JPS5737836A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5737836A JPS5737836A JP11418480A JP11418480A JPS5737836A JP S5737836 A JPS5737836 A JP S5737836A JP 11418480 A JP11418480 A JP 11418480A JP 11418480 A JP11418480 A JP 11418480A JP S5737836 A JPS5737836 A JP S5737836A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- resin sheet
- grinding
- attracted
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 239000011347 resin Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 3
- 239000007767 bonding agent Substances 0.000 abstract 2
- 238000011109 contamination Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11418480A JPS5737836A (en) | 1980-08-20 | 1980-08-20 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11418480A JPS5737836A (en) | 1980-08-20 | 1980-08-20 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5737836A true JPS5737836A (en) | 1982-03-02 |
Family
ID=14631294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11418480A Pending JPS5737836A (en) | 1980-08-20 | 1980-08-20 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5737836A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2547764A1 (fr) * | 1983-06-03 | 1984-12-28 | Ates Componenti Elettron | Appareil pour recouvrir d'une pellicule plastique de protection des rondelles de silicium en vue de leur rodage final et pour couper ladite pellicule a ras bord de celles-ci |
WO1985005734A1 (en) * | 1984-05-29 | 1985-12-19 | Mitsui Toatsu Chemicals, Incorporated | Film for machining wafers |
JPS6110242A (ja) * | 1984-05-29 | 1986-01-17 | Mitsui Toatsu Chem Inc | シリコンウエハ加工用フイルム |
JPS61260629A (ja) * | 1985-05-15 | 1986-11-18 | Mitsui Toatsu Chem Inc | ウエハ加工用フイルム |
JPS6258638A (ja) * | 1985-09-07 | 1987-03-14 | Nitto Electric Ind Co Ltd | 半導体ウエハの保護部材 |
-
1980
- 1980-08-20 JP JP11418480A patent/JPS5737836A/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2547764A1 (fr) * | 1983-06-03 | 1984-12-28 | Ates Componenti Elettron | Appareil pour recouvrir d'une pellicule plastique de protection des rondelles de silicium en vue de leur rodage final et pour couper ladite pellicule a ras bord de celles-ci |
WO1985005734A1 (en) * | 1984-05-29 | 1985-12-19 | Mitsui Toatsu Chemicals, Incorporated | Film for machining wafers |
JPS6110242A (ja) * | 1984-05-29 | 1986-01-17 | Mitsui Toatsu Chem Inc | シリコンウエハ加工用フイルム |
EP0185767A1 (en) * | 1984-05-29 | 1986-07-02 | MITSUI TOATSU CHEMICALS, Inc. | Film for machining wafers |
EP0185767A4 (en) * | 1984-05-29 | 1987-09-02 | Mitsui Toatsu Chemicals | FILM FOR TREATING SEMICONDUCTOR WAFFLES. |
JPS61260629A (ja) * | 1985-05-15 | 1986-11-18 | Mitsui Toatsu Chem Inc | ウエハ加工用フイルム |
JPS6258638A (ja) * | 1985-09-07 | 1987-03-14 | Nitto Electric Ind Co Ltd | 半導体ウエハの保護部材 |
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