf stability at normal temperature and quickly curing properties at high temperature.
COPYRIGHT: (C)1981,JPO&Japio
JP4034480A 1980-03-31 1980-03-31 Epoxy resin composition Pending JPS56136815A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4034480A JPS56136815A (en) 1980-03-31 1980-03-31 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4034480A JPS56136815A (en) 1980-03-31 1980-03-31 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS56136815A true JPS56136815A (en) 1981-10-26

Family

ID=12578007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4034480A Pending JPS56136815A (en) 1980-03-31 1980-03-31 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS56136815A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103992463A (en) * 2014-05-17 2014-08-20 北京化工大学 Synthesizing and curing method of carborane epoxy resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103992463A (en) * 2014-05-17 2014-08-20 北京化工大学 Synthesizing and curing method of carborane epoxy resin

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