JPS5737836A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5737836A
JPS5737836A JP11418480A JP11418480A JPS5737836A JP S5737836 A JPS5737836 A JP S5737836A JP 11418480 A JP11418480 A JP 11418480A JP 11418480 A JP11418480 A JP 11418480A JP S5737836 A JPS5737836 A JP S5737836A
Authority
JP
Japan
Prior art keywords
wafer
resin sheet
grinding
attracted
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11418480A
Other languages
English (en)
Inventor
Takumi Matsukura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11418480A priority Critical patent/JPS5737836A/ja
Publication of JPS5737836A publication Critical patent/JPS5737836A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP11418480A 1980-08-20 1980-08-20 Manufacture of semiconductor device Pending JPS5737836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11418480A JPS5737836A (en) 1980-08-20 1980-08-20 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11418480A JPS5737836A (en) 1980-08-20 1980-08-20 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5737836A true JPS5737836A (en) 1982-03-02

Family

ID=14631294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11418480A Pending JPS5737836A (en) 1980-08-20 1980-08-20 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5737836A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2547764A1 (fr) * 1983-06-03 1984-12-28 Ates Componenti Elettron Appareil pour recouvrir d'une pellicule plastique de protection des rondelles de silicium en vue de leur rodage final et pour couper ladite pellicule a ras bord de celles-ci
WO1985005734A1 (en) * 1984-05-29 1985-12-19 Mitsui Toatsu Chemicals, Incorporated Film for machining wafers
JPS6110242A (ja) * 1984-05-29 1986-01-17 Mitsui Toatsu Chem Inc シリコンウエハ加工用フイルム
JPS61260629A (ja) * 1985-05-15 1986-11-18 Mitsui Toatsu Chem Inc ウエハ加工用フイルム
JPS6258638A (ja) * 1985-09-07 1987-03-14 Nitto Electric Ind Co Ltd 半導体ウエハの保護部材

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2547764A1 (fr) * 1983-06-03 1984-12-28 Ates Componenti Elettron Appareil pour recouvrir d'une pellicule plastique de protection des rondelles de silicium en vue de leur rodage final et pour couper ladite pellicule a ras bord de celles-ci
WO1985005734A1 (en) * 1984-05-29 1985-12-19 Mitsui Toatsu Chemicals, Incorporated Film for machining wafers
JPS6110242A (ja) * 1984-05-29 1986-01-17 Mitsui Toatsu Chem Inc シリコンウエハ加工用フイルム
EP0185767A1 (en) * 1984-05-29 1986-07-02 MITSUI TOATSU CHEMICALS, Inc. Film for machining wafers
EP0185767A4 (en) * 1984-05-29 1987-09-02 Mitsui Toatsu Chemicals FILM FOR TREATING SEMICONDUCTOR WAFFLES.
JPS61260629A (ja) * 1985-05-15 1986-11-18 Mitsui Toatsu Chem Inc ウエハ加工用フイルム
JPS6258638A (ja) * 1985-09-07 1987-03-14 Nitto Electric Ind Co Ltd 半導体ウエハの保護部材

Similar Documents

Publication Publication Date Title
JP4860113B2 (ja) 半導体集積回路装置の製造方法
GB1562484A (en) Method and apparatus for lapping or polishing materials
JPS5224393A (en) Processing method and device of automatic controlling machine tool
JPS5737836A (en) Manufacture of semiconductor device
JP2010239161A (ja) 半導体集積回路装置の製造方法
JPS5745929A (en) Grinding method for semiconductor wafer
JPS61158145A (ja) 半導体基板の加工方法
US20030045073A1 (en) Process for lapping wafer and method for processing backside of wafer using the same
JPS52155494A (en) Process for w orking parallel plane of wafer
JPS51111993A (en) Apparatus for fabricating thin work as semiconductor or the like
JPH06204267A (ja) 半導体装置の製造方法
JPS6414007A (en) Deburring method and device therefor
JPS644339B2 (ja)
JPH0314258A (ja) 半導体装置の製造方法
JPS5691439A (en) Method and device for bonding pellet
JPS59101837A (ja) 半導体装置の製造方法
JPS5670635A (en) Rotatable coating method and device therefor
JPH02102559A (ja) 半導体製造装置
JPS5963742A (ja) 半導体素子の製造方法
JPS5840840A (ja) 半導体装置およびその製造方法
JPS63288714A (ja) ダイシング治具
JPH0210852A (ja) 半導体装置の製造方法
JPH06216092A (ja) 半導体装置の製造方法
JPS57147241A (en) Bonding method for crystal wafer
JPS56103425A (en) Improving method for semiconductor substrate